JP2011520245A5 - - Google Patents

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Publication number
JP2011520245A5
JP2011520245A5 JP2011503375A JP2011503375A JP2011520245A5 JP 2011520245 A5 JP2011520245 A5 JP 2011520245A5 JP 2011503375 A JP2011503375 A JP 2011503375A JP 2011503375 A JP2011503375 A JP 2011503375A JP 2011520245 A5 JP2011520245 A5 JP 2011520245A5
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JP
Japan
Prior art keywords
chuck
stage
array
stress
elements
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Application number
JP2011503375A
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English (en)
Japanese (ja)
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JP2011520245A (ja
JP5372136B2 (ja
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Priority claimed from PCT/EP2009/002577 external-priority patent/WO2009124732A1/en
Publication of JP2011520245A publication Critical patent/JP2011520245A/ja
Publication of JP2011520245A5 publication Critical patent/JP2011520245A5/ja
Application granted granted Critical
Publication of JP5372136B2 publication Critical patent/JP5372136B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011503375A 2008-04-10 2009-04-07 リソグラフィ装置のための剪断層チャック Active JP5372136B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7105908P 2008-04-10 2008-04-10
US61/071,059 2008-04-10
PCT/EP2009/002577 WO2009124732A1 (en) 2008-04-10 2009-04-07 Shear-layer chuck for lithographic apparatus

Publications (3)

Publication Number Publication Date
JP2011520245A JP2011520245A (ja) 2011-07-14
JP2011520245A5 true JP2011520245A5 (cg-RX-API-DMAC10.html) 2012-05-31
JP5372136B2 JP5372136B2 (ja) 2013-12-18

Family

ID=40752516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011503375A Active JP5372136B2 (ja) 2008-04-10 2009-04-07 リソグラフィ装置のための剪断層チャック

Country Status (7)

Country Link
US (3) US20110013164A1 (cg-RX-API-DMAC10.html)
JP (1) JP5372136B2 (cg-RX-API-DMAC10.html)
KR (1) KR101602367B1 (cg-RX-API-DMAC10.html)
CN (1) CN101990652B (cg-RX-API-DMAC10.html)
NL (1) NL1036735A1 (cg-RX-API-DMAC10.html)
TW (1) TWI429018B (cg-RX-API-DMAC10.html)
WO (1) WO2009124732A1 (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.
US9366973B2 (en) 2011-02-18 2016-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2753980B1 (en) 2011-09-09 2019-11-20 ASML Netherlands B.V. Support structure for wafer table
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
US11040705B2 (en) 2016-05-19 2021-06-22 Pylon Manufacturing Corp. Windshield wiper connector
US10761435B2 (en) 2017-02-10 2020-09-01 Asml Holding N.V. Reticle clamping device
CN113826045A (zh) 2019-04-30 2021-12-21 Asml荷兰有限公司 用于在本体上提供耐磨材料的方法、以及复合体
US11650512B2 (en) * 2021-06-25 2023-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle cleaning device and method of use
WO2025242380A1 (en) * 2024-05-20 2025-11-27 Asml Netherlands B.V. Split chuck
WO2026073658A1 (en) * 2024-10-01 2026-04-09 Asml Netherlands B.V. Methods and systems for determining reticle deformation

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JPS6335989U (cg-RX-API-DMAC10.html) * 1986-08-25 1988-03-08
US5401973A (en) 1992-12-04 1995-03-28 Atomic Energy Of Canada Limited Industrial material processing electron linear accelerator
WO2001060125A1 (en) * 2000-02-07 2001-08-16 Tdk Corporation Composite substrate, thin-film light-emitting device comprising the same, and method for producing the same
JP2003007602A (ja) * 2001-06-26 2003-01-10 Nikon Corp 計測装置及び計測方法、露光装置及び露光方法
JP2002050560A (ja) 2000-08-02 2002-02-15 Nikon Corp ステージ装置、計測装置及び計測方法、露光装置及び露光方法
JP2002134599A (ja) * 2000-10-24 2002-05-10 Ngk Insulators Ltd 静電吸着装置
US6513796B2 (en) * 2001-02-23 2003-02-04 International Business Machines Corporation Wafer chuck having a removable insert
JP2002299228A (ja) 2001-04-03 2002-10-11 Nikon Corp レチクル、それを用いた露光装置及び露光方法
JP4103385B2 (ja) * 2001-12-27 2008-06-18 住友金属工業株式会社 真空チャック
JP2003332411A (ja) * 2002-05-17 2003-11-21 Nikon Corp 基板保持装置及び露光装置
JP4204964B2 (ja) * 2002-12-23 2009-01-07 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
EP1434100A2 (en) * 2002-12-23 2004-06-30 ASML Netherlands B.V. Lithographic apparatus
CN1732551B (zh) 2002-12-27 2012-03-28 松下电工株式会社 场发射型电子源及其制造方法
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
JP2005039155A (ja) * 2003-07-18 2005-02-10 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及びそれに用いる半導体基板の製造方法
US7119884B2 (en) * 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7786607B2 (en) 2004-02-19 2010-08-31 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
JP4298547B2 (ja) 2004-03-01 2009-07-22 キヤノン株式会社 位置決め装置およびそれを用いた露光装置
EP2995997B1 (en) * 2004-12-15 2017-08-30 Nikon Corporation Exposure apparatus, exposure method, and device fabricating method
JP4708876B2 (ja) * 2005-06-21 2011-06-22 キヤノン株式会社 液浸露光装置
US7372549B2 (en) 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7564536B2 (en) * 2005-11-08 2009-07-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7733463B2 (en) 2006-05-05 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070268476A1 (en) 2006-05-19 2007-11-22 Nikon Corporation Kinematic chucks for reticles and other planar bodies
EP2021874A1 (en) * 2006-05-19 2009-02-11 Nikon Corporation Chucks for reticles and other planar bodies
US7722256B2 (en) * 2006-11-17 2010-05-25 Corning Incorporated Flat surface air bearing assembly
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.

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