JP2011523223A5 - - Google Patents

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Publication number
JP2011523223A5
JP2011523223A5 JP2011512955A JP2011512955A JP2011523223A5 JP 2011523223 A5 JP2011523223 A5 JP 2011523223A5 JP 2011512955 A JP2011512955 A JP 2011512955A JP 2011512955 A JP2011512955 A JP 2011512955A JP 2011523223 A5 JP2011523223 A5 JP 2011523223A5
Authority
JP
Japan
Prior art keywords
circuit board
layer
flexible region
region
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011512955A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011523223A (ja
Filing date
Publication date
Priority claimed from DE102008028300.2A external-priority patent/DE102008028300B4/de
Application filed filed Critical
Publication of JP2011523223A publication Critical patent/JP2011523223A/ja
Publication of JP2011523223A5 publication Critical patent/JP2011523223A5/ja
Pending legal-status Critical Current

Links

JP2011512955A 2008-06-13 2009-06-08 可撓領域を備えた回路基板およびその製造方法 Pending JP2011523223A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008028300.2 2008-06-13
DE102008028300.2A DE102008028300B4 (de) 2008-06-13 2008-06-13 Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung
PCT/EP2009/057051 WO2009150133A1 (de) 2008-06-13 2009-06-08 Leiterplatte mit flexiblem bereich und verfahren zur herstellung

Publications (2)

Publication Number Publication Date
JP2011523223A JP2011523223A (ja) 2011-08-04
JP2011523223A5 true JP2011523223A5 (cg-RX-API-DMAC7.html) 2012-06-28

Family

ID=41058975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011512955A Pending JP2011523223A (ja) 2008-06-13 2009-06-08 可撓領域を備えた回路基板およびその製造方法

Country Status (4)

Country Link
US (1) US9035189B2 (cg-RX-API-DMAC7.html)
JP (1) JP2011523223A (cg-RX-API-DMAC7.html)
DE (1) DE102008028300B4 (cg-RX-API-DMAC7.html)
WO (1) WO2009150133A1 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010034718B4 (de) 2010-08-18 2017-11-30 Deutsches Zentrum für Luft- und Raumfahrt e.V. Dehnbares Substrat mit einer Kontaktstelle zwischen einem polymerbasierten elektrischen Leiter und einem weiteren elektrischen Leiter
DE102011121818B4 (de) 2011-12-21 2024-08-14 Vitesco Technologies Germany Gmbh Anordnung eines elektronischen Bauteils in einem Gehäuse
JP5880428B2 (ja) * 2012-12-28 2016-03-09 株式会社オートネットワーク技術研究所 カードエッジコネクタ
DE102015208523A1 (de) * 2015-05-07 2016-11-10 Conti Temic Microelectronic Gmbh Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
US20170027070A1 (en) * 2015-07-23 2017-01-26 Magna Closures Inc. Housing assembly of a power operated device and method of manufacturing thereof
EP3454312B1 (de) * 2017-09-11 2019-08-07 Siemens Schweiz AG Optischer rauchmelder mit einem aufschwenkbaren leiterplattenabschnitt mit einem darauf angeordneten lichtsender und/oder lichtempfänger
EP3562279A1 (de) * 2018-04-25 2019-10-30 Siemens Aktiengesellschaft Herstellung einer elektrischen verbindung von bauelementen mit einer kontaktierungsplatte
DE102019201281B4 (de) * 2019-01-31 2022-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Trägeranordnung und Verfahren zur Herstellung einer Trägeranordnung

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2475804A1 (fr) * 1980-02-12 1981-08-14 Lewiner Jacques Perfectionnements aux nappes composites constitutives de transducteurs electromecaniques et aux transducteurs equipes de telles nappes
JPS58153468A (ja) 1982-03-05 1983-09-12 Sharp Corp テレビジヨン受像機の番組予約装置
JPS58153468U (ja) * 1982-04-08 1983-10-14 株式会社フジクラ フレキシブルプリント基板
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
JPS6268265A (ja) 1985-09-19 1987-03-28 Kawasaki Steel Corp 金属帯の表面疵研削方法
JPS6268265U (cg-RX-API-DMAC7.html) * 1985-10-18 1987-04-28
US4990948A (en) * 1986-12-27 1991-02-05 Canon Kabushiki Kaisha Flexible printed circuit board
US5159751A (en) * 1990-02-05 1992-11-03 Motorola, Inc. Method of manufacturing electronic module assembly
US5103375A (en) * 1990-02-05 1992-04-07 Motorola, Inc. Electronic module assembly and method of manufacture
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
JP2801487B2 (ja) * 1992-04-30 1998-09-21 シャープ株式会社 パネルの実装構造および実装方法並びに樹脂供給硬化方法
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
DE4341103C1 (de) * 1993-12-02 1995-01-12 Harting Elektronik Gmbh Elektrischer Steckverbinder
WO1997001823A2 (de) * 1995-06-27 1997-01-16 Orga Kartensysteme Gmbh Chipkarte
JPH09331153A (ja) 1996-06-11 1997-12-22 Toshiba Chem Corp 多層フレキシブル配線板の製造方法
DE19720106C2 (de) * 1997-05-16 2001-03-15 Telefunken Microelectron Vorrichtung zur Aufnahme von elektrischen Bauteilen
US6882538B1 (en) * 1999-05-31 2005-04-19 Tyco Electronics Logistics Ag Intelligent power module
FI112644B (fi) * 2000-11-10 2003-12-31 Vaisala Oyj Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi
AUPR846701A0 (en) * 2001-10-25 2001-11-15 Microtechnology Centre Management Limited A method of fabrication of micro-devices
DE10206818A1 (de) * 2002-02-18 2003-08-28 Infineon Technologies Ag Elektronisches Bauteil mit Klebstoffschicht und Verfahren zur Herstellung derselben
DE20221189U1 (de) 2002-09-19 2005-05-19 Ruwel Ag Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
JP2004140018A (ja) * 2002-10-15 2004-05-13 Denso Corp 多層基板の製造方法、多層基板、及びそれを用いたモバイル機器
US7371970B2 (en) * 2002-12-06 2008-05-13 Flammer Jeffrey D Rigid-flex circuit board system
US20040145874A1 (en) * 2003-01-23 2004-07-29 Stephane Pinel Method, system, and apparatus for embedding circuits
US7259969B2 (en) * 2003-02-26 2007-08-21 Wavezero, Inc. Methods and devices for connecting and grounding an EMI shield to a printed circuit board
US7109410B2 (en) * 2003-04-15 2006-09-19 Wavezero, Inc. EMI shielding for electronic component packaging
US20040232535A1 (en) * 2003-05-22 2004-11-25 Terry Tarn Microelectromechanical device packages with integral heaters
DE10345257B4 (de) * 2003-09-29 2008-10-02 Infineon Technologies Ag Chipkarte mit Kontaktfelder und Verfahren zum Herstellen solcher Kontaktfelder
JP3722223B2 (ja) * 2003-10-27 2005-11-30 セイコーエプソン株式会社 半導体装置及びその製造方法、電子モジュール並びに電子機器
US7176600B2 (en) * 2003-12-18 2007-02-13 Palo Alto Research Center Incorporated Poling system for piezoelectric diaphragm structures
CN101095277A (zh) * 2004-03-12 2007-12-26 斯里国际 机械超常材料
DE102004028211A1 (de) * 2004-06-09 2005-12-29 Robert Bosch Gmbh Streßoptimierte Leiterplatte
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP2006019636A (ja) * 2004-07-05 2006-01-19 Renesas Technology Corp 半導体装置
US20060040091A1 (en) * 2004-08-23 2006-02-23 Bletsos Ioannis V Breathable low-emissivity metalized sheets
US7312401B2 (en) * 2004-09-21 2007-12-25 Ibiden Co., Ltd. Flexible printed wiring board
JP4306590B2 (ja) * 2004-11-05 2009-08-05 セイコーエプソン株式会社 電気光学装置及び電子機器
US7274107B2 (en) * 2005-01-21 2007-09-25 Infineon Technologies Ag Semiconductor device
JP4588474B2 (ja) * 2005-02-04 2010-12-01 株式会社フジクラ 照明装置及び照明用光源の実装方法
JP2006231174A (ja) 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 有機物処理装置
JP4534972B2 (ja) * 2005-03-30 2010-09-01 エプソンイメージングデバイス株式会社 電気光学装置、及び電子機器
JP2006342238A (ja) 2005-06-08 2006-12-21 Kyocera Chemical Corp 熱硬化性接着シート、銅張積層板及びフレキシブルプリント配線板
JP4095082B2 (ja) * 2005-08-31 2008-06-04 Ｔｄｋ株式会社 磁気ヘッドアッセンブリのフレキシブル配線板
US7388756B1 (en) * 2006-12-12 2008-06-17 The Boeing Company Method and system for angled RF connection using a flexible substrate
KR20090070916A (ko) * 2007-12-27 2009-07-01 삼성전기주식회사 반도체 장치 및 그 제조방법

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