JP2012151093A - 銅含有組成物、金属銅膜の製造方法、および金属銅膜 - Google Patents

銅含有組成物、金属銅膜の製造方法、および金属銅膜 Download PDF

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Publication number
JP2012151093A
JP2012151093A JP2011260254A JP2011260254A JP2012151093A JP 2012151093 A JP2012151093 A JP 2012151093A JP 2011260254 A JP2011260254 A JP 2011260254A JP 2011260254 A JP2011260254 A JP 2011260254A JP 2012151093 A JP2012151093 A JP 2012151093A
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Japan
Prior art keywords
copper
metal
binder resin
containing composition
producing
Prior art date
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Pending
Application number
JP2011260254A
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English (en)
Japanese (ja)
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JP2012151093A5 (https=
Inventor
Tomoyuki Kinoshita
智之 木下
Kensho Oshima
憲昭 大島
Takahiro Kawabata
貴裕 川畑
Satoru Yamakawa
哲 山川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagami Chemical Research Institute
Tosoh Corp
Original Assignee
Sagami Chemical Research Institute
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sagami Chemical Research Institute, Tosoh Corp filed Critical Sagami Chemical Research Institute
Priority to JP2011260254A priority Critical patent/JP2012151093A/ja
Publication of JP2012151093A publication Critical patent/JP2012151093A/ja
Publication of JP2012151093A5 publication Critical patent/JP2012151093A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

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  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2011260254A 2010-12-28 2011-11-29 銅含有組成物、金属銅膜の製造方法、および金属銅膜 Pending JP2012151093A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011260254A JP2012151093A (ja) 2010-12-28 2011-11-29 銅含有組成物、金属銅膜の製造方法、および金属銅膜

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010292582 2010-12-28
JP2010292582 2010-12-28
JP2011260254A JP2012151093A (ja) 2010-12-28 2011-11-29 銅含有組成物、金属銅膜の製造方法、および金属銅膜

Publications (2)

Publication Number Publication Date
JP2012151093A true JP2012151093A (ja) 2012-08-09
JP2012151093A5 JP2012151093A5 (https=) 2015-01-22

Family

ID=46382987

Family Applications (1)

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JP2011260254A Pending JP2012151093A (ja) 2010-12-28 2011-11-29 銅含有組成物、金属銅膜の製造方法、および金属銅膜

Country Status (3)

Country Link
JP (1) JP2012151093A (https=)
TW (1) TW201241840A (https=)
WO (1) WO2012090881A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014119498A1 (ja) * 2013-02-04 2014-08-07 富士フイルム株式会社 導電膜形成用組成物、導電膜の製造方法
WO2014157303A1 (ja) * 2013-03-29 2014-10-02 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
WO2014156326A1 (ja) * 2013-03-29 2014-10-02 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP2016079439A (ja) * 2014-10-14 2016-05-16 四国化成工業株式会社 銅被膜形成剤およびその利用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5993812B2 (ja) * 2013-07-10 2016-09-14 富士フイルム株式会社 導電膜の製造方法
WO2016121668A1 (ja) * 2015-01-29 2016-08-04 ハリマ化成株式会社 導電性ペースト

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060319A (ja) * 1996-08-22 1998-03-03 Asahi Chem Ind Co Ltd 導電性ペースト組成物及びそれを用いた配線基板
JP2010121206A (ja) * 2008-10-22 2010-06-03 Tosoh Corp 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1087994A (ja) * 1996-09-10 1998-04-07 Polymertech Kk 複合導電性高分子および組成物ならびにその製造方法
TWI251018B (en) * 2002-04-10 2006-03-11 Fujikura Ltd Electroconductive composition, electroconductive coating and method of producing the electroconductive coating
JP4840097B2 (ja) * 2006-11-20 2011-12-21 住友ベークライト株式会社 導電性銅ペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060319A (ja) * 1996-08-22 1998-03-03 Asahi Chem Ind Co Ltd 導電性ペースト組成物及びそれを用いた配線基板
JP2010121206A (ja) * 2008-10-22 2010-06-03 Tosoh Corp 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN6016015862; '高機能フレキシブルプリント配線板用接着剤　アロンマイティＡＳ-６０' 技術情報 , 20160419, 東亞合成株式会社 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014119498A1 (ja) * 2013-02-04 2014-08-07 富士フイルム株式会社 導電膜形成用組成物、導電膜の製造方法
JP2014148633A (ja) * 2013-02-04 2014-08-21 Fujifilm Corp 導電膜形成用組成物、導電膜の製造方法
US10053587B2 (en) 2013-02-04 2018-08-21 Fujifilm Corporation Conductive film-forming composition and conductive film producing method
WO2014157303A1 (ja) * 2013-03-29 2014-10-02 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
WO2014156326A1 (ja) * 2013-03-29 2014-10-02 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP2016079439A (ja) * 2014-10-14 2016-05-16 四国化成工業株式会社 銅被膜形成剤およびその利用

Also Published As

Publication number Publication date
WO2012090881A1 (ja) 2012-07-05
TW201241840A (en) 2012-10-16

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