JP2012028659A - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP2012028659A
JP2012028659A JP2010167689A JP2010167689A JP2012028659A JP 2012028659 A JP2012028659 A JP 2012028659A JP 2010167689 A JP2010167689 A JP 2010167689A JP 2010167689 A JP2010167689 A JP 2010167689A JP 2012028659 A JP2012028659 A JP 2012028659A
Authority
JP
Japan
Prior art keywords
chamber
vacuum
transfer
wafer
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010167689A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012028659A5 (cg-RX-API-DMAC7.html
Inventor
Ryoichi Isomura
僚一 磯村
Tsutomu Tauchi
勤 田内
Hideaki Kondo
英明 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2010167689A priority Critical patent/JP2012028659A/ja
Priority to TW099127567A priority patent/TWI447838B/zh
Priority to KR1020100080456A priority patent/KR20120010945A/ko
Priority to CN2010102606997A priority patent/CN102347256A/zh
Priority to US12/805,837 priority patent/US20120027542A1/en
Publication of JP2012028659A publication Critical patent/JP2012028659A/ja
Publication of JP2012028659A5 publication Critical patent/JP2012028659A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010167689A 2010-07-27 2010-07-27 真空処理装置 Pending JP2012028659A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010167689A JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置
TW099127567A TWI447838B (zh) 2010-07-27 2010-08-18 Vacuum processing device
KR1020100080456A KR20120010945A (ko) 2010-07-27 2010-08-19 진공처리장치
CN2010102606997A CN102347256A (zh) 2010-07-27 2010-08-20 真空处理装置
US12/805,837 US20120027542A1 (en) 2010-07-27 2010-08-20 Vacuum processor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010167689A JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置

Publications (2)

Publication Number Publication Date
JP2012028659A true JP2012028659A (ja) 2012-02-09
JP2012028659A5 JP2012028659A5 (cg-RX-API-DMAC7.html) 2013-09-12

Family

ID=45526905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010167689A Pending JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置

Country Status (5)

Country Link
US (1) US20120027542A1 (cg-RX-API-DMAC7.html)
JP (1) JP2012028659A (cg-RX-API-DMAC7.html)
KR (1) KR20120010945A (cg-RX-API-DMAC7.html)
CN (1) CN102347256A (cg-RX-API-DMAC7.html)
TW (1) TWI447838B (cg-RX-API-DMAC7.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置
KR102618895B1 (ko) * 2011-03-11 2023-12-28 브룩스 오토메이션 인코퍼레이티드 기판 처리 툴
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP6120621B2 (ja) * 2013-03-14 2017-04-26 株式会社日立ハイテクノロジーズ 真空処理装置及びその運転方法
CN106162906B (zh) * 2015-03-31 2019-01-15 中兴通讯股份有限公司 调度信息发送、接收方法及装置
US9889567B2 (en) * 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
US11077535B2 (en) * 2018-02-14 2021-08-03 Samsung Electronics Co., Ltd. Process system having locking pin and locking pin
JP7115879B2 (ja) 2018-03-23 2022-08-09 株式会社日立ハイテク 真空処理装置の運転方法
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
CN113728422B (zh) 2020-03-24 2024-01-09 株式会社日立高新技术 真空处理装置
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
CN112249685B (zh) * 2020-10-27 2022-04-01 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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JP2002222845A (ja) * 2001-01-24 2002-08-09 Meidensha Corp 基板搬送用ロボット
JP2010067992A (ja) * 2003-06-02 2010-03-25 Tokyo Electron Ltd 基板処理装置及び基板搬送方法
JP2007511104A (ja) * 2003-11-10 2007-04-26 ブルーシフト テクノロジーズ インコーポレイテッド 真空下の半導体処理システムにおいて加工中の製品を処理する方法及びシステム

Also Published As

Publication number Publication date
TWI447838B (zh) 2014-08-01
CN102347256A (zh) 2012-02-08
KR20120010945A (ko) 2012-02-06
US20120027542A1 (en) 2012-02-02
TW201205710A (en) 2012-02-01

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