JP2012054346A - 半導体装置 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 230000015556 catabolic process Effects 0.000 claims abstract description 49
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- 238000000926 separation method Methods 0.000 claims abstract description 9
- 238000002955 isolation Methods 0.000 claims description 73
- 230000005684 electric field Effects 0.000 claims description 45
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 80
- 239000011229 interlayer Substances 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 11
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 108091006146 Channels Proteins 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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Abstract
【解決手段】活性層2に対して埋込絶縁膜4との境界部分にn+型埋込領域6が形成されているSOI基板5を用いて、素子領域8と配線引出部9との間にトレンチ分離部11を配置し、トレンチ分離部11をn-型ドリフト層7と同じもしくはそれより深く、かつ、埋込絶縁膜4から離間するように形成する。このような構成とすれば、SOI基板5に対して予め形成しておけるn+型埋込領域6を介して行うことができる。このため、高耐圧MOSFET1の素子領域8と配線引出部9との電気的な接続を裏面電極などを備える必要がなく、裏面に対する各種プロセスを必要としない簡素な構造の半導体装置により、層間絶縁膜18に大きな電位差が掛かることを抑制できる。また、電位分布が不均一になることを防止でき、高耐圧MOSFET1の耐圧低下を抑制することも可能となる。
【選択図】図1
Description
本発明の第1実施形態について説明する。図1は、本実施形態にかかる高耐圧MOSFETを有する半導体装置が形成されたチップのレベルシフト素子の断面図であり、図2は、図1に示す半導体装置の上面レイアウトを示した模式図である。図1は、図2のA−A’断面に相当している。以下、これらの図を参照して、本実施形態の半導体装置について説明する。
本発明の第2実施形態について説明する。本実施形態は、第1実施形態に対して素子領域8内のシリコン部(具体的にはn-型ドリフト層7)での電界負担を緩和させる構造を採用したものであり、その他に関しては第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第3実施形態について説明する。本実施形態は、第1実施形態に対して素子領域8と配線引出部9との間の絶縁構造(具体的にはトレンチ分離部11)での電界負担を緩和させる構造を採用したものであり、その他に関しては第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第4実施形態について説明する。本実施形態は、第1実施形態に対してトレンチ分離部11を変更したものであり、その他に関しては第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第5実施形態について説明する。本実施形態は、第4実施形態のようにトレンチ分離部11を多重トレンチ構造としつつ、電界分布の均等化を図ったものであり、その他に関しては第4実施形態と同様であるため、第4実施形態と異なる部分についてのみ説明する。
上記各実施形態では、配線引出部9の周囲をトレンチ分離部11が囲むような構造としたが、素子領域8と配線引出部9とを囲むトレンチ分離部10内において、素子領域8と配線引出部9との間にトレンチ分離部11が配置される構造であれば良い。例えば、素子領域8がトレンチ分離部11にて囲まれるような構造であっても構わない。ただし、高耐圧MOSFET1の近辺への配線引出部9の高電圧の影響が少なくできるように、トレンチ分離部11にて高電圧となる配線引出部9側を囲んだ構造にするのが好ましい。
2 活性層
4 埋込絶縁膜
5 SOI基板
6 n+型埋込領域
7 n-型ドリフト層
8 素子領域
9 配線引出部
11 トレンチ分離部
18 層間絶縁膜
19 ソース配線
22 ドレイン配線
30 p+型電界緩和層
40 n+型電界緩和層
50 p型領域
51 配線部
52 抵抗
Claims (6)
- シリコンからなる活性層(2)と支持基板(3)とが埋込絶縁膜(4)を介して接合されたSOI基板(5)を用いて形成され、前記活性層(2)に対して高耐圧トランジスタ(1)が形成された半導体装置であって、
前記SOI基板(5)における前記活性層(2)のうち前記埋込絶縁膜(4)との界面には第1導電型の埋込領域(6)が備えられ、
前記高耐圧トランジスタ(1)は、前記活性層(2)に含まれた第1導電型層(7)を有し、該第1導電型層(7)に互いにトレンチ分離部(11)にて分離された素子領域(8)と配線引出部(9)とを備えた構成とされ、
前記素子領域(8)は、前記第1導電型層(7)の表面側に第1配線(19)を備えていると共に、前記活性層(2)に備えられた前記埋込領域(6)との間において、前記第1導電型層(7)の表裏面を貫通するように電流を流す縦型のトランジスタにて構成され、
前記配線引出部(9)は、前記第1導電型層(7)の表面側に形成された第2配線(22)を有し、前記トレンチ分離部(11)が前記第1導電型層(7)と同じもしくはそれより深くかつ前記埋込絶縁膜(4)から離間して形成されることで、前記埋込領域(6)を通じて前記素子領域(8)と電気的に接続されており、前記第2配線(22)と前記第1導電型層(7)および前記埋込領域(6)を前記素子領域(8)に流す電流の引出し配線としていることを特徴とする半導体装置。 - 前記トレンチ分離部(11)により前記配線引出部(9)が囲まれていることを特徴とする請求項1に記載の半導体装置。
- 前記素子領域(8)における前記第1導電型層(7)のうち前記配線引出部(9)側において、前記トレンチ分離部(11)に沿って前記第1導電型層(7)の表面から形成された第2導電型電界緩和層(30)が備えられていることを特徴とする請求項1または2に記載の半導体装置。
- 前記素子領域(8)における前記第1導電型層(7)のうち前記配線引出部(9)側において、当該第1導電型層(7)よりも高不純物濃度とされ、前記トレンチ分離部(11)に沿って前記第1導電型層(7)の表面から形成された第1導電型電界緩和層(40)が備えられていることを特徴とする請求項1または2に記載の半導体装置。
- 前記トレンチ分離部(11)は、前記配線引出部(9)を中心として同心状に配置された多重トレンチ構造とされていることを特徴とする請求項1ないし4のいずれか1つに記載の半導体装置。
- 前記活性層(2)のうち前記多重トレンチ構造を構成する前記トレンチ分離部(11)の間に配置された部分には第2導電型領域(50)が備えられており、
前記第1配線と前記第2導電型領域(50)との間および前記第2配線と前記第2導電型領域(50)との間が抵抗(52)を介して接続されていることを特徴とする請求項5に記載の半導体装置。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018085373A (ja) * | 2016-11-21 | 2018-05-31 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
CN114639737A (zh) * | 2022-05-17 | 2022-06-17 | 广州粤芯半导体技术有限公司 | Ldmos器件及其制作方法 |
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