JP2013062499A5 - - Google Patents

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Publication number
JP2013062499A5
JP2013062499A5 JP2012183762A JP2012183762A JP2013062499A5 JP 2013062499 A5 JP2013062499 A5 JP 2013062499A5 JP 2012183762 A JP2012183762 A JP 2012183762A JP 2012183762 A JP2012183762 A JP 2012183762A JP 2013062499 A5 JP2013062499 A5 JP 2013062499A5
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JP
Japan
Prior art keywords
semiconductor substrate
substrate
plasma treatment
insulating layer
forming
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JP2012183762A
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English (en)
Japanese (ja)
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JP2013062499A (ja
JP6059912B2 (ja
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Priority to JP2012183762A priority Critical patent/JP6059912B2/ja
Priority claimed from JP2012183762A external-priority patent/JP6059912B2/ja
Publication of JP2013062499A publication Critical patent/JP2013062499A/ja
Publication of JP2013062499A5 publication Critical patent/JP2013062499A5/ja
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Publication of JP6059912B2 publication Critical patent/JP6059912B2/ja
Expired - Fee Related legal-status Critical Current
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JP2012183762A 2011-08-23 2012-08-23 Ｓｏｉ基板の作製方法 Expired - Fee Related JP6059912B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012183762A JP6059912B2 (ja) 2011-08-23 2012-08-23 Ｓｏｉ基板の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011181744 2011-08-23
JP2011181744 2011-08-23
JP2012183762A JP6059912B2 (ja) 2011-08-23 2012-08-23 Ｓｏｉ基板の作製方法

Publications (3)

Publication Number Publication Date
JP2013062499A JP2013062499A (ja) 2013-04-04
JP2013062499A5 true JP2013062499A5 (enExample) 2015-09-17
JP6059912B2 JP6059912B2 (ja) 2017-01-11

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JP2012183762A Expired - Fee Related JP6059912B2 (ja) 2011-08-23 2012-08-23 Ｓｏｉ基板の作製方法

Country Status (2)

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US (1) US8772130B2 (enExample)
JP (1) JP6059912B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013183001A (ja) 2012-03-01 2013-09-12 Semiconductor Energy Lab Co Ltd 半導体装置
US9721832B2 (en) 2013-03-15 2017-08-01 Kulite Semiconductor Products, Inc. Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding
KR102052075B1 (ko) * 2013-03-28 2020-01-09 삼성디스플레이 주식회사 증착 장치, 이를 이용한 박막 형성 방법, 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
TWI620324B (zh) * 2013-04-12 2018-04-01 半導體能源研究所股份有限公司 半導體裝置
DE102014019794B4 (de) 2013-05-20 2024-10-24 Semiconductor Energy Laboratory Co., Ltd. Halbleitervorrichtung
JP6345544B2 (ja) * 2013-09-05 2018-06-20 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2015060133A1 (en) * 2013-10-22 2015-04-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9455349B2 (en) * 2013-10-22 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor thin film transistor with reduced impurity diffusion
WO2015097596A1 (en) * 2013-12-26 2015-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10361290B2 (en) 2014-03-14 2019-07-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device comprising adding oxygen to buffer film and insulating film
KR20160034200A (ko) * 2014-09-19 2016-03-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
US20160155849A1 (en) 2014-12-02 2016-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, module, and electronic device
US9653613B2 (en) * 2015-02-27 2017-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102792931B1 (ko) 2015-11-20 2025-04-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기
US10020336B2 (en) 2015-12-28 2018-07-10 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device using three dimentional (3D) integration
US9905579B2 (en) * 2016-03-18 2018-02-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
US12349481B2 (en) 2018-09-21 2025-07-01 Semiconductor Energy Laboratory Co., Ltd. Imaging device, manufacturing method thereof, and electronic device
WO2020089762A1 (ja) 2018-11-02 2020-05-07 株式会社半導体エネルギー研究所 半導体装置
WO2021001719A1 (ja) 2019-07-04 2021-01-07 株式会社半導体エネルギー研究所 撮像装置および電子機器
CN114420549B (zh) * 2022-03-31 2022-11-18 深圳新声半导体有限公司 一种二氧化硅表面与硅表面低温键合的方法
WO2024192097A1 (en) 2023-03-14 2024-09-19 Atomera Incorporated Method for making a radio frequency silicon-on-insulator (rfsoi) wafer including a superlattice

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3298974B2 (ja) 1993-03-23 2002-07-08 電子科学株式会社 昇温脱離ガス分析装置
US6027988A (en) * 1997-05-28 2000-02-22 The Regents Of The University Of California Method of separating films from bulk substrates by plasma immersion ion implantation
JP3582566B2 (ja) * 1997-12-22 2004-10-27 三菱住友シリコン株式会社 Ｓｏｉ基板の製造方法
JP2000124092A (ja) 1998-10-16 2000-04-28 Shin Etsu Handotai Co Ltd 水素イオン注入剥離法によってｓｏｉウエーハを製造する方法およびこの方法で製造されたｓｏｉウエーハ
US6995075B1 (en) * 2002-07-12 2006-02-07 Silicon Wafer Technologies Process for forming a fragile layer inside of a single crystalline substrate
JP2005079394A (ja) * 2003-09-01 2005-03-24 Sumitomo Mitsubishi Silicon Corp ダミーウェーハ
JP2005085964A (ja) * 2003-09-08 2005-03-31 Sumitomo Mitsubishi Silicon Corp 貼り合わせ基板の製造方法
JP2005086041A (ja) * 2003-09-09 2005-03-31 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハのイオン注入方法
US20080072926A1 (en) * 2004-09-30 2008-03-27 Shin-Etsu Handotai Co., Ltd. Method for Cleaning Soi Wafer
US8420456B2 (en) 2007-06-12 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing for thin film transistor
US7763502B2 (en) * 2007-06-22 2010-07-27 Semiconductor Energy Laboratory Co., Ltd Semiconductor substrate, method for manufacturing semiconductor substrate, semiconductor device, and electronic device
US8049253B2 (en) 2007-07-11 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8067793B2 (en) 2007-09-27 2011-11-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including storage capacitor with yttrium oxide capacitor dielectric
KR101499175B1 (ko) * 2007-10-04 2015-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기판의 제조방법
US7851318B2 (en) 2007-11-01 2010-12-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device
SG160300A1 (en) 2008-10-03 2010-04-29 Semiconductor Energy Lab Method for manufacturing soi substrate
US8288249B2 (en) 2010-01-26 2012-10-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate

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