JP2013012536A - 平面発光モジュール - Google Patents
平面発光モジュール Download PDFInfo
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- JP2013012536A JP2013012536A JP2011143266A JP2011143266A JP2013012536A JP 2013012536 A JP2013012536 A JP 2013012536A JP 2011143266 A JP2011143266 A JP 2011143266A JP 2011143266 A JP2011143266 A JP 2011143266A JP 2013012536 A JP2013012536 A JP 2013012536A
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- light
- transparent resin
- light emitting
- resin layer
- phosphor
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- 229920005989 resin Polymers 0.000 claims abstract description 75
- 239000011347 resin Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 37
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 61
- 239000000463 material Substances 0.000 abstract description 6
- 230000001788 irregular Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 26
- 239000002994 raw material Substances 0.000 description 24
- 229910052788 barium Inorganic materials 0.000 description 10
- 229910052725 zinc Inorganic materials 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 229910052791 calcium Inorganic materials 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 229910052749 magnesium Inorganic materials 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 7
- 150000002367 halogens Chemical class 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- 229910052712 strontium Inorganic materials 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 229910052761 rare earth metal Inorganic materials 0.000 description 5
- 230000000295 complement effect Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003746 solid phase reaction Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- 241001289141 Babr Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 229910017639 MgSi Inorganic materials 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910018380 Mn(NO3)2.6H2 O Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 235000011148 calcium chloride Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- -1 oxide Chemical compound 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000012856 weighed raw material Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
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- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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Abstract
【解決手段】反射膜17が施された基板12上に複数の発光素子18が実装される。第1透明樹脂層24は、発光素子18を封止するように配置される。第2透明樹脂層26は、第1透明樹脂層24との間に空気層25を挟んで配置される。第1および第2透明樹脂層内には、発光素子18からの放射光を波長変換する蛍光体が分散配置されており、第2透明樹脂層26を外部から見たときに擬似白色光が観察されるように、蛍光体が選択される。
【選択図】図1
Description
第1の蛍光体は、紫外または短波長可視光により励起され可視光を発光する蛍光体であり、一般式が(M2 x,M3 y,M4 z)mM1O3X(2/n)(ここで、M1はSi、Ge、Ti、ZrおよびSnからなる群より選ばれる少なくともSiを含む1種以上の元素、M2はCa、Mg、BaおよびZnからなる群より選ばれる少なくともCaを含む1種以上の元素、M3はSr、Mg、BaおよびZnからなる群より選ばれる少なくともSrを含む1種以上の元素、Xは少なくとも1種のハロゲン元素、M4は希土類元素およびMnからなる群より選ばれる少なくともEu2+を含む1種以上の元素を示す。また、mは1≦m≦4/3、nは5≦n≦7の範囲であってもよい。また、x、y、zは、x+y+z=1、0<x<0.99、0<y<0.99、0.01≦z≦0.3を満たす範囲であってもよい。)で表される蛍光体である。また、第1の蛍光体は、560〜600nmの波長域にピーク波長を有する可視光を発光する蛍光体である。
(1)M’1O2(M’1はSi、Ge、Ti、Zr、Sn等の4価の元素を示す。)
(2)M’2O(M’2はMg、Ca、Ba、Zn等の2価の元素を示す。)
(3)M’3X2(M’3はMg、Sr、Ba、Zn等の2価の元素、Xはハロゲン元素を示す。)
(4)M’4(M’4はEu2+等の希土類元素および/またはMnを示す。)
第2の蛍光体は、その発光色が第1の蛍光体の発光色と補色関係である430〜480nmにピーク波長を有する蛍光体である。このような第2の蛍光体は、近紫外または短波長可視光を効率的に吸収し、ドミナント波長が440〜470nmの光を放射する。第2の蛍光体として用いることができる蛍光体として、特に組成の限定はないが、例えば下記の一般式で表される蛍光体(1)〜(4)の中から選択できる。
Claims (4)
- 反射膜が施された平面状の基板と、
前記基板の反射膜側に実装された発光素子と、
少なくとも前記発光素子を封止するように配置された第1透明樹脂層と、
前記第1透明樹脂層との間に空気層を挟んで配置された第2透明樹脂層と、
を備え、
前記第1および第2透明樹脂層内に、前記発光素子からの放射光を波長変換する蛍光体が分散配置されており、前記第2透明樹脂層を外部から見たときに擬似白色光が観察されるように前記蛍光体が選択されることを特徴とする平面発光モジュール。 - 前記第2透明樹脂層を外部から見たときに略均一な輝度の擬似白色光が観察されるように、前記第1および第2透明樹脂層の厚み、第1透明樹脂層と第2透明樹脂層との間に配置された空気層の厚み、ならびに前記蛍光体の濃度が設定されることを特徴とする請求項1に記載の平面発光モジュール。
- 前記発光素子は紫外光または短波長の可視光を放射し、
前記蛍光体は、前記発光素子からの放射光を黄色光に変換する第1蛍光体と、前記発光素子からの放射光を青色光に変換する第2蛍光体と、を含むことを特徴とする請求項1または2に記載の平面発光モジュール。 - 可視光に対して透明または半透明であるカバーをさらに備え、
前記第2透明樹脂層が前記カバーの基板側表面に設けられていることを特徴とする請求項1ないし3のいずれかに記載の平面発光モジュール。
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EP12172729.1A EP2541597B1 (en) | 2011-06-28 | 2012-06-20 | Planar light-emitting module |
US13/530,230 US8669699B2 (en) | 2011-06-28 | 2012-06-22 | Planar light-emitting module |
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JP2015173053A (ja) * | 2014-03-12 | 2015-10-01 | 株式会社モリタ東京製作所 | 照明装置、発光モジュールおよび診療装置 |
JP2016072584A (ja) * | 2014-10-02 | 2016-05-09 | ウシオ電機株式会社 | 発光モジュール |
JP2019184741A (ja) * | 2018-04-05 | 2019-10-24 | 株式会社Reiz | Led複数列式ledテープ |
JP2022545306A (ja) * | 2019-07-29 | 2022-10-27 | ラディアント オプト-エレクトロニクス(ナンキン)カンパニー リミテッド | 調光フィルム、バックライトモジュール及び表示装置 |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004127988A (ja) * | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | 白色発光装置 |
JP2007012792A (ja) * | 2005-06-29 | 2007-01-18 | Kyocera Corp | 発光素子収納用パッケージ、光源および発光装置 |
JP2007180347A (ja) * | 2005-12-28 | 2007-07-12 | Shinko Electric Ind Co Ltd | 発光装置及びその製造方法 |
JP2007266358A (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corp | 発光装置および照明装置 |
JP2008147453A (ja) * | 2006-12-11 | 2008-06-26 | Hitachi Displays Ltd | 照明装置及びこの照明装置を用いた表示装置 |
JP2008159705A (ja) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
JP2010004035A (ja) * | 2008-05-22 | 2010-01-07 | Mitsubishi Chemicals Corp | 半導体発光装置、照明装置、および画像表示装置 |
JP2010056398A (ja) * | 2008-08-29 | 2010-03-11 | Toshiba Corp | 発光デバイス及び発光装置 |
JP2010062305A (ja) * | 2008-09-03 | 2010-03-18 | Hitachi Displays Ltd | 照明装置、及び液晶表示装置 |
JP2010192859A (ja) * | 2009-02-20 | 2010-09-02 | Toshiba Corp | 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
JP3749243B2 (ja) * | 2001-09-03 | 2006-02-22 | 松下電器産業株式会社 | 半導体発光デバイス,発光装置及び半導体発光デバイスの製造方法 |
TW200512949A (en) * | 2003-09-17 | 2005-04-01 | Nanya Plastics Corp | A method to provide emission of white color light by the principle of secondary excitation and its product |
JP5196711B2 (ja) * | 2005-07-26 | 2013-05-15 | 京セラ株式会社 | 発光装置およびそれを用いた照明装置 |
WO2007077869A1 (ja) * | 2006-01-04 | 2007-07-12 | Rohm Co., Ltd. | 薄型発光ダイオードランプとその製造方法 |
US8441179B2 (en) * | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
JP4353196B2 (ja) | 2006-03-10 | 2009-10-28 | パナソニック電工株式会社 | 発光装置 |
JP4632311B2 (ja) | 2006-04-14 | 2011-02-16 | スタンレー電気株式会社 | 照明装置 |
JP2008071806A (ja) * | 2006-09-12 | 2008-03-27 | C I Kasei Co Ltd | 発光装置 |
JP2008159706A (ja) | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
US8344400B2 (en) * | 2007-08-31 | 2013-01-01 | Lg Innotek Co., Ltd. | Light emitting device package |
KR101429704B1 (ko) * | 2008-01-31 | 2014-08-12 | 삼성디스플레이 주식회사 | 파장변환 부재, 이를 포함하는 광원 어셈블리 및 액정 표시장치 |
US20090194774A1 (en) * | 2008-02-04 | 2009-08-06 | Kismart Corporation | Light source module with wavelength converting structure and the method of forming the same |
JPWO2009107535A1 (ja) * | 2008-02-25 | 2011-06-30 | 株式会社東芝 | 白色ledランプ、バックライト、発光装置、表示装置および照明装置 |
JP2010046130A (ja) | 2008-08-19 | 2010-03-04 | Fujifilm Corp | 放射線画像撮影システム、放射線変換器及び撮影台 |
JP2010113139A (ja) | 2008-11-06 | 2010-05-20 | Panasonic Corp | 画像表示装置およびその製造方法 |
WO2010106504A1 (en) * | 2009-03-19 | 2010-09-23 | Koninklijke Philips Electronics N.V. | Illumination device with remote luminescent material |
US20120098017A1 (en) * | 2009-05-15 | 2012-04-26 | Koito Manufacturing Co., Ltd. | Light emitting module, method of producing light-emitting module, and lighting fixture unit |
JP2011181793A (ja) | 2010-03-03 | 2011-09-15 | Koito Mfg Co Ltd | 発光装置 |
JP5468985B2 (ja) | 2010-05-17 | 2014-04-09 | 株式会社小糸製作所 | 照明装置 |
-
2011
- 2011-06-28 JP JP2011143266A patent/JP5863291B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-12 CN CN201210192620.0A patent/CN102856312B/zh active Active
- 2012-06-20 EP EP12172729.1A patent/EP2541597B1/en active Active
- 2012-06-22 US US13/530,230 patent/US8669699B2/en not_active Expired - Fee Related
- 2012-06-25 KR KR1020120067852A patent/KR101363116B1/ko not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004127988A (ja) * | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | 白色発光装置 |
JP2007012792A (ja) * | 2005-06-29 | 2007-01-18 | Kyocera Corp | 発光素子収納用パッケージ、光源および発光装置 |
JP2007180347A (ja) * | 2005-12-28 | 2007-07-12 | Shinko Electric Ind Co Ltd | 発光装置及びその製造方法 |
JP2007266358A (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corp | 発光装置および照明装置 |
JP2008147453A (ja) * | 2006-12-11 | 2008-06-26 | Hitachi Displays Ltd | 照明装置及びこの照明装置を用いた表示装置 |
JP2008159705A (ja) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
JP2010004035A (ja) * | 2008-05-22 | 2010-01-07 | Mitsubishi Chemicals Corp | 半導体発光装置、照明装置、および画像表示装置 |
JP2010056398A (ja) * | 2008-08-29 | 2010-03-11 | Toshiba Corp | 発光デバイス及び発光装置 |
JP2010062305A (ja) * | 2008-09-03 | 2010-03-18 | Hitachi Displays Ltd | 照明装置、及び液晶表示装置 |
JP2010192859A (ja) * | 2009-02-20 | 2010-09-02 | Toshiba Corp | 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015173054A (ja) * | 2014-03-12 | 2015-10-01 | 株式会社モリタ東京製作所 | 照明装置および診療装置 |
JP2015173053A (ja) * | 2014-03-12 | 2015-10-01 | 株式会社モリタ東京製作所 | 照明装置、発光モジュールおよび診療装置 |
JP2016072584A (ja) * | 2014-10-02 | 2016-05-09 | ウシオ電機株式会社 | 発光モジュール |
JP2019184741A (ja) * | 2018-04-05 | 2019-10-24 | 株式会社Reiz | Led複数列式ledテープ |
JP2022545306A (ja) * | 2019-07-29 | 2022-10-27 | ラディアント オプト-エレクトロニクス(ナンキン)カンパニー リミテッド | 調光フィルム、バックライトモジュール及び表示装置 |
JP7301134B2 (ja) | 2019-07-29 | 2023-06-30 | ラディアント オプト-エレクトロニクス(ナンキン)カンパニー リミテッド | 調光フィルム、バックライトモジュール及び表示装置 |
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US20130002128A1 (en) | 2013-01-03 |
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CN102856312A (zh) | 2013-01-02 |
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EP2541597B1 (en) | 2020-12-30 |
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