JP2012134441A - ダミー領域を含む半導体パッケージ基板 - Google Patents

ダミー領域を含む半導体パッケージ基板 Download PDF

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Publication number
JP2012134441A
JP2012134441A JP2011113108A JP2011113108A JP2012134441A JP 2012134441 A JP2012134441 A JP 2012134441A JP 2011113108 A JP2011113108 A JP 2011113108A JP 2011113108 A JP2011113108 A JP 2011113108A JP 2012134441 A JP2012134441 A JP 2012134441A
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JP
Japan
Prior art keywords
metal pattern
semiconductor package
package substrate
present
pattern
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Pending
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JP2011113108A
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English (en)
Japanese (ja)
Inventor
Ze-Jun Yang
ジュン ヤン・ゼ
Hyun-Kyun Kim
キュン キム・ヒュン
Hyun-Won Kang
ウォン カン・ヒュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2012134441A publication Critical patent/JP2012134441A/ja
Pending legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing & Machinery (AREA)
JP2011113108A 2010-12-21 2011-05-20 ダミー領域を含む半導体パッケージ基板 Pending JP2012134441A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100131624A KR101119305B1 (ko) 2010-12-21 2010-12-21 더미영역을 포함하는 반도체 패키지 기판
KR10-2010-0131624 2010-12-21

Publications (1)

Publication Number Publication Date
JP2012134441A true JP2012134441A (ja) 2012-07-12

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ID=46141419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011113108A Pending JP2012134441A (ja) 2010-12-21 2011-05-20 ダミー領域を含む半導体パッケージ基板

Country Status (2)

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JP (1) JP2012134441A (ko)
KR (1) KR101119305B1 (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168848A (ja) * 2001-11-30 2003-06-13 Nec Kansai Ltd 配線基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4173346B2 (ja) 2001-12-14 2008-10-29 株式会社ルネサステクノロジ 半導体装置
KR100722597B1 (ko) 2005-07-04 2007-05-28 삼성전기주식회사 구리 패턴이 형성된 더미 영역을 구비한 반도체 패키지기판

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168848A (ja) * 2001-11-30 2003-06-13 Nec Kansai Ltd 配線基板

Also Published As

Publication number Publication date
KR101119305B1 (ko) 2012-03-16

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