JP2012104627A - プリント基板 - Google Patents

プリント基板 Download PDF

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Publication number
JP2012104627A
JP2012104627A JP2010251463A JP2010251463A JP2012104627A JP 2012104627 A JP2012104627 A JP 2012104627A JP 2010251463 A JP2010251463 A JP 2010251463A JP 2010251463 A JP2010251463 A JP 2010251463A JP 2012104627 A JP2012104627 A JP 2012104627A
Authority
JP
Japan
Prior art keywords
circuit board
substrate
printed circuit
gap
connection hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010251463A
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English (en)
Japanese (ja)
Other versions
JP2012104627A5 (enrdf_load_stackoverflow
Inventor
Hiroshi Takechi
弘 武智
Kiyotaka Urahigashi
清隆 浦東
Yasuharu Kono
康晴 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2010251463A priority Critical patent/JP2012104627A/ja
Publication of JP2012104627A publication Critical patent/JP2012104627A/ja
Publication of JP2012104627A5 publication Critical patent/JP2012104627A5/ja
Pending legal-status Critical Current

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2010251463A 2010-11-10 2010-11-10 プリント基板 Pending JP2012104627A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010251463A JP2012104627A (ja) 2010-11-10 2010-11-10 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010251463A JP2012104627A (ja) 2010-11-10 2010-11-10 プリント基板

Publications (2)

Publication Number Publication Date
JP2012104627A true JP2012104627A (ja) 2012-05-31
JP2012104627A5 JP2012104627A5 (enrdf_load_stackoverflow) 2013-12-05

Family

ID=46394692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010251463A Pending JP2012104627A (ja) 2010-11-10 2010-11-10 プリント基板

Country Status (1)

Country Link
JP (1) JP2012104627A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025220A (ja) * 2014-07-22 2016-02-08 株式会社日立製作所 挿入部品の実装構造体及び回路基板及び電子回路装置の製造方法
CN106102341A (zh) * 2015-04-28 2016-11-09 发那科株式会社 抑制气孔发生的具有引线的电子部件的安装结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098434A (ja) * 1995-06-19 1997-01-10 Nippondenso Co Ltd 電子回路ユニット及びその製造方法
JPH09148705A (ja) * 1995-11-17 1997-06-06 Sony Corp 電子部品を搭載した回路基板
JP2005302929A (ja) * 2004-04-09 2005-10-27 Matsushita Electric Ind Co Ltd ガス抜きプリント基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098434A (ja) * 1995-06-19 1997-01-10 Nippondenso Co Ltd 電子回路ユニット及びその製造方法
JPH09148705A (ja) * 1995-11-17 1997-06-06 Sony Corp 電子部品を搭載した回路基板
JP2005302929A (ja) * 2004-04-09 2005-10-27 Matsushita Electric Ind Co Ltd ガス抜きプリント基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025220A (ja) * 2014-07-22 2016-02-08 株式会社日立製作所 挿入部品の実装構造体及び回路基板及び電子回路装置の製造方法
CN106102341A (zh) * 2015-04-28 2016-11-09 发那科株式会社 抑制气孔发生的具有引线的电子部件的安装结构
JP2016207953A (ja) * 2015-04-28 2016-12-08 ファナック株式会社 ブローホールの発生を抑制するリードを有する電子部品の実装構造
US9730334B2 (en) 2015-04-28 2017-08-08 Fanuc Corporation Mounting structure of leaded electronic component which reduces occurrence of blow hole
CN106102341B (zh) * 2015-04-28 2019-03-08 发那科株式会社 抑制气孔发生的具有引线的电子部件的安装结构
DE102016107597B4 (de) 2015-04-28 2019-08-14 Fanuc Corporation Aufbau zur Anbringung einer mit Leitungen versehenen elektronischen Komponente

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