JP2013060008A5 - - Google Patents

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Publication number
JP2013060008A5
JP2013060008A5 JP2012184354A JP2012184354A JP2013060008A5 JP 2013060008 A5 JP2013060008 A5 JP 2013060008A5 JP 2012184354 A JP2012184354 A JP 2012184354A JP 2012184354 A JP2012184354 A JP 2012184354A JP 2013060008 A5 JP2013060008 A5 JP 2013060008A5
Authority
JP
Japan
Prior art keywords
press
embossed
conductive pads
piezoelectric elements
flex circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012184354A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013060008A (ja
JP5934058B2 (ja
Filing date
Publication date
Priority claimed from US13/232,465 external-priority patent/US8584331B2/en
Application filed filed Critical
Publication of JP2013060008A publication Critical patent/JP2013060008A/ja
Publication of JP2013060008A5 publication Critical patent/JP2013060008A5/ja
Application granted granted Critical
Publication of JP5934058B2 publication Critical patent/JP5934058B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012184354A 2011-09-14 2012-08-23 電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工 Expired - Fee Related JP5934058B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/232,465 2011-09-14
US13/232,465 US8584331B2 (en) 2011-09-14 2011-09-14 In situ flexible circuit embossing to form an electrical interconnect

Publications (3)

Publication Number Publication Date
JP2013060008A JP2013060008A (ja) 2013-04-04
JP2013060008A5 true JP2013060008A5 (enExample) 2015-10-08
JP5934058B2 JP5934058B2 (ja) 2016-06-15

Family

ID=47828541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012184354A Expired - Fee Related JP5934058B2 (ja) 2011-09-14 2012-08-23 電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工

Country Status (3)

Country Link
US (1) US8584331B2 (enExample)
JP (1) JP5934058B2 (enExample)
CN (1) CN102991136B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8628173B2 (en) * 2010-06-07 2014-01-14 Xerox Corporation Electrical interconnect using embossed contacts on a flex circuit
US9079392B2 (en) * 2013-09-26 2015-07-14 Xerox Corporation Double sided flex for improved bump interconnect
US10038267B2 (en) * 2014-06-12 2018-07-31 Palo Alto Research Center Incorporated Circuit interconnect system and method
US10797421B2 (en) * 2018-05-23 2020-10-06 Xerox Corporation Landing electrical contact
US10813225B2 (en) * 2019-02-15 2020-10-20 Xerox Corporation Radio-frequency identification (RFID) label or conductive trace thermal transfer printing method
US12023934B2 (en) 2020-04-16 2024-07-02 Hewlett-Packard Development Company, L.P. Conductive connections

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05169655A (ja) * 1991-12-26 1993-07-09 Seiko Epson Corp インクジェット記録ヘッド及びその製造方法
US6089701A (en) * 1996-04-10 2000-07-18 Seiko Epson Corporation Ink jet recording head having reduced stress concentration near the boundaries of pressure generating chambers
JPH10112584A (ja) * 1996-10-04 1998-04-28 Seiko Epson Corp 回路基板の接続方法、回路基板の接続構造及びその構造を用いた液晶装置
US6464324B1 (en) * 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
JP4362996B2 (ja) * 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法
JP2003124256A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd フレキシブル基板の実装方法
CN100512604C (zh) * 2002-11-27 2009-07-08 住友电木株式会社 电路板、多层布线板及其制造方法
TWI263403B (en) * 2004-01-22 2006-10-01 Murata Manufacturing Co Electronic component manufacturing method
JP4628067B2 (ja) * 2004-11-12 2011-02-09 株式会社 ハリーズ インターポーザの接合方法、及び電子部品。
JP4661228B2 (ja) * 2005-01-13 2011-03-30 セイコーエプソン株式会社 液滴吐出ヘッド及び液滴吐出装置
JP4497053B2 (ja) * 2005-08-15 2010-07-07 セイコーエプソン株式会社 デバイス実装構造、液体吐出ヘッド、液体吐出装置、電子デバイスおよび電子装置
JP5074789B2 (ja) * 2007-03-06 2012-11-14 住友電気工業株式会社 接続構造体
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
JP2010225732A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 液滴吐出ヘッド、液滴吐出装置

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