JP2012151093A5 - - Google Patents
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- Publication number
- JP2012151093A5 JP2012151093A5 JP2011260254A JP2011260254A JP2012151093A5 JP 2012151093 A5 JP2012151093 A5 JP 2012151093A5 JP 2011260254 A JP2011260254 A JP 2011260254A JP 2011260254 A JP2011260254 A JP 2011260254A JP 2012151093 A5 JP2012151093 A5 JP 2012151093A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- oxide
- containing composition
- group viii
- metal catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 21
- 229910052802 copper Inorganic materials 0.000 claims 21
- 239000010949 copper Substances 0.000 claims 21
- 239000002184 metal Substances 0.000 claims 17
- 229910052751 metal Inorganic materials 0.000 claims 17
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 12
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims 8
- 239000003054 catalyst Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000005749 Copper compound Substances 0.000 claims 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 6
- 150000001880 copper compounds Chemical class 0.000 claims 6
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims 6
- 239000011230 binding agent Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 4
- NQZFAUXPNWSLBI-UHFFFAOYSA-N carbon monoxide;ruthenium Chemical group [Ru].[Ru].[Ru].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] NQZFAUXPNWSLBI-UHFFFAOYSA-N 0.000 claims 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims 2
- 239000005751 Copper oxide Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 claims 2
- 150000004699 copper complex Chemical class 0.000 claims 2
- 229910000431 copper oxide Inorganic materials 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 claims 2
- 235000011187 glycerol Nutrition 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 2
- 239000012528 membrane Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 claims 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011260254A JP2012151093A (ja) | 2010-12-28 | 2011-11-29 | 銅含有組成物、金属銅膜の製造方法、および金属銅膜 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010292582 | 2010-12-28 | ||
| JP2010292582 | 2010-12-28 | ||
| JP2011260254A JP2012151093A (ja) | 2010-12-28 | 2011-11-29 | 銅含有組成物、金属銅膜の製造方法、および金属銅膜 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012151093A JP2012151093A (ja) | 2012-08-09 |
| JP2012151093A5 true JP2012151093A5 (https=) | 2015-01-22 |
Family
ID=46382987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011260254A Pending JP2012151093A (ja) | 2010-12-28 | 2011-11-29 | 銅含有組成物、金属銅膜の製造方法、および金属銅膜 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2012151093A (https=) |
| TW (1) | TW201241840A (https=) |
| WO (1) | WO2012090881A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5972187B2 (ja) * | 2013-02-04 | 2016-08-17 | 富士フイルム株式会社 | 導電膜形成用組成物、導電膜の製造方法 |
| JP2014196427A (ja) * | 2013-03-29 | 2014-10-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| JP2014196384A (ja) * | 2013-03-29 | 2014-10-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| JP5993812B2 (ja) * | 2013-07-10 | 2016-09-14 | 富士フイルム株式会社 | 導電膜の製造方法 |
| JP2016079439A (ja) * | 2014-10-14 | 2016-05-16 | 四国化成工業株式会社 | 銅被膜形成剤およびその利用 |
| WO2016121668A1 (ja) * | 2015-01-29 | 2016-08-04 | ハリマ化成株式会社 | 導電性ペースト |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1060319A (ja) * | 1996-08-22 | 1998-03-03 | Asahi Chem Ind Co Ltd | 導電性ペースト組成物及びそれを用いた配線基板 |
| JPH1087994A (ja) * | 1996-09-10 | 1998-04-07 | Polymertech Kk | 複合導電性高分子および組成物ならびにその製造方法 |
| TWI251018B (en) * | 2002-04-10 | 2006-03-11 | Fujikura Ltd | Electroconductive composition, electroconductive coating and method of producing the electroconductive coating |
| JP4840097B2 (ja) * | 2006-11-20 | 2011-12-21 | 住友ベークライト株式会社 | 導電性銅ペースト |
| JP5778382B2 (ja) * | 2008-10-22 | 2015-09-16 | 東ソー株式会社 | 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法 |
-
2011
- 2011-11-29 JP JP2011260254A patent/JP2012151093A/ja active Pending
- 2011-12-22 WO PCT/JP2011/079925 patent/WO2012090881A1/ja not_active Ceased
- 2011-12-26 TW TW100148606A patent/TW201241840A/zh unknown
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