JP5934058B2 - 電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工 - Google Patents

電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工 Download PDF

Info

Publication number
JP5934058B2
JP5934058B2 JP2012184354A JP2012184354A JP5934058B2 JP 5934058 B2 JP5934058 B2 JP 5934058B2 JP 2012184354 A JP2012184354 A JP 2012184354A JP 2012184354 A JP2012184354 A JP 2012184354A JP 5934058 B2 JP5934058 B2 JP 5934058B2
Authority
JP
Japan
Prior art keywords
conductive pads
embossed
press
flex circuit
piezoelectric elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012184354A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013060008A (ja
JP2013060008A5 (enExample
Inventor
ブライアン・アール・ドーラン
ピーター・ジェイ・ニストロム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of JP2013060008A publication Critical patent/JP2013060008A/ja
Publication of JP2013060008A5 publication Critical patent/JP2013060008A5/ja
Application granted granted Critical
Publication of JP5934058B2 publication Critical patent/JP5934058B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2012184354A 2011-09-14 2012-08-23 電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工 Expired - Fee Related JP5934058B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/232,465 2011-09-14
US13/232,465 US8584331B2 (en) 2011-09-14 2011-09-14 In situ flexible circuit embossing to form an electrical interconnect

Publications (3)

Publication Number Publication Date
JP2013060008A JP2013060008A (ja) 2013-04-04
JP2013060008A5 JP2013060008A5 (enExample) 2015-10-08
JP5934058B2 true JP5934058B2 (ja) 2016-06-15

Family

ID=47828541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012184354A Expired - Fee Related JP5934058B2 (ja) 2011-09-14 2012-08-23 電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工

Country Status (3)

Country Link
US (1) US8584331B2 (enExample)
JP (1) JP5934058B2 (enExample)
CN (1) CN102991136B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8628173B2 (en) * 2010-06-07 2014-01-14 Xerox Corporation Electrical interconnect using embossed contacts on a flex circuit
US9079392B2 (en) * 2013-09-26 2015-07-14 Xerox Corporation Double sided flex for improved bump interconnect
US10038267B2 (en) * 2014-06-12 2018-07-31 Palo Alto Research Center Incorporated Circuit interconnect system and method
US10797421B2 (en) * 2018-05-23 2020-10-06 Xerox Corporation Landing electrical contact
US10813225B2 (en) * 2019-02-15 2020-10-20 Xerox Corporation Radio-frequency identification (RFID) label or conductive trace thermal transfer printing method
US12023934B2 (en) 2020-04-16 2024-07-02 Hewlett-Packard Development Company, L.P. Conductive connections

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05169655A (ja) * 1991-12-26 1993-07-09 Seiko Epson Corp インクジェット記録ヘッド及びその製造方法
US6089701A (en) * 1996-04-10 2000-07-18 Seiko Epson Corporation Ink jet recording head having reduced stress concentration near the boundaries of pressure generating chambers
JPH10112584A (ja) * 1996-10-04 1998-04-28 Seiko Epson Corp 回路基板の接続方法、回路基板の接続構造及びその構造を用いた液晶装置
US6464324B1 (en) * 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
JP4362996B2 (ja) * 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法
JP2003124256A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd フレキシブル基板の実装方法
CN100512604C (zh) * 2002-11-27 2009-07-08 住友电木株式会社 电路板、多层布线板及其制造方法
TWI263403B (en) * 2004-01-22 2006-10-01 Murata Manufacturing Co Electronic component manufacturing method
JP4628067B2 (ja) * 2004-11-12 2011-02-09 株式会社 ハリーズ インターポーザの接合方法、及び電子部品。
JP4661228B2 (ja) * 2005-01-13 2011-03-30 セイコーエプソン株式会社 液滴吐出ヘッド及び液滴吐出装置
JP4497053B2 (ja) * 2005-08-15 2010-07-07 セイコーエプソン株式会社 デバイス実装構造、液体吐出ヘッド、液体吐出装置、電子デバイスおよび電子装置
JP5074789B2 (ja) * 2007-03-06 2012-11-14 住友電気工業株式会社 接続構造体
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
JP2010225732A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 液滴吐出ヘッド、液滴吐出装置

Also Published As

Publication number Publication date
JP2013060008A (ja) 2013-04-04
CN102991136A (zh) 2013-03-27
US8584331B2 (en) 2013-11-19
US20130061469A1 (en) 2013-03-14
CN102991136B (zh) 2015-08-26

Similar Documents

Publication Publication Date Title
US9381737B2 (en) Method of manufacturing a print head
JP5934058B2 (ja) 電気相互接続を形成するためのｉｎ ｓｉｔｕフレキシブル回路エンボス加工
US20110175971A1 (en) Electrically grounded inkjet ejector and method for making an electrically grounded inkjet ejector
JP5793095B2 (ja) インクジェットプリントヘッドを形成するための方法
US7560852B2 (en) Piezoelectric actuator, method for manufacturing piezoelectric actuator, and liquid transporting apparatus
JP4134773B2 (ja) インクジェットヘッド
US7891093B2 (en) Method for manufacturing an inkjet head
CN103112253B (zh) 用于高密度印刷头的粘合硅结构
JP2009078564A (ja) 記録ヘッドの製造方法及び記録ヘッド
JP2005305847A (ja) 記録ヘッドの製造方法及び記録ヘッド
WO2001042024A1 (en) Ink jet head and printer
CN107303757B (zh) 形成压电驱动器电极的方法
JP4634118B2 (ja) インクジェット装置
JP4899678B2 (ja) 液体移送装置、アクチュエータユニット及び液体移送装置の製造方法
JP4887747B2 (ja) 圧電アクチュエータ、圧電アクチュエータの製造方法、及び、液体移送装置
JPH09300609A (ja) インクジェットヘッド
US20060170737A1 (en) Ink-Jet Head
JP2006116953A (ja) 液体噴射装置及びその製造方法
US7815293B2 (en) Ink-jet head and method of producing the same
JP2006082393A (ja) インクジェット記録ヘッド及びインクジェットプリンタ
JP2013067166A (ja) 密度が制限されたフレックス回路を使用した高密度電気相互接続
JP3656800B2 (ja) インクジェット記録装置及びその製造方法
JP2010012724A (ja) 液滴吐出ヘッド、画像形成装置、及び液滴吐出ヘッドの製造方法
US8205969B2 (en) Jet stack with precision port holes for ink jet printer and associated method
JP2001146013A (ja) インクジェットヘッドとヘッドユニット及びインクジェット記録装置

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20131212

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150821

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150821

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150821

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20150930

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151027

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160209

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160325

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160426

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160506

R150 Certificate of patent or registration of utility model

Ref document number: 5934058

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees