JP2012174896A5 - - Google Patents
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- Publication number
- JP2012174896A5 JP2012174896A5 JP2011035751A JP2011035751A JP2012174896A5 JP 2012174896 A5 JP2012174896 A5 JP 2012174896A5 JP 2011035751 A JP2011035751 A JP 2011035751A JP 2011035751 A JP2011035751 A JP 2011035751A JP 2012174896 A5 JP2012174896 A5 JP 2012174896A5
- Authority
- JP
- Japan
- Prior art keywords
- defect
- image
- silicon carbide
- inspection apparatus
- carbide substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000007547 defect Effects 0.000 claims 20
- 238000007689 inspection Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 230000003287 optical effect Effects 0.000 claims 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims 6
- 238000005286 illumination Methods 0.000 claims 4
- 238000003384 imaging method Methods 0.000 claims 2
- 244000000626 Daucus carota Species 0.000 claims 1
- 235000002767 Daucus carota Nutrition 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000003763 carbonization Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011035751A JP5725501B2 (ja) | 2011-02-22 | 2011-02-22 | 検査装置 |
| US13/073,130 US20110242312A1 (en) | 2010-03-30 | 2011-03-28 | Inspection system and inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011035751A JP5725501B2 (ja) | 2011-02-22 | 2011-02-22 | 検査装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012106055A Division JP5114808B2 (ja) | 2012-05-07 | 2012-05-07 | 検査装置及び欠陥検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012174896A JP2012174896A (ja) | 2012-09-10 |
| JP2012174896A5 true JP2012174896A5 (enExample) | 2014-03-27 |
| JP5725501B2 JP5725501B2 (ja) | 2015-05-27 |
Family
ID=46977518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011035751A Active JP5725501B2 (ja) | 2010-03-30 | 2011-02-22 | 検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5725501B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9551672B2 (en) | 2013-12-18 | 2017-01-24 | Lasertec Corporation | Defect classifying method and optical inspection apparatus for silicon carbide substrate |
| CN108701623B (zh) * | 2015-11-05 | 2022-10-04 | 米朋克斯株式会社 | 基板评价方法 |
| US10429315B2 (en) | 2017-07-18 | 2019-10-01 | Samsung Electronics Co., Ltd. | Imaging apparatus and imaging method |
| CN108169228A (zh) * | 2017-11-28 | 2018-06-15 | 中国工程物理研究院电子工程研究所 | 一种准确辨别碳化硅单晶位错类型的方法 |
| US11017520B2 (en) * | 2018-09-04 | 2021-05-25 | Kla Corporation | Multi-wavelength interferometry for defect classification |
| JP7056515B2 (ja) * | 2018-10-30 | 2022-04-19 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| JP6914990B2 (ja) * | 2019-05-09 | 2021-08-04 | アンリツ株式会社 | 物品検査装置及び物品検査方法 |
| JP7750648B2 (ja) * | 2020-10-23 | 2025-10-07 | レーザーテック株式会社 | 測定装置、及び測定方法 |
| CN112446857A (zh) * | 2020-11-06 | 2021-03-05 | 长江存储科技有限责任公司 | 缺陷图像自动分类标记系统、建立方法及分类标记方法 |
| JP7669772B2 (ja) * | 2021-04-15 | 2025-04-30 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
| CN114280009A (zh) * | 2021-12-31 | 2022-04-05 | 北京天科合达半导体股份有限公司 | 一种碳化硅晶片的综合缺陷检测装置及方法 |
| JP2024177762A (ja) * | 2023-06-12 | 2024-12-24 | 浜松ホトニクス株式会社 | 干渉観察装置及び干渉観察方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514779B1 (en) * | 2001-10-17 | 2003-02-04 | Cree, Inc. | Large area silicon carbide devices and manufacturing methods therefor |
| JP4357355B2 (ja) * | 2004-05-07 | 2009-11-04 | 株式会社日立ハイテクノロジーズ | パターン検査方法及びその装置 |
| US7554656B2 (en) * | 2005-10-06 | 2009-06-30 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of a wafer |
-
2011
- 2011-02-22 JP JP2011035751A patent/JP5725501B2/ja active Active
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