JP2012114400A5 - - Google Patents

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Publication number
JP2012114400A5
JP2012114400A5 JP2011117724A JP2011117724A JP2012114400A5 JP 2012114400 A5 JP2012114400 A5 JP 2012114400A5 JP 2011117724 A JP2011117724 A JP 2011117724A JP 2011117724 A JP2011117724 A JP 2011117724A JP 2012114400 A5 JP2012114400 A5 JP 2012114400A5
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JP
Japan
Prior art keywords
substrate
hole
manufacturing
wiring board
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011117724A
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English (en)
Japanese (ja)
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JP5608605B2 (ja
JP2012114400A (ja
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Priority to JP2011117724A priority Critical patent/JP5608605B2/ja
Priority claimed from JP2011117724A external-priority patent/JP5608605B2/ja
Publication of JP2012114400A publication Critical patent/JP2012114400A/ja
Publication of JP2012114400A5 publication Critical patent/JP2012114400A5/ja
Application granted granted Critical
Publication of JP5608605B2 publication Critical patent/JP5608605B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011117724A 2010-11-05 2011-05-26 配線基板の製造方法 Expired - Fee Related JP5608605B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011117724A JP5608605B2 (ja) 2010-11-05 2011-05-26 配線基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010248328 2010-11-05
JP2010248328 2010-11-05
JP2011117724A JP5608605B2 (ja) 2010-11-05 2011-05-26 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2012114400A JP2012114400A (ja) 2012-06-14
JP2012114400A5 true JP2012114400A5 (ru) 2014-04-10
JP5608605B2 JP5608605B2 (ja) 2014-10-15

Family

ID=46498251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011117724A Expired - Fee Related JP5608605B2 (ja) 2010-11-05 2011-05-26 配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP5608605B2 (ru)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014069662A1 (ja) 2012-11-05 2014-05-08 大日本印刷株式会社 配線構造体
JP2014236102A (ja) * 2013-05-31 2014-12-15 凸版印刷株式会社 貫通電極付き配線基板、その製造方法及び半導体装置
KR20150049515A (ko) * 2013-10-30 2015-05-08 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
JP2015198093A (ja) * 2014-03-31 2015-11-09 凸版印刷株式会社 インターポーザー、半導体装置、インターポーザーの製造方法、半導体装置の製造方法
EP3128547B1 (en) 2014-03-31 2019-07-17 Toppan Printing Co., Ltd. Interposer and semiconductor device
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
CN105657987B (zh) * 2014-12-03 2019-05-21 北大方正集团有限公司 板材塞孔方法和电路板
KR102039887B1 (ko) * 2017-12-13 2019-12-05 엘비세미콘 주식회사 양면 도금 공정을 이용한 반도체 패키지의 제조방법
JP6828733B2 (ja) * 2018-12-25 2021-02-10 凸版印刷株式会社 インターポーザー、半導体装置、インターポーザーの製造方法、半導体装置の製造方法
KR102442256B1 (ko) * 2020-11-05 2022-09-08 성균관대학교산학협력단 보이드가 없는 실리콘 관통전극의 제조방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232487A (ja) * 1987-03-20 1988-09-28 日本電気株式会社 印刷配線板の製造方法
JPH0423488A (ja) * 1990-05-18 1992-01-27 Hitachi Ltd プリント基板の製造方法
JPH06260757A (ja) * 1993-03-05 1994-09-16 Meikoo:Kk プリント回路板の製造方法
JP2006237431A (ja) * 2005-02-28 2006-09-07 New Japan Radio Co Ltd セラミック基板の製造方法
JP2007095743A (ja) * 2005-09-27 2007-04-12 Matsushita Electric Works Ltd 貫通孔配線及びその製造方法

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