JP2012140649A - めっき液中から不純物を除去する方法 - Google Patents
めっき液中から不純物を除去する方法 Download PDFInfo
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- JP2012140649A JP2012140649A JP2010292150A JP2010292150A JP2012140649A JP 2012140649 A JP2012140649 A JP 2012140649A JP 2010292150 A JP2010292150 A JP 2010292150A JP 2010292150 A JP2010292150 A JP 2010292150A JP 2012140649 A JP2012140649 A JP 2012140649A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
【解決手段】チオ尿素又はチオ尿素化合物を含有する無電解スズめっき液を用いて銅又は銅合金に無電解スズめっきを行った後、前記無電解スズめっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加して析出物を生成させることにより、めっき液中から不純物を除去する。
【選択図】なし
Description
以下の組成の無電解スズめっき液(基本浴1)を調製した。
ホウフッ化スズ (Sn2+として) 30g/L
メタンスルホン酸 50g/L
次亜リン酸 15g/L
チオ尿素 100g/L
ノニオン系界面活性剤 30g/L
上記基本浴1にベンゼンスルホン酸を60g/L添加した以外は実施例1と同様の操作を行い、銅濃度を測定した。測定した銅濃度は6.6g/Lであった。
上記基本浴1に対し、ベンゼンスルホン酸を加えない(比較例1)か、表1に記載の化合物を30g/L加えたもの(比較例2〜5)について、実施例1と同様の操作を行った。結果を表1に示す。なお、比較例1〜5はいずれも沈殿が析出しなかったため、銅濃度測定は比較例1のみ行った。
めっき浴の組成を実施例1から変更し、以下の組成の無電解スズめっき液(基本浴2)を作製した。
メタンスルホン酸スズ (Sn2+として) 30g/L
メタンスルホン酸 50g/L
次亜リン酸 15g/L
チオ尿素 100g/L
ノニオン系界面活性剤 30g/L
ベンゼンスルホン酸を添加し不純物を除去した後のめっき液の性能確認試験を行った。めっき浴として、実施例1で使用した基本浴1を準備した。
Claims (6)
- チオ尿素又はチオ尿素化合物を含有するスズめっき液に、ベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加して析出物を生成させることにより、めっき液中から不純物を除去する方法。
- チオ尿素又はチオ尿素化合物を含有する無電解スズめっき液を用いて銅又は銅合金に無電解スズめっきを行った後、前記無電解スズめっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加し、生成する析出物を除去する、めっき液の再生方法。
- チオ尿素又はチオ尿素化合物を含むスズめっき液を用いて無電解スズめっき皮膜を形成する方法であって、前記無電解スズめっきを行うめっき槽からめっき液の一部又は全部を固液分離装置を経由して前記めっき槽に循環させるとともに、前記めっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加し、生成する析出物を前記固液分離装置により捕捉除去する、めっき皮膜の形成方法。
- 無電解めっきを行う本槽、析出物を形成する析出槽、本槽と析出槽との間を無電解めっき液が循環可能となるように接続する循環配管、及び析出槽から本槽への間に設置される固液分離装置を有する複槽型めっき装置を用い、チオ尿素又はチオ尿素化合物を含有するスズめっき液を用いて被めっき物に無電解めっきを行う方法であって、前記析出槽中のめっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加する工程、及び生成する析出物を固液分離装置を用いて捕捉する工程を有する、めっき方法。
- めっき液を貯留し無電解めっきを行うめっき槽、めっき液の一部又は全部を循環可能となるようにめっき槽に接続する循環配管及びめっき液の循環経路に設置される固液分離装置を有する単槽型めっき装置を用い、チオ尿素又はチオ尿素化合物を含有するスズめっき液を用いて被めっき物に無電解めっきを行う方法であって、被めっき物をめっき槽中のめっき液に浸漬する工程、前記めっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加する工程、生成する析出物を前記固液分離装置を用いてめっき液から除去する工程を有する、めっき方法。
- チオ尿素又はチオ尿素化合物を含有する銅又は銅合金用の無電解めっき液の管理方法であって、前記めっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加し、析出物を生成させることによりめっき液中の銅イオン濃度を減少させる、めっき液の管理方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010292150A JP5715411B2 (ja) | 2010-12-28 | 2010-12-28 | めっき液中から不純物を除去する方法 |
EP11195167.9A EP2471977B1 (en) | 2010-12-28 | 2011-12-22 | Method for removing impurities from plating solution |
KR1020110145049A KR101797517B1 (ko) | 2010-12-28 | 2011-12-28 | 도금액으로부터 불순물을 제거하는 방법 |
TW100149133A TWI588291B (zh) | 2010-12-28 | 2011-12-28 | 從鍍覆溶液移除雜質之方法 |
CN201110463300.XA CN102560570B (zh) | 2010-12-28 | 2011-12-28 | 从镀液中去除杂质的方法 |
US13/338,483 US20120164341A1 (en) | 2010-12-28 | 2011-12-28 | Method for removing impurities from plating solutions |
Applications Claiming Priority (1)
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---|---|---|---|
JP2010292150A JP5715411B2 (ja) | 2010-12-28 | 2010-12-28 | めっき液中から不純物を除去する方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012140649A true JP2012140649A (ja) | 2012-07-26 |
JP5715411B2 JP5715411B2 (ja) | 2015-05-07 |
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Family Applications (1)
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JP2010292150A Expired - Fee Related JP5715411B2 (ja) | 2010-12-28 | 2010-12-28 | めっき液中から不純物を除去する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120164341A1 (ja) |
EP (1) | EP2471977B1 (ja) |
JP (1) | JP5715411B2 (ja) |
KR (1) | KR101797517B1 (ja) |
CN (1) | CN102560570B (ja) |
TW (1) | TWI588291B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013060638A (ja) * | 2011-09-14 | 2013-04-04 | Rohm & Haas Denshi Zairyo Kk | めっき液中から不純物を除去する方法 |
KR20160133403A (ko) | 2014-03-06 | 2016-11-22 | 미쓰비시 마테리알 가부시키가이샤 | 산화 제 1 주석의 제조 방법, 산화 제 1 주석, Sn 도금액의 제조 방법 및 Sn 도금액의 불순물 제거 방법 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9404194B2 (en) | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
JP5830242B2 (ja) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
US9534308B2 (en) | 2012-06-05 | 2017-01-03 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
CN112135932A (zh) * | 2018-05-09 | 2020-12-25 | 应用材料公司 | 用于去除电镀系统内的污染物的系统及方法 |
CN109546191B (zh) * | 2018-11-07 | 2021-06-18 | 大连理工大学 | 一种混合基质型阴离子膜及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07268638A (ja) * | 1994-03-28 | 1995-10-17 | Hitachi Ltd | 無電解めっき方法 |
JP2004068056A (ja) * | 2002-08-02 | 2004-03-04 | Ishihara Chem Co Ltd | 無電解スズメッキ浴 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0830274B2 (ja) | 1991-03-01 | 1996-03-27 | 上村工業株式会社 | 無電解錫、鉛又はそれらの合金めっき浴中の銅イオン濃度の分析方法 |
JP2525521B2 (ja) * | 1991-06-25 | 1996-08-21 | 日本リーロナール株式会社 | 無電解スズ―鉛合金めっき浴 |
JPH0522540A (ja) | 1991-07-15 | 1993-01-29 | Murata Mach Ltd | メールボツクスを有したフアクシミリ装置 |
CA2083196C (en) | 1991-11-27 | 1998-02-17 | Randal D. King | Process for extending the life of a displacement plating bath |
JP3030534B2 (ja) * | 1994-09-07 | 2000-04-10 | 日本マクダーミッド株式会社 | 錫系合金めっき浴の再生方法 |
AU2792697A (en) * | 1996-06-05 | 1998-01-05 | Sumitomo Light Metal Industries, Ltd. | Internally tin-plated copper pipe manufacturing method |
DE19719020A1 (de) | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
DE19954613A1 (de) * | 1999-11-12 | 2001-05-17 | Enthone Omi Deutschland Gmbh | Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen |
US6821323B1 (en) * | 1999-11-12 | 2004-11-23 | Enthone Inc. | Process for the non-galvanic tin plating of copper or copper alloys |
GB0106131D0 (en) * | 2001-03-13 | 2001-05-02 | Macdermid Plc | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
JP2002317275A (ja) | 2001-04-17 | 2002-10-31 | Toto Ltd | 無電解スズめっき液の長寿命化方法 |
US6562221B2 (en) * | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
JP2004002970A (ja) * | 2002-03-05 | 2004-01-08 | Shipley Co Llc | スズ又はスズ合金電気メッキ浴液における酸化によるスズ損失の制限 |
US20080149884A1 (en) * | 2006-12-21 | 2008-06-26 | Junaid Ahmed Siddiqui | Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
CN101624714B (zh) * | 2009-08-18 | 2010-12-29 | 杜强 | 含有机添加剂的铜锡锌镀液及利用该镀液进行电镀的工艺 |
JP5830242B2 (ja) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
-
2010
- 2010-12-28 JP JP2010292150A patent/JP5715411B2/ja not_active Expired - Fee Related
-
2011
- 2011-12-22 EP EP11195167.9A patent/EP2471977B1/en not_active Not-in-force
- 2011-12-28 KR KR1020110145049A patent/KR101797517B1/ko active IP Right Grant
- 2011-12-28 TW TW100149133A patent/TWI588291B/zh not_active IP Right Cessation
- 2011-12-28 US US13/338,483 patent/US20120164341A1/en not_active Abandoned
- 2011-12-28 CN CN201110463300.XA patent/CN102560570B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07268638A (ja) * | 1994-03-28 | 1995-10-17 | Hitachi Ltd | 無電解めっき方法 |
JP2004068056A (ja) * | 2002-08-02 | 2004-03-04 | Ishihara Chem Co Ltd | 無電解スズメッキ浴 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013060638A (ja) * | 2011-09-14 | 2013-04-04 | Rohm & Haas Denshi Zairyo Kk | めっき液中から不純物を除去する方法 |
KR20160133403A (ko) | 2014-03-06 | 2016-11-22 | 미쓰비시 마테리알 가부시키가이샤 | 산화 제 1 주석의 제조 방법, 산화 제 1 주석, Sn 도금액의 제조 방법 및 Sn 도금액의 불순물 제거 방법 |
US10184046B2 (en) | 2014-03-06 | 2019-01-22 | Mitsubishi Materials Corporation | Method of producing stannous oxide, stannous oxide, method of Sn plating solution, and method of removing impurities from Sn plating solution |
Also Published As
Publication number | Publication date |
---|---|
JP5715411B2 (ja) | 2015-05-07 |
CN102560570B (zh) | 2016-05-04 |
KR101797517B1 (ko) | 2017-11-15 |
KR20120075438A (ko) | 2012-07-06 |
TW201243103A (en) | 2012-11-01 |
EP2471977A2 (en) | 2012-07-04 |
US20120164341A1 (en) | 2012-06-28 |
TWI588291B (zh) | 2017-06-21 |
EP2471977A3 (en) | 2012-08-08 |
EP2471977B1 (en) | 2017-01-25 |
CN102560570A (zh) | 2012-07-11 |
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