JP2012524985A - ウェハを位置調整し予備付着するためのデバイス - Google Patents

ウェハを位置調整し予備付着するためのデバイス Download PDF

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Publication number
JP2012524985A
JP2012524985A JP2012506360A JP2012506360A JP2012524985A JP 2012524985 A JP2012524985 A JP 2012524985A JP 2012506360 A JP2012506360 A JP 2012506360A JP 2012506360 A JP2012506360 A JP 2012506360A JP 2012524985 A JP2012524985 A JP 2012524985A
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Japan
Prior art keywords
substrate
carrier
outer contour
carrier substrate
actuator
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Pending
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JP2012506360A
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English (en)
Japanese (ja)
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JP2012524985A5 (https=
Inventor
ユルゲン・ブルクグラーフ
パウル・リンドナー
シュテファン・パルクフリーダー
ダニエル・ブルクシュタラー
Original Assignee
エーファウ・グループ・ゲーエムベーハー
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Publication of JP2012524985A publication Critical patent/JP2012524985A/ja
Publication of JP2012524985A5 publication Critical patent/JP2012524985A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y10T29/49902—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"] by manipulating aligning means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53978—Means to assemble or disassemble including means to relatively position plural work parts
JP2012506360A 2009-04-25 2010-03-31 ウェハを位置調整し予備付着するためのデバイス Pending JP2012524985A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009018977.7 2009-04-25
DE102009018977A DE102009018977A1 (de) 2009-04-25 2009-04-25 Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
PCT/EP2010/002053 WO2010121702A1 (de) 2009-04-25 2010-03-31 Vorrichtung zur ausrichtung und vorfixierung eines wafers

Publications (2)

Publication Number Publication Date
JP2012524985A true JP2012524985A (ja) 2012-10-18
JP2012524985A5 JP2012524985A5 (https=) 2012-11-29

Family

ID=42169431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012506360A Pending JP2012524985A (ja) 2009-04-25 2010-03-31 ウェハを位置調整し予備付着するためのデバイス

Country Status (8)

Country Link
US (2) US8918989B2 (https=)
EP (1) EP2422364B1 (https=)
JP (1) JP2012524985A (https=)
KR (1) KR101642536B1 (https=)
CN (1) CN102439711B (https=)
DE (1) DE102009018977A1 (https=)
TW (1) TWI588930B (https=)
WO (1) WO2010121702A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
DE102012010310B4 (de) 2012-05-24 2019-12-12 Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh Wafer-Aufnahme
DE102012111246A1 (de) 2012-11-21 2014-05-22 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden
KR20150080449A (ko) * 2013-12-06 2015-07-09 에베 그룹 에. 탈너 게엠베하 기질들을 정렬하기 위한 장치 및 방법
CN109332331A (zh) * 2018-09-28 2019-02-15 芜湖华宇彩晶科技有限公司 一种显示屏清洗用支撑定位装置
JP2021171874A (ja) * 2020-04-24 2021-11-01 セイコーエプソン株式会社 ワーク処理方法
JP7597462B2 (ja) * 2020-11-16 2024-12-10 東京エレクトロン株式会社 基板保持機構及び基板載置方法
EP4620024A1 (de) 2022-11-18 2025-09-24 EV Group E. Thallner GmbH Verfahren und vorrichtung zum bonden von substraten
US20250079227A1 (en) * 2023-09-05 2025-03-06 Taiwan Semiconductor Manufacturing Company Limited Wafer retaining device
CN117096071B (zh) * 2023-10-20 2024-01-23 上海谙邦半导体设备有限公司 一种晶圆真空锁系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04149917A (ja) * 1990-10-12 1992-05-22 Murata Mfg Co Ltd グリーンシート基板のブロック化装置
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
JP2004253808A (ja) * 2003-02-20 2004-09-09 Applied Materials Inc 支持ステージに対して基板を位置決めする方法および装置
JP2004296907A (ja) * 2003-03-27 2004-10-21 Shibaura Mechatronics Corp 基板貼り合わせ装置
JP2005039035A (ja) * 2003-07-14 2005-02-10 Nitto Denko Corp 基板貼合せ方法およびその装置
JP2008182127A (ja) * 2007-01-25 2008-08-07 Tokyo Ohka Kogyo Co Ltd 重ね合わせユニット及び貼り合わせ装置

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US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
JPH03227702A (ja) 1990-01-31 1991-10-08 Bridgestone Corp 二輪車用空気入りタイヤ
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JPH098103A (ja) * 1995-06-19 1997-01-10 Nikon Corp 投影露光装置及び投影露光方法
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
WO2000058188A1 (en) * 1999-03-25 2000-10-05 N & K Technology, Inc. Wafer handling robot having x-y stage for wafer handling and positioning
JP2002313688A (ja) * 2001-04-16 2002-10-25 Toshiba Corp ウェーハ接着装置
JP4387219B2 (ja) * 2003-02-20 2009-12-16 アプライド マテリアルズ インコーポレイテッド 支持ステージに対する基板位置を判定する方法および装置
US6908027B2 (en) * 2003-03-31 2005-06-21 Intel Corporation Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
US20050160992A1 (en) * 2004-01-28 2005-07-28 Applied Materials, Inc. Substrate gripping apparatus
DE102007035788A1 (de) * 2007-07-31 2009-02-05 Robert Bosch Gmbh Waferfügeverfahren, Waferverbund sowie Chip
KR100886957B1 (ko) * 2008-04-24 2009-03-09 주식회사 엘트린 기판 본딩 모듈 및 이를 이용한 기판 본딩 방법
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04149917A (ja) * 1990-10-12 1992-05-22 Murata Mfg Co Ltd グリーンシート基板のブロック化装置
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
JP2004253808A (ja) * 2003-02-20 2004-09-09 Applied Materials Inc 支持ステージに対して基板を位置決めする方法および装置
JP2004296907A (ja) * 2003-03-27 2004-10-21 Shibaura Mechatronics Corp 基板貼り合わせ装置
JP2005039035A (ja) * 2003-07-14 2005-02-10 Nitto Denko Corp 基板貼合せ方法およびその装置
JP2008182127A (ja) * 2007-01-25 2008-08-07 Tokyo Ohka Kogyo Co Ltd 重ね合わせユニット及び貼り合わせ装置

Also Published As

Publication number Publication date
EP2422364B1 (de) 2016-03-23
WO2010121702A1 (de) 2010-10-28
TWI588930B (zh) 2017-06-21
US9449863B2 (en) 2016-09-20
TW201101411A (en) 2011-01-01
KR20120014557A (ko) 2012-02-17
US20150089783A1 (en) 2015-04-02
CN102439711B (zh) 2017-02-08
DE102009018977A1 (de) 2010-11-04
US20120110825A1 (en) 2012-05-10
EP2422364A1 (de) 2012-02-29
CN102439711A (zh) 2012-05-02
KR101642536B1 (ko) 2016-07-25
US8918989B2 (en) 2014-12-30

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