JP2012134441A - ダミー領域を含む半導体パッケージ基板 - Google Patents
ダミー領域を含む半導体パッケージ基板 Download PDFInfo
- Publication number
- JP2012134441A JP2012134441A JP2011113108A JP2011113108A JP2012134441A JP 2012134441 A JP2012134441 A JP 2012134441A JP 2011113108 A JP2011113108 A JP 2011113108A JP 2011113108 A JP2011113108 A JP 2011113108A JP 2012134441 A JP2012134441 A JP 2012134441A
- Authority
- JP
- Japan
- Prior art keywords
- metal pattern
- semiconductor package
- package substrate
- present
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100131624A KR101119305B1 (ko) | 2010-12-21 | 2010-12-21 | 더미영역을 포함하는 반도체 패키지 기판 |
KR10-2010-0131624 | 2010-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012134441A true JP2012134441A (ja) | 2012-07-12 |
Family
ID=46141419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011113108A Pending JP2012134441A (ja) | 2010-12-21 | 2011-05-20 | ダミー領域を含む半導体パッケージ基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2012134441A (ko) |
KR (1) | KR101119305B1 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168848A (ja) * | 2001-11-30 | 2003-06-13 | Nec Kansai Ltd | 配線基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4173346B2 (ja) | 2001-12-14 | 2008-10-29 | 株式会社ルネサステクノロジ | 半導体装置 |
KR100722597B1 (ko) | 2005-07-04 | 2007-05-28 | 삼성전기주식회사 | 구리 패턴이 형성된 더미 영역을 구비한 반도체 패키지기판 |
-
2010
- 2010-12-21 KR KR1020100131624A patent/KR101119305B1/ko active IP Right Grant
-
2011
- 2011-05-20 JP JP2011113108A patent/JP2012134441A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168848A (ja) * | 2001-11-30 | 2003-06-13 | Nec Kansai Ltd | 配線基板 |
Also Published As
Publication number | Publication date |
---|---|
KR101119305B1 (ko) | 2012-03-16 |
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