JP2012514871A5 - - Google Patents

Download PDF

Info

Publication number
JP2012514871A5
JP2012514871A5 JP2011545386A JP2011545386A JP2012514871A5 JP 2012514871 A5 JP2012514871 A5 JP 2012514871A5 JP 2011545386 A JP2011545386 A JP 2011545386A JP 2011545386 A JP2011545386 A JP 2011545386A JP 2012514871 A5 JP2012514871 A5 JP 2012514871A5
Authority
JP
Japan
Prior art keywords
measurement
target
information
accuracy
measurement target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011545386A
Other languages
English (en)
Japanese (ja)
Other versions
JP5635011B2 (ja
JP2012514871A (ja
Filing date
Publication date
Priority claimed from US12/350,826 external-priority patent/US8214771B2/en
Application filed filed Critical
Publication of JP2012514871A publication Critical patent/JP2012514871A/ja
Publication of JP2012514871A5 publication Critical patent/JP2012514871A5/ja
Application granted granted Critical
Publication of JP5635011B2 publication Critical patent/JP5635011B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011545386A 2009-01-08 2010-01-04 光散乱計測ターゲット設計の最適化 Active JP5635011B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/350,826 US8214771B2 (en) 2009-01-08 2009-01-08 Scatterometry metrology target design optimization
US12/350,826 2009-01-08
PCT/US2010/020046 WO2010080732A2 (en) 2009-01-08 2010-01-04 Scatterometry metrology target design optimization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014210497A Division JP5855728B2 (ja) 2009-01-08 2014-10-15 計測ターゲットを設計するための方法、装置および媒体

Publications (3)

Publication Number Publication Date
JP2012514871A JP2012514871A (ja) 2012-06-28
JP2012514871A5 true JP2012514871A5 (https=) 2014-06-05
JP5635011B2 JP5635011B2 (ja) 2014-12-03

Family

ID=42312538

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2011545386A Active JP5635011B2 (ja) 2009-01-08 2010-01-04 光散乱計測ターゲット設計の最適化
JP2014210497A Active JP5855728B2 (ja) 2009-01-08 2014-10-15 計測ターゲットを設計するための方法、装置および媒体
JP2015240051A Pending JP2016066093A (ja) 2009-01-08 2015-12-09 計測ターゲットを設計するための方法、装置および媒体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2014210497A Active JP5855728B2 (ja) 2009-01-08 2014-10-15 計測ターゲットを設計するための方法、装置および媒体
JP2015240051A Pending JP2016066093A (ja) 2009-01-08 2015-12-09 計測ターゲットを設計するための方法、装置および媒体

Country Status (5)

Country Link
US (1) US8214771B2 (https=)
EP (1) EP2386114B1 (https=)
JP (3) JP5635011B2 (https=)
KR (1) KR101281301B1 (https=)
WO (1) WO2010080732A2 (https=)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
US20130110477A1 (en) * 2011-10-31 2013-05-02 Stilian Pandev Process variation-based model optimization for metrology
US9311431B2 (en) * 2011-11-03 2016-04-12 Kla-Tencor Corporation Secondary target design for optical measurements
US20130297061A1 (en) * 2012-05-03 2013-11-07 National Taiwan University Method and computer-aided design system of manufacturing an optical system
US9329033B2 (en) * 2012-09-05 2016-05-03 Kla-Tencor Corporation Method for estimating and correcting misregistration target inaccuracy
US9879977B2 (en) 2012-11-09 2018-01-30 Kla-Tencor Corporation Apparatus and method for optical metrology with optimized system parameters
US20140136164A1 (en) * 2012-11-09 2014-05-15 Kla -Tencor Corporation Analytic continuations to the continuum limit in numerical simulations of wafer response
US10769320B2 (en) * 2012-12-18 2020-09-08 Kla-Tencor Corporation Integrated use of model-based metrology and a process model
US9910953B2 (en) 2013-03-04 2018-03-06 Kla-Tencor Corporation Metrology target identification, design and verification
KR101694275B1 (ko) 2013-03-14 2017-01-23 에이에스엠엘 네델란즈 비.브이. 패터닝 디바이스, 기판에 마커를 생성하는 방법 및 디바이스 제조 방법
US10955359B2 (en) * 2013-11-12 2021-03-23 International Business Machines Corporation Method for quantification of process non uniformity using model-based metrology
JP6509225B2 (ja) * 2013-12-11 2019-05-08 ケーエルエー−テンカー コーポレイション 要件に対するターゲット及びプロセス感度の分析
SG11201604739RA (en) 2013-12-30 2016-07-28 Asml Netherlands Bv Method and apparatus for design of a metrology target
KR101860038B1 (ko) 2013-12-30 2018-05-21 에이에스엠엘 네델란즈 비.브이. 메트롤로지 타겟의 디자인을 위한 방법 및 장치
US9553033B2 (en) 2014-01-15 2017-01-24 Kla-Tencor Corporation Semiconductor device models including re-usable sub-structures
KR101906289B1 (ko) * 2014-02-21 2018-10-10 에이에스엠엘 네델란즈 비.브이. 리소그래피를 수반하는 제조 공정을 위한 공정 파라미터의 측정
CN106030414B (zh) 2014-02-21 2018-10-09 Asml荷兰有限公司 目标布置的优化和相关的目标
NL2013293A (en) * 2014-06-02 2016-03-31 Asml Netherlands Bv Method of designing metrology targets, substrates having metrology targets, method of measuring overlay, and device manufacturing method.
KR102574171B1 (ko) 2014-08-29 2023-09-06 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법, 타겟 및 기판
TWI703651B (zh) 2014-10-03 2020-09-01 美商克萊譚克公司 驗證度量目標及其設計
US9589079B2 (en) 2014-11-17 2017-03-07 Sunedison, Inc. Methods and systems for designing photovoltaic systems
US10185303B2 (en) 2015-02-21 2019-01-22 Kla-Tencor Corporation Optimizing computational efficiency by multiple truncation of spatial harmonics
CN113050388B (zh) * 2015-04-10 2024-11-05 Asml荷兰有限公司 用于检测及量测的方法与装置
CN107532945B (zh) * 2015-04-21 2020-12-01 科磊股份有限公司 用于倾斜装置设计的计量目标设计
US9995689B2 (en) * 2015-05-22 2018-06-12 Nanometrics Incorporated Optical metrology using differential fitting
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling
US9824176B2 (en) * 2015-07-24 2017-11-21 Nanometrics Incorporated Optical critical dimension target design
WO2017032534A2 (en) * 2015-08-27 2017-03-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10386829B2 (en) 2015-09-18 2019-08-20 Kla-Tencor Corporation Systems and methods for controlling an etch process
US9697310B2 (en) * 2015-11-02 2017-07-04 Winbond Electronics Corporation Level faults interception in integrated circuits
KR20190005955A (ko) 2016-05-12 2019-01-16 에이에스엠엘 네델란즈 비.브이. 측정치 획득 방법, 프로세스 단계 수행 장치, 계측 장치, 디바이스 제조 방법
US10018919B2 (en) 2016-05-29 2018-07-10 Kla-Tencor Corporation System and method for fabricating metrology targets oriented with an angle rotated with respect to device features
WO2017207269A1 (en) * 2016-06-03 2017-12-07 Asml Holding N.V. Alignment system wafer stack beam analyzer
US10095122B1 (en) 2016-06-30 2018-10-09 Kla-Tencor Corporation Systems and methods for fabricating metrology targets with sub-resolution features
US10527952B2 (en) * 2016-10-25 2020-01-07 Kla-Tencor Corporation Fault discrimination and calibration of scatterometry overlay targets
US10496781B2 (en) * 2016-12-19 2019-12-03 Kla Tencor Corporation Metrology recipe generation using predicted metrology images
CN110249268B (zh) 2017-02-02 2021-08-24 Asml荷兰有限公司 量测方法和设备以及关联的计算机产品
EP3367166A1 (en) * 2017-02-24 2018-08-29 ASML Netherlands B.V. Method of measuring variation, inspection system, computer program, and computer system
US11106141B2 (en) 2017-04-28 2021-08-31 Asml Netherlands B.V. Optimizing a sequence of processes for manufacturing of product units
US11112369B2 (en) * 2017-06-19 2021-09-07 Kla-Tencor Corporation Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay
US11119417B2 (en) * 2018-11-21 2021-09-14 Kla-Tencor Corporation Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s)
US11018064B2 (en) 2018-12-12 2021-05-25 Kla Corporation Multiple-tool parameter set configuration and misregistration measurement system and method
WO2020190318A1 (en) * 2019-03-21 2020-09-24 Kla Corporation Parameter-stable misregistration measurement amelioration in semiconductor devices
CN114097066A (zh) * 2019-07-10 2022-02-25 科磊股份有限公司 数据驱动的错位参数配置与测量的系统及方法
US12585201B2 (en) * 2019-10-14 2026-03-24 Asml Holding N.V. Metrology mark structure and method of determining metrology mark structure
US11487929B2 (en) * 2020-04-28 2022-11-01 Kla Corporation Target design process for overlay targets intended for multi-signal measurements
KR20240037469A (ko) * 2022-09-15 2024-03-22 에스케이하이닉스 주식회사 반도체 소자 제조 파라미터 설정 방법 및 장치
KR102738956B1 (ko) * 2023-10-31 2024-12-06 (주)오로스 테크놀로지 오버레이 계측 방법 및 오버레이 계측 시스템

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166752A (en) * 1990-01-11 1992-11-24 Rudolph Research Corporation Simultaneous multiple angle/multiple wavelength ellipsometer and method
US5181080A (en) * 1991-12-23 1993-01-19 Therma-Wave, Inc. Method and apparatus for evaluating the thickness of thin films
JPH08202020A (ja) * 1995-01-31 1996-08-09 Sony Corp フォトマスクにおけるパターン形状評価方法、フォトマスク、フォトマスクの作製方法、フォトマスクのパターン形成方法、並びに露光方法
US5805290A (en) * 1996-05-02 1998-09-08 International Business Machines Corporation Method of optical metrology of unresolved pattern arrays
JP2000021767A (ja) * 1998-07-03 2000-01-21 Canon Inc 位置観察方法及び位置観察装置
US6248602B1 (en) * 1999-11-01 2001-06-19 Amd, Inc. Method and apparatus for automated rework within run-to-run control semiconductor manufacturing
JP4077141B2 (ja) 2000-06-30 2008-04-16 株式会社東芝 デザインルール作成方法、デザインルール作成システム及び記録媒体
US6430737B1 (en) * 2000-07-10 2002-08-06 Mentor Graphics Corp. Convergence technique for model-based optical and process correction
JP3347130B2 (ja) * 2000-09-27 2002-11-20 株式会社東芝 アライメント方法
US6581193B1 (en) * 2001-06-13 2003-06-17 Kla-Tencor Apparatus and methods for modeling process effects and imaging effects in scanning electron microscopy
US6678046B2 (en) * 2001-08-28 2004-01-13 Therma-Wave, Inc. Detector configurations for optical metrology
US6673638B1 (en) 2001-11-14 2004-01-06 Kla-Tencor Corporation Method and apparatus for the production of process sensitive lithographic features
US6886153B1 (en) * 2001-12-21 2005-04-26 Kla-Tencor Corporation Design driven inspection or measurement for semiconductor using recipe
FI113876B (fi) * 2002-02-15 2004-06-30 Valtion Teknillinen Uudet tärkkelyspohjaiset liimat
US20030160163A1 (en) * 2002-02-25 2003-08-28 Alan Wong Optical metrology target design for simultaneous measurement of multiple periodic structures
US7712056B2 (en) * 2002-06-07 2010-05-04 Cadence Design Systems, Inc. Characterization and verification for integrated circuit designs
US7092110B2 (en) * 2002-07-25 2006-08-15 Timbre Technologies, Inc. Optimized model and parameter selection for optical metrology
JP4080813B2 (ja) * 2002-08-09 2008-04-23 株式会社東芝 マーク設計システム、マーク設計方法、マーク設計プログラムおよびこのマーク設計方法を用いた半導体装置の製造方法
US7266480B2 (en) * 2002-10-01 2007-09-04 The Regents Of The University Of California Rapid scattering simulation of objects in imaging using edge domain decomposition
US20040181768A1 (en) * 2003-03-12 2004-09-16 Krukar Richard H. Model pattern simulation of semiconductor wafer processing steps
US7608468B1 (en) * 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
US7346878B1 (en) * 2003-07-02 2008-03-18 Kla-Tencor Technologies Corporation Apparatus and methods for providing in-chip microtargets for metrology or inspection
US7135344B2 (en) * 2003-07-11 2006-11-14 Applied Materials, Israel, Ltd. Design-based monitoring
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US7573574B2 (en) * 2004-07-13 2009-08-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7678516B2 (en) * 2004-07-22 2010-03-16 Kla-Tencor Technologies Corp. Test structures and methods for monitoring or controlling a semiconductor fabrication process
JP4904034B2 (ja) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
JP4856865B2 (ja) * 2004-10-05 2012-01-18 キヤノン株式会社 位置検出方法
US7094507B2 (en) * 2004-10-29 2006-08-22 Infineon Technologies Ag Method for determining an optimal absorber stack geometry of a lithographic reflection mask
JP4707374B2 (ja) * 2004-11-26 2011-06-22 Ｏｋｉセミコンダクタ株式会社 Ｅｓｄ保護回路の構成を決定する方法及びシミュレーション方法
US20060117293A1 (en) * 2004-11-30 2006-06-01 Nigel Smith Method for designing an overlay mark
TWI269870B (en) * 2004-12-30 2007-01-01 Ind Tech Res Inst Method for deciding structure parameters of a grating
US7557921B1 (en) * 2005-01-14 2009-07-07 Kla-Tencor Technologies Corporation Apparatus and methods for optically monitoring the fidelity of patterns produced by photolitographic tools
KR100660861B1 (ko) * 2005-02-23 2006-12-26 삼성전자주식회사 반도체 공정 결과를 예측하고 제어하는 반도체 공정 제어장치
US7695876B2 (en) * 2005-08-31 2010-04-13 Brion Technologies, Inc. Method for identifying and using process window signature patterns for lithography process control
US7480050B2 (en) * 2006-02-09 2009-01-20 Asml Netherlands B.V. Lithographic system, sensor, and method of measuring properties of a substrate
US7925486B2 (en) * 2006-03-14 2011-04-12 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
US7528941B2 (en) * 2006-06-01 2009-05-05 Kla-Tencor Technolgies Corporation Order selected overlay metrology
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization

Similar Documents

Publication Publication Date Title
JP2012514871A5 (https=)
JP5635011B2 (ja) 光散乱計測ターゲット設計の最適化
EP3658944B1 (fr) Procédé de calibration d'un magnétomètre
TWI640743B (zh) 在散射疊對量測中校準光瞳中心之方法與系統
CN113348358B (zh) 用于大量生产过程监视的宽松耦合检验及计量系统
TW200921085A (en) Determining profile parameters of a structure using approximation and fine diffraction models in optical metrology
Peery et al. Easily interpretable bulk flows: continuing tension with the standard cosmological model
Dong et al. Determination of an optimal measurement configuration in optical scatterometry using global sensitivity analysis
Harnois-Déraps et al. Non-Gaussian error bars in galaxy surveys–I
Kok et al. Virtual experiments for the assessment of data analysis and uncertainty quantification methods in scatterometry
CN108040250B (zh) 一种智能电视性能的评估方法和装置
CN113255921A (zh) 测量系统、方法、装置及设备
CN118261028B (zh) 一种气溶胶光学和微物理参数反演方法和系统
JP2017167081A (ja) 粒子径分布測定装置、データ処理方法及びデータ処理プログラム
Scholze et al. Determination of line profiles on photomasks using DUV, EUV, and x-ray scattering
Naglič et al. From Monte Carlo simulations to efficient estimation of optical properties for spatial frequency domain imaging
Kobayashi et al. Application of the statistical optimization method to the inversion algorithm for analyzing aerosol optical properties from sun and sky radiance measurements
TW201028643A (en) Curved surface testing system and method
Tejnil Application of optical similarity in OPC model calibration
US8860956B2 (en) Spectrometry employing extinction coefficient modulation
JP7654117B2 (ja) 粒子線解析装置及び粒子線解析方法
Dillon et al. Mask process matching using a model based data preparation solution
TW201432482A (zh) 對於晶圓響應之數値模擬中之連續極限的解析延拓
KR20200131545A (ko) 반도체 구조의 분석 방법 및 분석 시스템
JP7129356B2 (ja) 測定方法