JP2012169268A - 絶縁フィルム構造体及びその製造方法 - Google Patents
絶縁フィルム構造体及びその製造方法 Download PDFInfo
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- JP2012169268A JP2012169268A JP2012017990A JP2012017990A JP2012169268A JP 2012169268 A JP2012169268 A JP 2012169268A JP 2012017990 A JP2012017990 A JP 2012017990A JP 2012017990 A JP2012017990 A JP 2012017990A JP 2012169268 A JP2012169268 A JP 2012169268A
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- B32—LAYERED PRODUCTS
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/62—Insulating-layers or insulating-films on metal bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/04—Treating the surfaces, e.g. applying coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
- Y10T428/31797—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31913—Monoolefin polymer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
Abstract
【解決手段】絶縁フィルム構造体は、絶縁フィルム層10及びキャリアフィルム層20から成る2層構造を有し、キャリアフィルム層20で、絶縁フィルム層10に当接する一面には離型層21が形成され、その他面には表面処理層22が形成される
【選択図】図3
Description
20 キャリアフィルム層
21 離型層
22 表面処理層
Claims (12)
- 絶縁フィルム層及びキャリアフィルム層から成る2層構造を有し、
前記キャリアフィルム層において、前記絶縁フィルム層に当接する一面には離型層が形成され、その他面には表面処理層が形成される絶縁フィルム構造体。 - 前記キャリアフィルム層に形成された前記離型層の離型力が、30gf〜1000gfである請求項1に記載の絶縁フィルム構造体。
- 前記キャリアフィルム層に形成された前記表面処理層の表面は、粗さ処理される請求項1に記載の絶縁フィルム構造体。
- 前記キャリアフィルム層に形成された前記表面処理層の合紙力が、34dyne〜40dyneである請求項1に記載の絶縁フィルム構造体。
- 前記キャリアフィルム層に形成された前記表面処理層の表面抵抗が、1010Ω〜1012Ωである請求項1に記載の絶縁フィルム構造体。
- 前記キャリアフィルム層は、PET、PP及びPEのうちの少なくともいずれか一つによって形成される請求項1に記載の絶縁フィルム構造体。
- 前記絶縁フィルムは、B−stageまたはC−stageエポキシ樹脂によって形成される請求項1に記載の絶縁フィルム構造体。
- キャリアフィルム層の一面に離型層を形成する工程と、
前記キャリアフィルム層の他面に表面処理層を形成する工程と、
前記離型層の形成された前記キャリアフィルム層に絶縁フィルムをキャスティングする工程と、
を含む絶縁フィルム構造体の製造方法。 - 前記離型層は、シリコン離型処理及びフッ素離型処理のうちのいずれか一つによって形成される請求項8に記載の絶縁フィルム構造体の製造方法。
- 前記表面処理層は、メタロセン触媒重合を用いるポリオレフィン樹脂及びPE(ポリエチレン)−PP(ポリプロピレン)のブロック共重合体のうちのいずれか一つによって形成される請求項8に記載の絶縁フィルム構造体の製造方法。
- 前記表面処理層に対して粗さ処理を施す工程を、さらに含む請求項8に記載の絶縁フィルム構造体の製造方法。
- 前記粗さ処理は、前記キャリアフィルム層に対して物理的処理及び化学的処理を施す工程を含む請求項11に記載の絶縁フィルム構造体の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0012777 | 2011-02-14 | ||
KR1020110012777A KR101175892B1 (ko) | 2011-02-14 | 2011-02-14 | 절연 필름 구조체 및 이의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012169268A true JP2012169268A (ja) | 2012-09-06 |
JP5475029B2 JP5475029B2 (ja) | 2014-04-16 |
Family
ID=46621859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012017990A Expired - Fee Related JP5475029B2 (ja) | 2011-02-14 | 2012-01-31 | 絶縁フィルム構造体及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20120207972A1 (ja) |
JP (1) | JP5475029B2 (ja) |
KR (1) | KR101175892B1 (ja) |
CN (1) | CN102637496A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101930398B1 (ko) * | 2017-11-07 | 2018-12-18 | 주식회사 넥스플러스 | 쉴드캔 제조방법 |
KR101952319B1 (ko) * | 2017-11-07 | 2019-02-26 | 주식회사 넥스플러스 | 쉴드캔 제조방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10194537B2 (en) | 2013-03-25 | 2019-01-29 | International Business Machines Corporation | Minimizing printed circuit board warpage |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002003702A (ja) * | 2000-06-21 | 2002-01-09 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、絶縁フィルム、樹脂付き金属箔及び多層プリント配線板 |
JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |
Family Cites Families (11)
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US5531393A (en) * | 1992-05-19 | 1996-07-02 | Salzsauler; Donald J. | Stretch film |
US6096420A (en) * | 1998-01-30 | 2000-08-01 | Tredegar Corporation | Thin plastic film |
JP2000006320A (ja) | 1998-06-25 | 2000-01-11 | Teijin Ltd | 離形フィルムならびにそれを用いた樹脂シート成形用キャリヤーフィルムおよび樹脂シート保護用フィルム |
JP2001106869A (ja) | 1999-10-01 | 2001-04-17 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及びプリント配線板用絶縁樹脂シート |
JP2002064275A (ja) | 2000-08-17 | 2002-02-28 | Sumitomo Bakelite Co Ltd | 多層プリント配線板用絶縁樹脂フィルム |
JP2003045234A (ja) * | 2001-07-26 | 2003-02-14 | Dainippon Printing Co Ltd | 透明導電性フィルム |
JP3889700B2 (ja) * | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
JP2005521209A (ja) * | 2002-03-20 | 2005-07-14 | 富士写真フイルム株式会社 | 有機薄膜素子及びその製造方法 |
JP4445448B2 (ja) * | 2005-09-16 | 2010-04-07 | 株式会社東芝 | 回路基板の製造方法 |
JP2008084701A (ja) * | 2006-09-27 | 2008-04-10 | Fujifilm Corp | 電子デバイス用転写材料、電子デバイスの縁層形成方法及び隔壁形成方法、並びに発光素子 |
KR100971172B1 (ko) * | 2008-02-26 | 2010-07-20 | (주)켐텍 | 표면처리된 절연필름 및 제조방법 |
-
2011
- 2011-02-14 KR KR1020110012777A patent/KR101175892B1/ko not_active IP Right Cessation
-
2012
- 2012-01-17 US US13/351,871 patent/US20120207972A1/en not_active Abandoned
- 2012-01-31 JP JP2012017990A patent/JP5475029B2/ja not_active Expired - Fee Related
- 2012-02-13 CN CN2012100316895A patent/CN102637496A/zh active Pending
-
2013
- 2013-03-18 US US13/845,452 patent/US20130216697A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002003702A (ja) * | 2000-06-21 | 2002-01-09 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、絶縁フィルム、樹脂付き金属箔及び多層プリント配線板 |
JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101930398B1 (ko) * | 2017-11-07 | 2018-12-18 | 주식회사 넥스플러스 | 쉴드캔 제조방법 |
KR101952319B1 (ko) * | 2017-11-07 | 2019-02-26 | 주식회사 넥스플러스 | 쉴드캔 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
CN102637496A (zh) | 2012-08-15 |
KR101175892B1 (ko) | 2012-08-23 |
US20130216697A1 (en) | 2013-08-22 |
JP5475029B2 (ja) | 2014-04-16 |
US20120207972A1 (en) | 2012-08-16 |
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