JP2012226934A - 基板組立体および照明装置 - Google Patents
基板組立体および照明装置 Download PDFInfo
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- JP2012226934A JP2012226934A JP2011092708A JP2011092708A JP2012226934A JP 2012226934 A JP2012226934 A JP 2012226934A JP 2011092708 A JP2011092708 A JP 2011092708A JP 2011092708 A JP2011092708 A JP 2011092708A JP 2012226934 A JP2012226934 A JP 2012226934A
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- flexible printed
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- 239000000758 substrate Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 7
- 238000005286 illumination Methods 0.000 description 5
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- 238000005452 bending Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
- F21L4/00—Electric lighting devices with self-contained electric batteries or cells
- F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
【解決手段】発光ダイオードランプ1は、ランプ本体2に基板組立体3が配設され、基板組立体3に発光ダイオード5が取り付けられている。基板組立体3は複数のフレキシブルプリント基板6から構成されている。各フレキシブルプリント基板6はそれぞれ、平板状の基体7を有し、基体7の両端部にそれぞれ発光ダイオードランプ1の給電部との接続部8が設けられ、基体7の中間部が複数箇所で折り曲げられて天面部9および側面部10が形成されている。これらのフレキシブルプリント基板6は、その天面部9が交差して上下に重なるように立体的に組み合わされている。
【選択図】図1
Description
[発明の実施の形態1]
[発明の実施の形態2]
[発明の実施の形態3]
[発明の実施の形態4]
[発明の実施の形態5]
[発明のその他の実施の形態]
2……ランプ本体(照明装置本体)
3……基板組立体
5……発光ダイオード
6……フレキシブルプリント基板
6a……放熱層
7……基体
8……接続部
9……天面部
10……側面部
10a……側縁部
11……発光ダイオード取付部
13……リブ
Claims (6)
- 発光ダイオードが取り付けられた照明装置に用いられる複数のフレキシブルプリント基板からなる基板組立体であって、
前記各フレキシブルプリント基板はそれぞれ、平板状の基体を有し、この基体の両端部にそれぞれ前記照明装置の給電部との接続部が設けられ、前記基体の中間部が複数箇所で折り曲げられて天面部および側面部が形成され、
これらのフレキシブルプリント基板は、ほぼ同一の形状を呈しているとともに、その天面部が交差して上下に重なるように立体的に組み合わされていることを特徴とする基板組立体。 - 前記各フレキシブルプリント基板はそれぞれ、引張強度が400MPa以上で厚さが70μm以上の銅箔からなる放熱層を有することを特徴とする請求項1に記載の基板組立体。
- 前記複数のフレキシブルプリント基板のうち、最上位に位置するフレキシブルプリント基板は、前記天面部および前記側面部にそれぞれ、前記発光ダイオードが取り付けられる発光ダイオード取付部が設けられ、それ以外のフレキシブルプリント基板は、前記側面部に、前記発光ダイオードが取り付けられる発光ダイオード取付部が設けられていることを特徴とする請求項1または2に記載の基板組立体。
- 前記複数のフレキシブルプリント基板の前記発光ダイオード取付部は、前記発光ダイオードが取り付けられたときに、これらの発光ダイオードの照射領域が周縁部において互いに重なるように設定されていることを特徴とする請求項3に記載の基板組立体。
- 前記フレキシブルプリント基板の前記側面部には、側縁部に沿ってリブが形成されていることを特徴とする請求項1乃至4のいずれかに記載の基板組立体。
- 照明装置本体に請求項1乃至5のいずれかに記載の前記基板組立体が配設され、この基板組立体に前記発光ダイオードが取り付けられていることを特徴とする照明装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011092708A JP5750297B2 (ja) | 2011-04-19 | 2011-04-19 | 基板組立体および照明装置 |
EP11863822.0A EP2570720B1 (en) | 2011-04-19 | 2011-12-16 | Circuit board assembly and lighting device |
US13/521,651 US8545056B2 (en) | 2011-04-19 | 2011-12-16 | LED flexible board assembly and lighting unit |
PCT/JP2011/079159 WO2012144109A1 (ja) | 2011-04-19 | 2011-12-16 | 基板組立体および照明装置 |
TW101113771A TWI557363B (zh) | 2011-04-19 | 2012-04-18 | 基板組裝體及照明裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011092708A JP5750297B2 (ja) | 2011-04-19 | 2011-04-19 | 基板組立体および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012226934A true JP2012226934A (ja) | 2012-11-15 |
JP5750297B2 JP5750297B2 (ja) | 2015-07-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011092708A Active JP5750297B2 (ja) | 2011-04-19 | 2011-04-19 | 基板組立体および照明装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8545056B2 (ja) |
EP (1) | EP2570720B1 (ja) |
JP (1) | JP5750297B2 (ja) |
TW (1) | TWI557363B (ja) |
WO (1) | WO2012144109A1 (ja) |
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KR101325080B1 (ko) * | 2013-07-01 | 2013-11-05 | 주식회사 디에스이 | 엘이디 촛대전구 |
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JP2014229604A (ja) * | 2013-05-20 | 2014-12-08 | 華宏新技股▲分▼有限公司 | 折り曲げ可能な熱放射複合体及び該熱放射複合体を備えるバックライトユニット |
JP2016012467A (ja) * | 2014-06-28 | 2016-01-21 | 岩崎電気株式会社 | 気密封止形のledランプ |
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- 2011-12-16 WO PCT/JP2011/079159 patent/WO2012144109A1/ja active Application Filing
- 2011-12-16 US US13/521,651 patent/US8545056B2/en not_active Expired - Fee Related
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US9370093B2 (en) | 2013-05-10 | 2016-06-14 | Nichia Corporation | Wiring board and light emitting device using same |
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KR101325080B1 (ko) * | 2013-07-01 | 2013-11-05 | 주식회사 디에스이 | 엘이디 촛대전구 |
CN103574368A (zh) * | 2013-11-12 | 2014-02-12 | 无锡天地合同能源管理有限公司 | Led球泡灯 |
JP2016012467A (ja) * | 2014-06-28 | 2016-01-21 | 岩崎電気株式会社 | 気密封止形のledランプ |
JP2016092306A (ja) * | 2014-11-07 | 2016-05-23 | 住友電工プリントサーキット株式会社 | Ledモジュール及びled照明器具 |
JP2018508115A (ja) * | 2015-03-09 | 2018-03-22 | リッドリテック カンパニー, リミテッドLedlitek Co., Ltd | Ledランプ用フレキシブル回路基板組立体 |
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CN110375217A (zh) * | 2017-09-18 | 2019-10-25 | 烟台知兴知识产权咨询服务有限公司 | 一种电力线路检修用便携式照明装置 |
CN110375217B (zh) * | 2017-09-18 | 2020-07-10 | 海门市初享工业设计有限公司 | 一种电力线路检修用便携式照明装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2570720A4 (en) | 2014-04-02 |
WO2012144109A1 (ja) | 2012-10-26 |
JP5750297B2 (ja) | 2015-07-15 |
EP2570720A1 (en) | 2013-03-20 |
US8545056B2 (en) | 2013-10-01 |
TWI557363B (zh) | 2016-11-11 |
US20120287614A1 (en) | 2012-11-15 |
EP2570720B1 (en) | 2016-03-09 |
TW201305490A (zh) | 2013-02-01 |
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