CN102991136B - 形成电气互联的原位柔性电路压凸 - Google Patents

形成电气互联的原位柔性电路压凸 Download PDF

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Publication number
CN102991136B
CN102991136B CN201210328054.1A CN201210328054A CN102991136B CN 102991136 B CN102991136 B CN 102991136B CN 201210328054 A CN201210328054 A CN 201210328054A CN 102991136 B CN102991136 B CN 102991136B
Authority
CN
China
Prior art keywords
piezoelectric element
belling
conductive welding
described multiple
flex circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210328054.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102991136A (zh
Inventor
布莱恩·R·杜兰
彼得·J·奈斯特龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of CN102991136A publication Critical patent/CN102991136A/zh
Application granted granted Critical
Publication of CN102991136B publication Critical patent/CN102991136B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
CN201210328054.1A 2011-09-14 2012-09-06 形成电气互联的原位柔性电路压凸 Expired - Fee Related CN102991136B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/232465 2011-09-14
US13/232,465 US8584331B2 (en) 2011-09-14 2011-09-14 In situ flexible circuit embossing to form an electrical interconnect

Publications (2)

Publication Number Publication Date
CN102991136A CN102991136A (zh) 2013-03-27
CN102991136B true CN102991136B (zh) 2015-08-26

Family

ID=47828541

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210328054.1A Expired - Fee Related CN102991136B (zh) 2011-09-14 2012-09-06 形成电气互联的原位柔性电路压凸

Country Status (3)

Country Link
US (1) US8584331B2 (enExample)
JP (1) JP5934058B2 (enExample)
CN (1) CN102991136B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8628173B2 (en) * 2010-06-07 2014-01-14 Xerox Corporation Electrical interconnect using embossed contacts on a flex circuit
US9079392B2 (en) * 2013-09-26 2015-07-14 Xerox Corporation Double sided flex for improved bump interconnect
US10038267B2 (en) * 2014-06-12 2018-07-31 Palo Alto Research Center Incorporated Circuit interconnect system and method
US10797421B2 (en) * 2018-05-23 2020-10-06 Xerox Corporation Landing electrical contact
US10813225B2 (en) * 2019-02-15 2020-10-20 Xerox Corporation Radio-frequency identification (RFID) label or conductive trace thermal transfer printing method
US12023934B2 (en) 2020-04-16 2024-07-02 Hewlett-Packard Development Company, L.P. Conductive connections

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1364106A (zh) * 2000-01-31 2002-08-14 皮科杰特公司 微观流体器件和超声波焊接过程
CN1714609A (zh) * 2002-11-27 2005-12-28 住友电木株式会社 电路板、多层布线板及其制造方法
CN1883043A (zh) * 2004-01-22 2006-12-20 株式会社村田制作所 制造电子部件的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05169655A (ja) * 1991-12-26 1993-07-09 Seiko Epson Corp インクジェット記録ヘッド及びその製造方法
US6089701A (en) * 1996-04-10 2000-07-18 Seiko Epson Corporation Ink jet recording head having reduced stress concentration near the boundaries of pressure generating chambers
JPH10112584A (ja) * 1996-10-04 1998-04-28 Seiko Epson Corp 回路基板の接続方法、回路基板の接続構造及びその構造を用いた液晶装置
JP4362996B2 (ja) * 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法
JP2003124256A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd フレキシブル基板の実装方法
JP4628067B2 (ja) * 2004-11-12 2011-02-09 株式会社 ハリーズ インターポーザの接合方法、及び電子部品。
JP4661228B2 (ja) * 2005-01-13 2011-03-30 セイコーエプソン株式会社 液滴吐出ヘッド及び液滴吐出装置
JP4497053B2 (ja) * 2005-08-15 2010-07-07 セイコーエプソン株式会社 デバイス実装構造、液体吐出ヘッド、液体吐出装置、電子デバイスおよび電子装置
JP5074789B2 (ja) * 2007-03-06 2012-11-14 住友電気工業株式会社 接続構造体
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
JP2010225732A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 液滴吐出ヘッド、液滴吐出装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1364106A (zh) * 2000-01-31 2002-08-14 皮科杰特公司 微观流体器件和超声波焊接过程
CN1714609A (zh) * 2002-11-27 2005-12-28 住友电木株式会社 电路板、多层布线板及其制造方法
CN1883043A (zh) * 2004-01-22 2006-12-20 株式会社村田制作所 制造电子部件的方法

Also Published As

Publication number Publication date
JP2013060008A (ja) 2013-04-04
CN102991136A (zh) 2013-03-27
JP5934058B2 (ja) 2016-06-15
US8584331B2 (en) 2013-11-19
US20130061469A1 (en) 2013-03-14

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Granted publication date: 20150826

Termination date: 20210906