JP2011528176A - 電子ユニットとその製造方法 - Google Patents

電子ユニットとその製造方法 Download PDF

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Publication number
JP2011528176A
JP2011528176A JP2011517834A JP2011517834A JP2011528176A JP 2011528176 A JP2011528176 A JP 2011528176A JP 2011517834 A JP2011517834 A JP 2011517834A JP 2011517834 A JP2011517834 A JP 2011517834A JP 2011528176 A JP2011528176 A JP 2011528176A
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JP
Japan
Prior art keywords
conductive substrate
conductive
contact
molding compound
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011517834A
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English (en)
Japanese (ja)
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JP2011528176A5 (https=
Inventor
レートリングスヘーファー ヴァルター
ゲーベル ウルリヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2011528176A publication Critical patent/JP2011528176A/ja
Publication of JP2011528176A5 publication Critical patent/JP2011528176A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Resistors (AREA)
  • Fuses (AREA)
  • Powder Metallurgy (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2011517834A 2008-07-17 2009-06-16 電子ユニットとその製造方法 Pending JP2011528176A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008040488.8 2008-07-17
DE102008040488A DE102008040488A1 (de) 2008-07-17 2008-07-17 Elektronische Baueinheit und Verfahren zu deren Herstellung
PCT/EP2009/057409 WO2010006864A1 (de) 2008-07-17 2009-06-16 Elektronische baueinheit und verfahren zu deren herstellung

Publications (2)

Publication Number Publication Date
JP2011528176A true JP2011528176A (ja) 2011-11-10
JP2011528176A5 JP2011528176A5 (https=) 2012-01-19

Family

ID=41064573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011517834A Pending JP2011528176A (ja) 2008-07-17 2009-06-16 電子ユニットとその製造方法

Country Status (7)

Country Link
US (1) US20110182048A1 (https=)
EP (1) EP2305013B1 (https=)
JP (1) JP2011528176A (https=)
CN (1) CN102090156B (https=)
AT (1) ATE546033T1 (https=)
DE (1) DE102008040488A1 (https=)
WO (1) WO2010006864A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171848A (ja) * 2012-02-17 2013-09-02 Denso Corp モールドパッケージおよびその製造方法
JP2013539237A (ja) * 2010-10-07 2013-10-17 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子モジュール、並びに、電子モジュールの製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
WO2013174418A1 (de) * 2012-05-22 2013-11-28 Würth Elektronik GmbH & Co. KG Verfahren zum herstellen einer elektronischen baugruppe
US9807890B2 (en) * 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
DE102013215246A1 (de) * 2013-08-02 2015-02-05 Robert Bosch Gmbh Elektronikmodul mit Leiterplatten und anspritzbarem Kunststoff-Dichtring, insbesondere für ein Kfz-Getriebesteuergerät, und Verfahren zum Fertigen desselben
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
DE102019204871A1 (de) * 2019-04-05 2020-10-08 Robert Bosch Gmbh Elektronische Schaltungseinheit
EP3739624A1 (en) * 2019-05-13 2020-11-18 Infineon Technologies Austria AG Semiconductor arrangement with a compressible contact element encapsulated between two carriers and corresponding manufacturing method
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules
DE102020203993A1 (de) 2020-03-27 2021-09-30 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktanordnung mit sinterverbundenen Schaltungsträgern

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132447A (ja) * 1992-10-20 1994-05-13 Hitachi Ltd 混成型集積回路装置
JPH06151703A (ja) * 1992-11-05 1994-05-31 Sony Corp 半導体装置及びその成形方法
JP2005191146A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置の製造方法
WO2007040694A1 (en) * 2005-09-26 2007-04-12 Motorola, Inc. Integrated circuit mounting for thermal stress relief useable in a multi-chip module
JP2008103623A (ja) * 2006-10-20 2008-05-01 Denso Corp 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2971637B2 (ja) * 1991-06-17 1999-11-08 富士通株式会社 半導体装置
JP3108856B2 (ja) * 1995-12-28 2000-11-13 ローム株式会社 樹脂パッケージ型半導体装置およびこれを実装した電子回路基板
JP2001077232A (ja) * 1999-09-06 2001-03-23 Mitsubishi Electric Corp 半導体装置およびその製造方法
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
TWI226110B (en) * 2004-03-17 2005-01-01 Cyntec Co Ltd Package with stacked substrates
DE102005047567B3 (de) * 2005-10-05 2007-03-29 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Isolationszwischenlage und Verfahren zu seiner Herstellung
KR100656751B1 (ko) * 2005-12-13 2006-12-13 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
US7986043B2 (en) * 2006-03-08 2011-07-26 Stats Chippac Ltd. Integrated circuit package on package system
US7535086B2 (en) * 2006-08-03 2009-05-19 Stats Chippac Ltd. Integrated circuit package-on-package stacking system
US20080047653A1 (en) * 2006-08-28 2008-02-28 Kan Shih-Wei Method for manufacturing multi-layer ceramic substrate
DE102007032142A1 (de) * 2007-06-30 2009-01-02 Robert Bosch Gmbh Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132447A (ja) * 1992-10-20 1994-05-13 Hitachi Ltd 混成型集積回路装置
JPH06151703A (ja) * 1992-11-05 1994-05-31 Sony Corp 半導体装置及びその成形方法
JP2005191146A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置の製造方法
WO2007040694A1 (en) * 2005-09-26 2007-04-12 Motorola, Inc. Integrated circuit mounting for thermal stress relief useable in a multi-chip module
JP2008103623A (ja) * 2006-10-20 2008-05-01 Denso Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539237A (ja) * 2010-10-07 2013-10-17 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子モジュール、並びに、電子モジュールの製造方法
JP2013171848A (ja) * 2012-02-17 2013-09-02 Denso Corp モールドパッケージおよびその製造方法

Also Published As

Publication number Publication date
DE102008040488A1 (de) 2010-01-21
EP2305013B1 (de) 2012-02-15
CN102090156B (zh) 2014-07-16
WO2010006864A1 (de) 2010-01-21
US20110182048A1 (en) 2011-07-28
ATE546033T1 (de) 2012-03-15
CN102090156A (zh) 2011-06-08
EP2305013A1 (de) 2011-04-06

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