KR101642536B1 - 기판을 캐리어 기판 위에 정렬하고 프리픽싱 하기 위한 장치 및 방법 - Google Patents

기판을 캐리어 기판 위에 정렬하고 프리픽싱 하기 위한 장치 및 방법 Download PDF

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Publication number
KR101642536B1
KR101642536B1 KR1020117025193A KR20117025193A KR101642536B1 KR 101642536 B1 KR101642536 B1 KR 101642536B1 KR 1020117025193 A KR1020117025193 A KR 1020117025193A KR 20117025193 A KR20117025193 A KR 20117025193A KR 101642536 B1 KR101642536 B1 KR 101642536B1
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South Korea
Prior art keywords
substrate
carrier substrate
carrier
outer contour
aligning
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KR1020117025193A
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Korean (ko)
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KR20120014557A (ko
Inventor
쥐르겐 부르그르프
폴 린드너
슈테판 파륵프리더
대니얼 부르그스탈러
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에베 그룹 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y10T29/49902—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"] by manipulating aligning means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53978—Means to assemble or disassemble including means to relatively position plural work parts

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020117025193A 2009-04-25 2010-03-31 기판을 캐리어 기판 위에 정렬하고 프리픽싱 하기 위한 장치 및 방법 Active KR101642536B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009018977.7 2009-04-25
DE102009018977A DE102009018977A1 (de) 2009-04-25 2009-04-25 Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers

Publications (2)

Publication Number Publication Date
KR20120014557A KR20120014557A (ko) 2012-02-17
KR101642536B1 true KR101642536B1 (ko) 2016-07-25

Family

ID=42169431

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Application Number Title Priority Date Filing Date
KR1020117025193A Active KR101642536B1 (ko) 2009-04-25 2010-03-31 기판을 캐리어 기판 위에 정렬하고 프리픽싱 하기 위한 장치 및 방법

Country Status (8)

Country Link
US (2) US8918989B2 (https=)
EP (1) EP2422364B1 (https=)
JP (1) JP2012524985A (https=)
KR (1) KR101642536B1 (https=)
CN (1) CN102439711B (https=)
DE (1) DE102009018977A1 (https=)
TW (1) TWI588930B (https=)
WO (1) WO2010121702A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
DE102012010310B4 (de) 2012-05-24 2019-12-12 Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh Wafer-Aufnahme
DE102012111246A1 (de) 2012-11-21 2014-05-22 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden
KR20150080449A (ko) * 2013-12-06 2015-07-09 에베 그룹 에. 탈너 게엠베하 기질들을 정렬하기 위한 장치 및 방법
CN109332331A (zh) * 2018-09-28 2019-02-15 芜湖华宇彩晶科技有限公司 一种显示屏清洗用支撑定位装置
JP2021171874A (ja) * 2020-04-24 2021-11-01 セイコーエプソン株式会社 ワーク処理方法
JP7597462B2 (ja) * 2020-11-16 2024-12-10 東京エレクトロン株式会社 基板保持機構及び基板載置方法
EP4620024A1 (de) 2022-11-18 2025-09-24 EV Group E. Thallner GmbH Verfahren und vorrichtung zum bonden von substraten
US20250079227A1 (en) * 2023-09-05 2025-03-06 Taiwan Semiconductor Manufacturing Company Limited Wafer retaining device
CN117096071B (zh) * 2023-10-20 2024-01-23 上海谙邦半导体设备有限公司 一种晶圆真空锁系统

Citations (3)

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JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
EP1450398A2 (en) 2003-02-20 2004-08-25 Applied Materials, Inc. A method and an apparatus for positioning a substrate relative to a support stage
JP2004296907A (ja) 2003-03-27 2004-10-21 Shibaura Mechatronics Corp 基板貼り合わせ装置

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US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
JPH03227702A (ja) 1990-01-31 1991-10-08 Bridgestone Corp 二輪車用空気入りタイヤ
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JP3227702B2 (ja) * 1990-10-12 2001-11-12 株式会社村田製作所 グリーンシート基板のブロック化装置
JPH098103A (ja) * 1995-06-19 1997-01-10 Nikon Corp 投影露光装置及び投影露光方法
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
WO2000058188A1 (en) * 1999-03-25 2000-10-05 N & K Technology, Inc. Wafer handling robot having x-y stage for wafer handling and positioning
JP2002313688A (ja) * 2001-04-16 2002-10-25 Toshiba Corp ウェーハ接着装置
JP4387219B2 (ja) * 2003-02-20 2009-12-16 アプライド マテリアルズ インコーポレイテッド 支持ステージに対する基板位置を判定する方法および装置
US6908027B2 (en) * 2003-03-31 2005-06-21 Intel Corporation Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
JP4330393B2 (ja) * 2003-07-14 2009-09-16 日東電工株式会社 基板貼合せ方法およびその装置
US20050160992A1 (en) * 2004-01-28 2005-07-28 Applied Materials, Inc. Substrate gripping apparatus
JP4750724B2 (ja) * 2007-01-25 2011-08-17 東京応化工業株式会社 重ね合わせユニット及び貼り合わせ装置
DE102007035788A1 (de) * 2007-07-31 2009-02-05 Robert Bosch Gmbh Waferfügeverfahren, Waferverbund sowie Chip
KR100886957B1 (ko) * 2008-04-24 2009-03-09 주식회사 엘트린 기판 본딩 모듈 및 이를 이용한 기판 본딩 방법
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
EP1450398A2 (en) 2003-02-20 2004-08-25 Applied Materials, Inc. A method and an apparatus for positioning a substrate relative to a support stage
JP2004296907A (ja) 2003-03-27 2004-10-21 Shibaura Mechatronics Corp 基板貼り合わせ装置

Also Published As

Publication number Publication date
EP2422364B1 (de) 2016-03-23
WO2010121702A1 (de) 2010-10-28
TWI588930B (zh) 2017-06-21
US9449863B2 (en) 2016-09-20
JP2012524985A (ja) 2012-10-18
TW201101411A (en) 2011-01-01
KR20120014557A (ko) 2012-02-17
US20150089783A1 (en) 2015-04-02
CN102439711B (zh) 2017-02-08
DE102009018977A1 (de) 2010-11-04
US20120110825A1 (en) 2012-05-10
EP2422364A1 (de) 2012-02-29
CN102439711A (zh) 2012-05-02
US8918989B2 (en) 2014-12-30

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