JP2012507860A5 - - Google Patents
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- Publication number
- JP2012507860A5 JP2012507860A5 JP2011534507A JP2011534507A JP2012507860A5 JP 2012507860 A5 JP2012507860 A5 JP 2012507860A5 JP 2011534507 A JP2011534507 A JP 2011534507A JP 2011534507 A JP2011534507 A JP 2011534507A JP 2012507860 A5 JP2012507860 A5 JP 2012507860A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode assembly
- lower electrode
- edge ring
- assembly according
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 20
- 238000005219 brazing Methods 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19315108P | 2008-10-31 | 2008-10-31 | |
| US61/193,151 | 2008-10-31 | ||
| PCT/US2009/005857 WO2010062345A2 (en) | 2008-10-31 | 2009-10-29 | Lower electrode assembly of plasma processing chamber |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015090990A Division JP5976875B2 (ja) | 2008-10-31 | 2015-04-28 | プラズマ処理チャンバの下側電極アセンブリ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012507860A JP2012507860A (ja) | 2012-03-29 |
| JP2012507860A5 true JP2012507860A5 (https=) | 2012-12-13 |
| JP5743895B2 JP5743895B2 (ja) | 2015-07-01 |
Family
ID=42130005
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011534507A Active JP5743895B2 (ja) | 2008-10-31 | 2009-10-29 | プラズマ処理チャンバの下側電極アセンブリ |
| JP2015090990A Active JP5976875B2 (ja) | 2008-10-31 | 2015-04-28 | プラズマ処理チャンバの下側電極アセンブリ |
| JP2016142436A Active JP6385397B2 (ja) | 2008-10-31 | 2016-07-20 | プラズマ処理チャンバの下側電極アセンブリ |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015090990A Active JP5976875B2 (ja) | 2008-10-31 | 2015-04-28 | プラズマ処理チャンバの下側電極アセンブリ |
| JP2016142436A Active JP6385397B2 (ja) | 2008-10-31 | 2016-07-20 | プラズマ処理チャンバの下側電極アセンブリ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9412555B2 (https=) |
| EP (1) | EP2342951B1 (https=) |
| JP (3) | JP5743895B2 (https=) |
| KR (3) | KR101624123B1 (https=) |
| CN (1) | CN102187741B (https=) |
| TW (1) | TWI496511B (https=) |
| WO (1) | WO2010062345A2 (https=) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8485128B2 (en) | 2010-06-30 | 2013-07-16 | Lam Research Corporation | Movable ground ring for a plasma processing chamber |
| US9859142B2 (en) | 2011-10-20 | 2018-01-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US9869392B2 (en) * | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US8677586B2 (en) * | 2012-04-04 | 2014-03-25 | Lam Research Corporation | Installation fixture for elastomer bands and methods of using the same |
| US9070536B2 (en) * | 2012-04-24 | 2015-06-30 | Applied Materials, Inc. | Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface |
| US9997381B2 (en) | 2013-02-18 | 2018-06-12 | Lam Research Corporation | Hybrid edge ring for plasma wafer processing |
| US9502279B2 (en) | 2013-06-28 | 2016-11-22 | Lam Research Corporation | Installation fixture having a micro-grooved non-stick surface |
| US9583369B2 (en) | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US9725799B2 (en) | 2013-12-06 | 2017-08-08 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| JP2015115421A (ja) * | 2013-12-10 | 2015-06-22 | 東京エレクトロン株式会社 | プラズマ処理装置及びフォーカスリング |
| US9583377B2 (en) | 2013-12-17 | 2017-02-28 | Lam Research Corporation | Installation fixture for elastomer bands |
| US10804081B2 (en) * | 2013-12-20 | 2020-10-13 | Lam Research Corporation | Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber |
| US10090211B2 (en) | 2013-12-26 | 2018-10-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| JP6540022B2 (ja) * | 2014-12-26 | 2019-07-10 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| TWI613753B (zh) * | 2015-02-16 | 2018-02-01 | 麥豐密封科技股份有限公司 | 靜電吸附承盤側壁之改良密封件 |
| CN106711061B (zh) * | 2015-11-18 | 2019-11-29 | 北京北方华创微电子装备有限公司 | 承载装置及反应腔室 |
| JP6545613B2 (ja) * | 2015-12-28 | 2019-07-17 | クアーズテック株式会社 | フォーカスリング |
| JP3210105U (ja) * | 2016-03-04 | 2017-04-27 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ユニバーサルプロセスキット |
| US10256003B2 (en) | 2017-01-31 | 2019-04-09 | Plansee Japan Ltd. | Blind-vented electrode |
| US11195704B2 (en) | 2017-03-31 | 2021-12-07 | Beijing E-town Semiconductor Technology Co., Ltd. | Pedestal assembly for plasma processing apparatus |
| EP3607635B1 (de) * | 2017-04-07 | 2022-10-19 | Sew-Eurodrive GmbH & Co. KG | Verfahren zum herstellen eines systems zur induktiven übertragung von energie an ein mobilteil und vorrichtung zur durchführung des verfahrens |
| KR102258054B1 (ko) * | 2017-07-24 | 2021-05-28 | 램 리써치 코포레이션 | 이동가능한 에지 링 설계들 |
| CN118380372A (zh) | 2017-11-21 | 2024-07-23 | 朗姆研究公司 | 底部边缘环和中部边缘环 |
| CN115938902B (zh) * | 2017-12-15 | 2024-10-29 | 朗姆研究公司 | 等离子体室中使用的环形结构和系统 |
| US11387134B2 (en) | 2018-01-19 | 2022-07-12 | Applied Materials, Inc. | Process kit for a substrate support |
| US12293902B2 (en) | 2018-01-19 | 2025-05-06 | Applied Materials, Inc. | Process kit for a substrate support |
| CN118398464A (zh) | 2018-08-13 | 2024-07-26 | 朗姆研究公司 | 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件 |
| JP7228989B2 (ja) * | 2018-11-05 | 2023-02-27 | 東京エレクトロン株式会社 | 載置台、エッジリングの位置決め方法及び基板処理装置 |
| US11094511B2 (en) * | 2018-11-13 | 2021-08-17 | Applied Materials, Inc. | Processing chamber with substrate edge enhancement processing |
| CN112992631B (zh) * | 2019-12-16 | 2023-09-29 | 中微半导体设备(上海)股份有限公司 | 一种下电极组件，其安装方法及等离子体处理装置 |
| KR102905595B1 (ko) | 2020-03-23 | 2025-12-29 | 램 리써치 코포레이션 | 기판 프로세싱 시스템들에서의 중간-링 부식 보상 |
| WO2022076227A1 (en) | 2020-10-05 | 2022-04-14 | Lam Research Corporation | Moveable edge rings for plasma processing systems |
| CN112466740A (zh) * | 2020-11-30 | 2021-03-09 | 上海诺硕电子科技有限公司 | 等离子体处理晶圆用载具及晶圆处理设备 |
| CN114649178A (zh) * | 2020-12-18 | 2022-06-21 | 中微半导体设备(上海)股份有限公司 | 一种下电极组件及等离子体处理装置 |
| KR102580583B1 (ko) * | 2021-08-10 | 2023-09-21 | 피에스케이 주식회사 | 기판 처리 장치 |
| US12469733B2 (en) | 2021-12-14 | 2025-11-11 | Applied Materials, Inc. | Wafer to baseplate arc prevention using textured dielectric |
| US20250079132A1 (en) * | 2022-01-11 | 2025-03-06 | Lam Research Corporation | Plasma radical edge ring barrier seal |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3257741B2 (ja) * | 1994-03-03 | 2002-02-18 | 東京エレクトロン株式会社 | プラズマエッチング装置及び方法 |
| US5573596A (en) * | 1994-01-28 | 1996-11-12 | Applied Materials, Inc. | Arc suppression in a plasma processing system |
| JP3210207B2 (ja) * | 1994-04-20 | 2001-09-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JPH08316299A (ja) * | 1995-03-14 | 1996-11-29 | Souzou Kagaku:Kk | 静電チャック |
| US5824605A (en) * | 1995-07-31 | 1998-10-20 | Lam Research Corporation | Gas dispersion window for plasma apparatus and method of use thereof |
| US5805408A (en) * | 1995-12-22 | 1998-09-08 | Lam Research Corporation | Electrostatic clamp with lip seal for clamping substrates |
| US5948704A (en) * | 1996-06-05 | 1999-09-07 | Lam Research Corporation | High flow vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support |
| US6013155A (en) * | 1996-06-28 | 2000-01-11 | Lam Research Corporation | Gas injection system for plasma processing |
| US6284093B1 (en) * | 1996-11-29 | 2001-09-04 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
| JPH10303288A (ja) * | 1997-04-26 | 1998-11-13 | Anelva Corp | プラズマ処理装置用基板ホルダー |
| US6039836A (en) * | 1997-12-19 | 2000-03-21 | Lam Research Corporation | Focus rings |
| US6179924B1 (en) * | 1998-04-28 | 2001-01-30 | Applied Materials, Inc. | Heater for use in substrate processing apparatus to deposit tungsten |
| US6013984A (en) * | 1998-06-10 | 2000-01-11 | Lam Research Corporation | Ion energy attenuation method by determining the required number of ion collisions |
| US5998932A (en) * | 1998-06-26 | 1999-12-07 | Lam Research Corporation | Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber |
| US6230651B1 (en) * | 1998-12-30 | 2001-05-15 | Lam Research Corporation | Gas injection system for plasma processing |
| US6383931B1 (en) * | 2000-02-11 | 2002-05-07 | Lam Research Corporation | Convertible hot edge ring to improve low-K dielectric etch |
| US6872281B1 (en) * | 2000-09-28 | 2005-03-29 | Lam Research Corporation | Chamber configuration for confining a plasma |
| US6333272B1 (en) * | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US6391787B1 (en) * | 2000-10-13 | 2002-05-21 | Lam Research Corporation | Stepped upper electrode for plasma processing uniformity |
| US6554954B2 (en) | 2001-04-03 | 2003-04-29 | Applied Materials Inc. | Conductive collar surrounding semiconductor workpiece in plasma chamber |
| JP2003152063A (ja) * | 2001-11-09 | 2003-05-23 | Applied Materials Inc | 静電チャック及び半導体製造装置 |
| TWI272877B (en) * | 2001-12-13 | 2007-02-01 | Tokyo Electron Ltd | Ring mechanism, and plasma processing device using the ring mechanism |
| JP4082924B2 (ja) * | 2002-04-16 | 2008-04-30 | キヤノンアネルバ株式会社 | 静電吸着ホルダー及び基板処理装置 |
| US6896765B2 (en) * | 2002-09-18 | 2005-05-24 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
| JP2004296553A (ja) * | 2003-03-25 | 2004-10-21 | Ngk Insulators Ltd | 半導体製造装置用部材 |
| KR100578129B1 (ko) * | 2003-09-19 | 2006-05-10 | 삼성전자주식회사 | 플라즈마 식각 장치 |
| US7338578B2 (en) * | 2004-01-20 | 2008-03-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Step edge insert ring for etch chamber |
| JP4833859B2 (ja) * | 2004-01-30 | 2011-12-07 | 東京エレクトロン株式会社 | 流体用ギャップを有する基板ホルダとこの基板ホルダの製造方法 |
| US20060043067A1 (en) * | 2004-08-26 | 2006-03-02 | Lam Research Corporation | Yttria insulator ring for use inside a plasma chamber |
| US7815740B2 (en) * | 2005-03-18 | 2010-10-19 | Tokyo Electron Limited | Substrate mounting table, substrate processing apparatus and substrate processing method |
| JP4674512B2 (ja) * | 2005-09-12 | 2011-04-20 | パナソニック株式会社 | プラズマ処理装置 |
| US7588668B2 (en) * | 2005-09-13 | 2009-09-15 | Applied Materials, Inc. | Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers |
| JP2007250967A (ja) * | 2006-03-17 | 2007-09-27 | Tokyo Electron Ltd | プラズマ処理装置および方法とフォーカスリング |
| JP2008078208A (ja) * | 2006-09-19 | 2008-04-03 | Tokyo Electron Ltd | フォーカスリング及びプラズマ処理装置 |
-
2009
- 2009-10-29 KR KR1020157022860A patent/KR101624123B1/ko active Active
- 2009-10-29 WO PCT/US2009/005857 patent/WO2010062345A2/en not_active Ceased
- 2009-10-29 KR KR1020117010001A patent/KR101592061B1/ko active Active
- 2009-10-29 JP JP2011534507A patent/JP5743895B2/ja active Active
- 2009-10-29 CN CN200980141249.1A patent/CN102187741B/zh active Active
- 2009-10-29 KR KR1020167013192A patent/KR101701101B1/ko active Active
- 2009-10-29 EP EP09829445.7A patent/EP2342951B1/en active Active
- 2009-10-30 US US12/609,377 patent/US9412555B2/en active Active
- 2009-10-30 TW TW098136933A patent/TWI496511B/zh active
-
2015
- 2015-04-28 JP JP2015090990A patent/JP5976875B2/ja active Active
-
2016
- 2016-07-20 JP JP2016142436A patent/JP6385397B2/ja active Active
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