JP2012028659A5 - - Google Patents

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Publication number
JP2012028659A5
JP2012028659A5 JP2010167689A JP2010167689A JP2012028659A5 JP 2012028659 A5 JP2012028659 A5 JP 2012028659A5 JP 2010167689 A JP2010167689 A JP 2010167689A JP 2010167689 A JP2010167689 A JP 2010167689A JP 2012028659 A5 JP2012028659 A5 JP 2012028659A5
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JP
Japan
Prior art keywords
wafer
container
processing apparatus
transfer container
robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010167689A
Other languages
English (en)
Japanese (ja)
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JP2012028659A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010167689A priority Critical patent/JP2012028659A/ja
Priority claimed from JP2010167689A external-priority patent/JP2012028659A/ja
Priority to TW099127567A priority patent/TWI447838B/zh
Priority to KR1020100080456A priority patent/KR20120010945A/ko
Priority to CN2010102606997A priority patent/CN102347256A/zh
Priority to US12/805,837 priority patent/US20120027542A1/en
Publication of JP2012028659A publication Critical patent/JP2012028659A/ja
Publication of JP2012028659A5 publication Critical patent/JP2012028659A5/ja
Pending legal-status Critical Current

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JP2010167689A 2010-07-27 2010-07-27 真空処理装置 Pending JP2012028659A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010167689A JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置
TW099127567A TWI447838B (zh) 2010-07-27 2010-08-18 Vacuum processing device
KR1020100080456A KR20120010945A (ko) 2010-07-27 2010-08-19 진공처리장치
CN2010102606997A CN102347256A (zh) 2010-07-27 2010-08-20 真空处理装置
US12/805,837 US20120027542A1 (en) 2010-07-27 2010-08-20 Vacuum processor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010167689A JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置

Publications (2)

Publication Number Publication Date
JP2012028659A JP2012028659A (ja) 2012-02-09
JP2012028659A5 true JP2012028659A5 (cg-RX-API-DMAC7.html) 2013-09-12

Family

ID=45526905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010167689A Pending JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置

Country Status (5)

Country Link
US (1) US20120027542A1 (cg-RX-API-DMAC7.html)
JP (1) JP2012028659A (cg-RX-API-DMAC7.html)
KR (1) KR20120010945A (cg-RX-API-DMAC7.html)
CN (1) CN102347256A (cg-RX-API-DMAC7.html)
TW (1) TWI447838B (cg-RX-API-DMAC7.html)

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KR102618895B1 (ko) * 2011-03-11 2023-12-28 브룩스 오토메이션 인코퍼레이티드 기판 처리 툴
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP6120621B2 (ja) * 2013-03-14 2017-04-26 株式会社日立ハイテクノロジーズ 真空処理装置及びその運転方法
CN106162906B (zh) * 2015-03-31 2019-01-15 中兴通讯股份有限公司 调度信息发送、接收方法及装置
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JP7115879B2 (ja) 2018-03-23 2022-08-09 株式会社日立ハイテク 真空処理装置の運転方法
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
CN113728422B (zh) 2020-03-24 2024-01-09 株式会社日立高新技术 真空处理装置
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
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US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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