JP2012002730A - バーンインボード、バーンイン装置、及び、バーンインシステム - Google Patents

バーンインボード、バーンイン装置、及び、バーンインシステム Download PDF

Info

Publication number
JP2012002730A
JP2012002730A JP2010139161A JP2010139161A JP2012002730A JP 2012002730 A JP2012002730 A JP 2012002730A JP 2010139161 A JP2010139161 A JP 2010139161A JP 2010139161 A JP2010139161 A JP 2010139161A JP 2012002730 A JP2012002730 A JP 2012002730A
Authority
JP
Japan
Prior art keywords
test
burn
programmable logic
sockets
under test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010139161A
Other languages
English (en)
Japanese (ja)
Inventor
Akimasa Yuzurihara
原 章 政 譲
Takeshi Kumagai
谷 威 熊
Kazuhiko Sato
藤 和 彦 佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Engineering Corp
Original Assignee
Japan Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Engineering Corp filed Critical Japan Engineering Corp
Priority to JP2010139161A priority Critical patent/JP2012002730A/ja
Priority to TW099123264A priority patent/TW201200886A/zh
Priority to KR1020100071894A priority patent/KR101155581B1/ko
Publication of JP2012002730A publication Critical patent/JP2012002730A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2010139161A 2010-06-18 2010-06-18 バーンインボード、バーンイン装置、及び、バーンインシステム Pending JP2012002730A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010139161A JP2012002730A (ja) 2010-06-18 2010-06-18 バーンインボード、バーンイン装置、及び、バーンインシステム
TW099123264A TW201200886A (en) 2010-06-18 2010-07-15 Burn-in board, burn-in device and burn-in system
KR1020100071894A KR101155581B1 (ko) 2010-06-18 2010-07-26 번-인 보드, 번-인 장치, 및 번-인 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010139161A JP2012002730A (ja) 2010-06-18 2010-06-18 バーンインボード、バーンイン装置、及び、バーンインシステム

Publications (1)

Publication Number Publication Date
JP2012002730A true JP2012002730A (ja) 2012-01-05

Family

ID=45504175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010139161A Pending JP2012002730A (ja) 2010-06-18 2010-06-18 バーンインボード、バーンイン装置、及び、バーンインシステム

Country Status (3)

Country Link
JP (1) JP2012002730A (zh)
KR (1) KR101155581B1 (zh)
TW (1) TW201200886A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107102247A (zh) * 2017-04-18 2017-08-29 西南交通大学 一种crh3型动车组牵引逆变器igbt开路故障诊断方法
CN112513655A (zh) * 2018-08-20 2021-03-16 泰瑞达公司 基于载体的测试系统
CN114355149A (zh) * 2020-10-14 2022-04-15 株洲中车时代电气股份有限公司 一种变流器模块电路板的温度应力筛选试验系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471575B (zh) * 2012-06-14 2015-02-01 Macronix Int Co Ltd 預燒板、系統及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06180342A (ja) * 1992-12-14 1994-06-28 Ono Sokki Co Ltd Ｉｃ評価装置
JP2003156530A (ja) * 2001-11-20 2003-05-30 Hitachi Ltd 半導体回路と試験方法
JP2005043205A (ja) * 2003-07-22 2005-02-17 Toppoly Optoelectronics Corp フラットパネルディスプレイ用点灯エージング試験システム
JP2008152873A (ja) * 2006-12-19 2008-07-03 Yokogawa Electric Corp メモリテストシステム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080133165A1 (en) * 2006-12-04 2008-06-05 Advantest Corporation Test apparatus and device interface

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06180342A (ja) * 1992-12-14 1994-06-28 Ono Sokki Co Ltd Ｉｃ評価装置
JP2003156530A (ja) * 2001-11-20 2003-05-30 Hitachi Ltd 半導体回路と試験方法
JP2005043205A (ja) * 2003-07-22 2005-02-17 Toppoly Optoelectronics Corp フラットパネルディスプレイ用点灯エージング試験システム
JP2008152873A (ja) * 2006-12-19 2008-07-03 Yokogawa Electric Corp メモリテストシステム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107102247A (zh) * 2017-04-18 2017-08-29 西南交通大学 一种crh3型动车组牵引逆变器igbt开路故障诊断方法
CN107102247B (zh) * 2017-04-18 2019-05-14 西南交通大学 一种crh3型动车组牵引逆变器igbt开路故障诊断方法
CN112513655A (zh) * 2018-08-20 2021-03-16 泰瑞达公司 基于载体的测试系统
JP2021533364A (ja) * 2018-08-20 2021-12-02 テラダイン、 インコーポレイテッド キャリヤベースの試験システム
JP7308924B2 (ja) 2018-08-20 2023-07-14 テラダイン、 インコーポレイテッド 試験システムと、デバイスを試験する方法
CN114355149A (zh) * 2020-10-14 2022-04-15 株洲中车时代电气股份有限公司 一种变流器模块电路板的温度应力筛选试验系统

Also Published As

Publication number Publication date
KR20110138131A (ko) 2011-12-26
TW201200886A (en) 2012-01-01
KR101155581B1 (ko) 2012-06-19

Similar Documents

Publication Publication Date Title
JP2011242197A (ja) バーンインボード、バーンイン装置、及び、バーンインシステム
US7519880B1 (en) Burn-in using system-level test hardware
US9275187B2 (en) Programmable test chip, system and method for characterization of integrated circuit fabrication processes
US20060279306A1 (en) Test equipment of semiconductor devices
US6407567B1 (en) IC Device burn-in method and apparatus
US20220252662A1 (en) Scalable Tester for Testing Multiple Devices Under Test
JP2012002730A (ja) バーンインボード、バーンイン装置、及び、バーンインシステム
US20070096758A1 (en) Method and apparatus for eliminating automated testing equipment index time
JP2012093124A (ja) バーンイン装置、バーンインシステム、バーンイン装置の制御方法およびバーンインシステムの制御方法
WO2009147724A1 (ja) 試験用ウエハユニットおよび試験システム
US9620243B2 (en) Test system simultaneously testing semiconductor devices
KR100856079B1 (ko) 반도체 검사장치
JP4124206B2 (ja) バーンインテスト方法
CN110161400A (zh) 一种用于测试内存组件的测试室以及测试方法
TWI763594B (zh) 半導體晶片及其預燒測試方法
US11719741B2 (en) Burn-in board and burn-in apparatus
Bernardi et al. A DMA and CACHE-based stress schema for burn-in of automotive microcontroller
KR20050121376A (ko) 반도체 장치의 테스트 장치 및 이를 이용한 반도체 장치테스트 방법
KR100816796B1 (ko) 반도체 디바이스 테스트 시스템
KR101599459B1 (ko) 반도체 소자 테스트 시스템 및 방법
JP2008076241A (ja) 半導体テスト装置
US20240192269A1 (en) Test substrate, test apparatus, and test method for semiconductor integrated circuit
KR100935234B1 (ko) 번인 테스트를 위한 개별 전류 설정 장치 및 방법
JP2012242132A (ja) 取り外し可能型取り付け装置、及び、バーンインボード
JP5314684B2 (ja) 試験用ウエハ、および、試験システム

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120515

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121225

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130416