JP2012215527A5 - - Google Patents
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- Publication number
- JP2012215527A5 JP2012215527A5 JP2011082161A JP2011082161A JP2012215527A5 JP 2012215527 A5 JP2012215527 A5 JP 2012215527A5 JP 2011082161 A JP2011082161 A JP 2011082161A JP 2011082161 A JP2011082161 A JP 2011082161A JP 2012215527 A5 JP2012215527 A5 JP 2012215527A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- side pad
- front side
- conductive layer
- sputter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011082161A JP5670806B2 (ja) | 2011-04-01 | 2011-04-01 | セラミック基板及びその製造方法 |
| US13/436,005 US9049786B2 (en) | 2011-04-01 | 2012-03-30 | Ceramic substrate and method for manufacturing the same |
| KR1020120033148A KR101555405B1 (ko) | 2011-04-01 | 2012-03-30 | 세라믹 기판 및 그 제조방법 |
| CN201210094793.9A CN102740590B (zh) | 2011-04-01 | 2012-04-01 | 陶瓷基板及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011082161A JP5670806B2 (ja) | 2011-04-01 | 2011-04-01 | セラミック基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012215527A JP2012215527A (ja) | 2012-11-08 |
| JP2012215527A5 true JP2012215527A5 (enExample) | 2013-07-25 |
| JP5670806B2 JP5670806B2 (ja) | 2015-02-18 |
Family
ID=46925759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011082161A Active JP5670806B2 (ja) | 2011-04-01 | 2011-04-01 | セラミック基板及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9049786B2 (enExample) |
| JP (1) | JP5670806B2 (enExample) |
| KR (1) | KR101555405B1 (enExample) |
| CN (1) | CN102740590B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5798435B2 (ja) | 2011-03-07 | 2015-10-21 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板およびその製造方法 |
| JP5777997B2 (ja) * | 2011-03-07 | 2015-09-16 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板およびその製造方法 |
| CN115626828A (zh) * | 2017-10-20 | 2023-01-20 | 飞罗得材料技术股份有限公司 | 陶瓷、探针引导构件、探针卡及封装检查用插座 |
| KR101961101B1 (ko) * | 2017-12-07 | 2019-03-22 | (주)티에스이 | 무프레임 구조를 갖는 테스트용 러버 소켓 및 그의 제작 방법 |
| JP2020030127A (ja) * | 2018-08-23 | 2020-02-27 | 日本特殊陶業株式会社 | 電気検査用基板およびその製造方法 |
| JP7102525B2 (ja) * | 2018-11-29 | 2022-07-19 | コステックシス カンパニー リミテッド | 入出力回路が内蔵された電力増幅器用パッケージの製造方法 |
| CN115307617A (zh) * | 2022-07-13 | 2022-11-08 | 广州奥鑫通讯设备有限公司 | 一种用于光纤陀螺仪的光器件及其制备方法 |
| CN115291340A (zh) * | 2022-07-13 | 2022-11-04 | 广州奥鑫通讯设备有限公司 | 一种用于光纤陀螺仪的光器件及其制备方法 |
| CN116278242A (zh) * | 2023-03-20 | 2023-06-23 | 瓷金科技(深圳)有限公司 | 多层陶瓷管壳及其生坯以及两者的制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1065345A (ja) * | 1996-08-20 | 1998-03-06 | Hitachi Ltd | 多層セラミック基板とその製造方法及びパターン検査装置 |
| JP2002257858A (ja) * | 2001-02-28 | 2002-09-11 | Ibiden Co Ltd | プローブカード |
| JP2003060358A (ja) * | 2001-08-10 | 2003-02-28 | Ngk Spark Plug Co Ltd | セラミック配線基板の製造方法 |
| US20060086703A1 (en) | 2004-08-18 | 2006-04-27 | Ling Liu | System and method for singulating a substrate |
| JP2009074823A (ja) | 2007-09-19 | 2009-04-09 | Ngk Spark Plug Co Ltd | 電子部品検査装置用配線基板およびその製造方法 |
| JP4542587B2 (ja) | 2008-02-04 | 2010-09-15 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
| JP5449719B2 (ja) * | 2008-08-11 | 2014-03-19 | 日本特殊陶業株式会社 | 配線基板、ｉｃ電気特性検査用配線基板、及び配線基板の製造方法 |
-
2011
- 2011-04-01 JP JP2011082161A patent/JP5670806B2/ja active Active
-
2012
- 2012-03-30 US US13/436,005 patent/US9049786B2/en active Active
- 2012-03-30 KR KR1020120033148A patent/KR101555405B1/ko active Active
- 2012-04-01 CN CN201210094793.9A patent/CN102740590B/zh active Active
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