JP2013539237A - 電子モジュール、並びに、電子モジュールの製造方法 - Google Patents
電子モジュール、並びに、電子モジュールの製造方法 Download PDFInfo
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- 238000005452 bending Methods 0.000 description 2
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- 239000000853 adhesive Substances 0.000 description 1
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Y10T29/49126—Assembling bases
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Abstract
・モールドボディ(2)と、
・電子構成素子(5)が配置されている第1内側面(3a;13a)と、第1外側面(3b:13b)とを備える第1回路支持体(3;13)と、
・電子構成素子(5)が配置されている第2内側面(4a;14a)と、第2外側面(4b:14b)とを備える第2回路支持体(4;14)と、
・前記第1回路支持体及び前記第2回路支持体の、前記内側面同士、又は、前記内側面に配置されている電子構成素子(5)の表面同士を接続する、少なくとも1つのばね装置(6,7;16)と、
を含み、
・前記第1外側面と前記第2外側面は、熱を直接前記電子モジュールの外側に排出するために、前記外側に対して露出しており、
・前記第1外側面と前記第2外側面は、互いに平行である、
ことを特徴とする電子モジュール。
Description
Claims (11)
- 電子モジュールにおいて、該電子モジュールは、
・モールドボディ(2)と、
・電子構成素子(5)が配置されている第1内側面(3a;13a)と、第1外側面(3b:13b)とを備える第1回路支持体(3;13)と、
・電子構成素子(5)が配置されている第2内側面(4a;14a)と、第2外側面(4b:14b)とを備える第2回路支持体(4;14)と、
・前記第1回路支持体(3;13)及び前記第2回路支持体(4;14)の、前記内側面同士(3a,4a;13a,14a)、又は、前記内側面に配置されている電子構成素子(5)の表面同士を接続する、少なくとも1つのばね装置(6,7;16)と、
を含み、
・前記第1外側面(3b;13b)と前記第2外側面(4b;14b)は、熱を直接前記電子モジュールの外側に排出するために、前記外側に対して露出しており、
・前記第1外側面(3b;13b)と前記第2外側面(4b;14b)は、互いに平行である、
ことを特徴とする電子モジュール。 - 前記第1回路支持体(13)と、前記第2回路支持体(14)と、前記ばね装置(16)は、1つの統合された構成部材(12)である、
ことを特徴とする請求項1記載の電子モジュール。 - 前記統合された構成部材(12)は、リードフレームである、
ことを特徴とする請求項2記載の電子モジュール。 - 前記電子モジュールはさらに、付加的な別個のばね装置を含む、
ことを特徴とする請求項2又は3記載の電子モジュール。 - 前記第1回路支持体(13)と前記第2回路支持体(14)は、1つの共通の電気接続端子(18)を有する、
ことを特徴とする請求項2から4のいずれか一項記載の電子モジュール。 - 前記第1回路支持体(3)と、前記第2回路支持体(4)と、前記ばね装置(6,7)は、別個の構成部材である、
ことを特徴とする請求項1記載の電子モジュール。 - 前記ばね装置(6,7)は、1つの別個のばねエレメントを含むか、又は、複数の別個のばねエレメント、有利には2つの、特に有利には4つの別個のばねエレメントを含む、
ことを特徴とする請求項6記載の電子モジュール。 - 前記第1回路支持体(3)と前記第2回路支持体(4)は、それぞれ別個の電気接続端子(8,9)を有する、
ことを特徴とする請求項6又は7記載の電子モジュール。 - 前記ばね装置は、導電性材料から製造されており、導電機能を有する、
ことを特徴とする請求項1から8のいずれか一項記載の電子モジュール。 - 第1回路支持体(3;13)と、第2回路支持体(4;14)と、モールドボディ(2)とを備えた電子モジュール(1)の製造方法において、
・前記第1回路支持体(3;13)と前記第2回路支持体(4:14)を、モールド工具(20)の中に配置し、
前記第1回路支持体と前記第2回路支持体との間に、前記第1回路支持体の外側面(3b;13b)が前記モールド工具(20)の第1壁領域(21a)に押圧されて該第1壁領域(21a)に当接するように、かつ、前記第2回路支持体(4;14)の第2外側面(4b;14b)が前記モールド工具(20)の第2壁領域(22a)に押圧されて該第2壁領域(22a)に当接するように、ばね装置(6,7;16)を配置し、この際、前記第1壁領域(21a)と前記第2壁領域(22a)とを互いに平行に配向し、
・前記モールドボディ(2)を形成するために、前記モールド工具(20)の中にモールドペーストを供給し、この際、前記ばね装置(6,7;16)を、前記モールドペーストによって包囲し、前記第1及び第2回路支持体の前記外側面(3b,4b;13b,14b)は、前記電子モジュール(1)の平行な排熱面として機能するために、モールドペーストが無いままである、
ことを特徴とする製造方法。 - 前記ばね装置(6,7;16)を、導電性材料から製造し、前記モールド工具(20)の中に入れる前に、前記第1及び第2回路支持体(3,4;13,14)に導電的に接続させる、
ことを特徴とする請求項10記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010042168A DE102010042168A1 (de) | 2010-10-07 | 2010-10-07 | Elektronische Baugruppe sowie Verfahren zu deren Herstellung |
DE102010042168.5 | 2010-10-07 | ||
PCT/EP2011/066608 WO2012045600A1 (de) | 2010-10-07 | 2011-09-23 | Elektronische baugruppe sowie verfahren zu deren herstellung |
Publications (2)
Publication Number | Publication Date |
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JP2013539237A true JP2013539237A (ja) | 2013-10-17 |
JP5693736B2 JP5693736B2 (ja) | 2015-04-01 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013532115A Expired - Fee Related JP5693736B2 (ja) | 2010-10-07 | 2011-09-23 | 電子モジュール、並びに、電子モジュールの製造方法 |
Country Status (7)
Country | Link |
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US (1) | US8970030B2 (ja) |
EP (1) | EP2625713B1 (ja) |
JP (1) | JP5693736B2 (ja) |
CN (1) | CN103155144B (ja) |
DE (1) | DE102010042168A1 (ja) |
ES (1) | ES2736249T3 (ja) |
WO (1) | WO2012045600A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3226293B1 (en) * | 2014-11-27 | 2022-05-11 | Mitsubishi Electric Corporation | Semiconductor module and semiconductor driving device |
US10403601B2 (en) * | 2016-06-17 | 2019-09-03 | Fairchild Semiconductor Corporation | Semiconductor package and related methods |
US10373895B2 (en) | 2016-12-12 | 2019-08-06 | Infineon Technologies Austria Ag | Semiconductor device having die pads with exposed surfaces |
DE102017208772A1 (de) * | 2017-05-23 | 2018-11-29 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Herstellen eines Leiterplattensandwichs und Leiterplattensandwich |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05304247A (ja) * | 1992-04-27 | 1993-11-16 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH06151703A (ja) * | 1992-11-05 | 1994-05-31 | Sony Corp | 半導体装置及びその成形方法 |
US20040156173A1 (en) * | 2002-12-30 | 2004-08-12 | Nyeon-Sik Jeong | Semiconductor package with a heat spreader |
JP2011528176A (ja) * | 2008-07-17 | 2011-11-10 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子ユニットとその製造方法 |
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JP3153309B2 (ja) * | 1992-01-30 | 2001-04-09 | タカタ株式会社 | シートベルトリトラクタ |
EP1148547B8 (en) * | 2000-04-19 | 2016-01-06 | Denso Corporation | Coolant cooled type semiconductor device |
US6665187B1 (en) * | 2002-07-16 | 2003-12-16 | International Business Machines Corporation | Thermally enhanced lid for multichip modules |
US7880282B2 (en) * | 2003-12-18 | 2011-02-01 | Rf Module & Optical Design Ltd. | Semiconductor package with integrated heatsink and electromagnetic shield |
CN100435324C (zh) * | 2004-12-20 | 2008-11-19 | 半导体元件工业有限责任公司 | 具有增强散热性的半导体封装结构 |
US20070029648A1 (en) * | 2005-08-02 | 2007-02-08 | Texas Instruments Incorporated | Enhanced multi-die package |
DE102007032142A1 (de) * | 2007-06-30 | 2009-01-02 | Robert Bosch Gmbh | Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls |
-
2010
- 2010-10-07 DE DE102010042168A patent/DE102010042168A1/de not_active Ceased
-
2011
- 2011-09-23 JP JP2013532115A patent/JP5693736B2/ja not_active Expired - Fee Related
- 2011-09-23 EP EP11761075.8A patent/EP2625713B1/de not_active Not-in-force
- 2011-09-23 US US13/878,369 patent/US8970030B2/en not_active Expired - Fee Related
- 2011-09-23 ES ES11761075T patent/ES2736249T3/es active Active
- 2011-09-23 CN CN201180048394.2A patent/CN103155144B/zh not_active Expired - Fee Related
- 2011-09-23 WO PCT/EP2011/066608 patent/WO2012045600A1/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05304247A (ja) * | 1992-04-27 | 1993-11-16 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH06151703A (ja) * | 1992-11-05 | 1994-05-31 | Sony Corp | 半導体装置及びその成形方法 |
US20040156173A1 (en) * | 2002-12-30 | 2004-08-12 | Nyeon-Sik Jeong | Semiconductor package with a heat spreader |
JP2011528176A (ja) * | 2008-07-17 | 2011-11-10 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子ユニットとその製造方法 |
Also Published As
Publication number | Publication date |
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EP2625713A1 (de) | 2013-08-14 |
DE102010042168A1 (de) | 2012-04-12 |
ES2736249T3 (es) | 2019-12-27 |
WO2012045600A1 (de) | 2012-04-12 |
US8970030B2 (en) | 2015-03-03 |
CN103155144A (zh) | 2013-06-12 |
EP2625713B1 (de) | 2019-04-17 |
CN103155144B (zh) | 2016-05-04 |
US20130201614A1 (en) | 2013-08-08 |
JP5693736B2 (ja) | 2015-04-01 |
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