JP2011513995A5 - - Google Patents
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- Publication number
- JP2011513995A5 JP2011513995A5 JP2010549837A JP2010549837A JP2011513995A5 JP 2011513995 A5 JP2011513995 A5 JP 2011513995A5 JP 2010549837 A JP2010549837 A JP 2010549837A JP 2010549837 A JP2010549837 A JP 2010549837A JP 2011513995 A5 JP2011513995 A5 JP 2011513995A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- pattern
- acrylate ester
- dicing
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- -1 acrylate ester Chemical class 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 11
- 238000012986 modification Methods 0.000 claims description 8
- 230000004048 modification Effects 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 239000002685 polymerization catalyst Substances 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 3
- 230000005865 ionizing radiation Effects 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3479108P | 2008-03-07 | 2008-03-07 | |
| PCT/US2009/035948 WO2009114345A1 (en) | 2008-03-07 | 2009-03-04 | Dicing tape and die attach adhesive with patterned backing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011513995A JP2011513995A (ja) | 2011-04-28 |
| JP2011513995A5 true JP2011513995A5 (https=) | 2012-04-26 |
Family
ID=40834530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010549837A Withdrawn JP2011513995A (ja) | 2008-03-07 | 2009-03-04 | 模様付き裏材を備えるダイシングテープ及びダイアタッチ接着剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7858499B2 (https=) |
| EP (1) | EP2257608A1 (https=) |
| JP (1) | JP2011513995A (https=) |
| KR (1) | KR20100122110A (https=) |
| CN (1) | CN102015943A (https=) |
| TW (1) | TW200947543A (https=) |
| WO (1) | WO2009114345A1 (https=) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150235A (ja) * | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
| WO2008115711A1 (en) * | 2007-03-16 | 2008-09-25 | 3M Innovative Properties Company | Dicing and die attach adhesive |
| JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
| JP2011018669A (ja) * | 2009-07-07 | 2011-01-27 | Nitto Denko Corp | 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法 |
| US8987632B2 (en) * | 2009-10-09 | 2015-03-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Modification of surface energy via direct laser ablative surface patterning |
| WO2011132647A1 (ja) * | 2010-04-19 | 2011-10-27 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム |
| JP5583080B2 (ja) * | 2010-07-07 | 2014-09-03 | 古河電気工業株式会社 | ウエハ加工用テープおよびそれを用いた半導体加工方法 |
| US8580683B2 (en) | 2011-09-27 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and methods for molding die on wafer interposers |
| US8501590B2 (en) | 2011-07-05 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and methods for dicing interposer assembly |
| CN102690611B (zh) * | 2011-12-27 | 2015-06-24 | 3M中国有限公司 | 胶带组合物以及由其制备的胶带 |
| US8940618B2 (en) * | 2012-03-13 | 2015-01-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and device for cutting semiconductor wafers |
| US20130264686A1 (en) * | 2012-04-05 | 2013-10-10 | Texas Instruments Incorporated | Semiconductor wafer processing |
| US9056438B2 (en) | 2012-05-02 | 2015-06-16 | 3M Innovative Properties Company | Curable composition, articles comprising the curable composition, and method of making the same |
| JP2015525430A (ja) | 2012-05-18 | 2015-09-03 | スリーエム イノベイティブ プロパティズ カンパニー | オーバーコートされたナノワイヤ透明導電コーティングのコロナによるパターニング |
| US9278374B2 (en) | 2012-06-08 | 2016-03-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Modified surface having low adhesion properties to mitigate insect residue adhesion |
| US8962389B2 (en) | 2013-05-30 | 2015-02-24 | Freescale Semiconductor, Inc. | Microelectronic packages including patterned die attach material and methods for the fabrication thereof |
| TWI575779B (zh) * | 2014-03-31 | 2017-03-21 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
| CN110085524A (zh) | 2014-05-12 | 2019-08-02 | 天工方案公司 | 用于处理单片化射频单元的设备和方法 |
| US11069734B2 (en) | 2014-12-11 | 2021-07-20 | Invensas Corporation | Image sensor device |
| TWI787147B (zh) | 2015-03-06 | 2022-12-21 | 荷蘭商露明控股公司 | 用於提供陶瓷磷光板至發光裝置（ｌｅｄ）晶粒之方法、用於切割或傳送陶瓷磷光板之帶、放置陶瓷磷光板於帶上之方法、及使用帶之方法 |
| JP6454580B2 (ja) * | 2015-03-30 | 2019-01-16 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
| US9741620B2 (en) * | 2015-06-24 | 2017-08-22 | Invensas Corporation | Structures and methods for reliable packages |
| US10947326B2 (en) * | 2015-07-29 | 2021-03-16 | Showa Denko Materials Co., Ltd. | Adhesive composition, cured article, semiconductor device, and production method for same |
| TW202524641A (zh) | 2016-01-15 | 2025-06-16 | 荷蘭商庫力克及索發荷蘭公司 | 放置超小或超薄之離散組件 |
| DE102016203413A1 (de) * | 2016-03-02 | 2017-09-07 | Tesa Se | Erhöhung der Abzugskraft durch selektive Plasmavorbehandlung |
| US10204893B2 (en) | 2016-05-19 | 2019-02-12 | Invensas Bonding Technologies, Inc. | Stacked dies and methods for forming bonded structures |
| US10269756B2 (en) | 2017-04-21 | 2019-04-23 | Invensas Bonding Technologies, Inc. | Die processing |
| US10879212B2 (en) | 2017-05-11 | 2020-12-29 | Invensas Bonding Technologies, Inc. | Processed stacked dies |
| US10217720B2 (en) | 2017-06-15 | 2019-02-26 | Invensas Corporation | Multi-chip modules formed using wafer-level processing of a reconstitute wafer |
| US10727219B2 (en) * | 2018-02-15 | 2020-07-28 | Invensas Bonding Technologies, Inc. | Techniques for processing devices |
| US11276676B2 (en) | 2018-05-15 | 2022-03-15 | Invensas Bonding Technologies, Inc. | Stacked devices and methods of fabrication |
| WO2020010265A1 (en) | 2018-07-06 | 2020-01-09 | Invensas Bonding Technologies, Inc. | Microelectronic assemblies |
| US11158606B2 (en) | 2018-07-06 | 2021-10-26 | Invensas Bonding Technologies, Inc. | Molded direct bonded and interconnected stack |
| JP7189705B2 (ja) * | 2018-09-03 | 2022-12-14 | 株式会社ディスコ | テープ貼着方法及びテープ拡張方法 |
| WO2020081533A1 (en) * | 2018-10-15 | 2020-04-23 | Lightmatter, Inc. | Photonic packages and related methods |
| CN113330557A (zh) | 2019-01-14 | 2021-08-31 | 伊文萨思粘合技术公司 | 键合结构 |
| TW202113412A (zh) | 2019-01-15 | 2021-04-01 | 美商萊特美特股份有限公司 | 高效率多槽式波導奈米光機電相位調變器 |
| US11296053B2 (en) | 2019-06-26 | 2022-04-05 | Invensas Bonding Technologies, Inc. | Direct bonded stack structures for increased reliability and improved yield in microelectronics |
| US12080672B2 (en) | 2019-09-26 | 2024-09-03 | Adeia Semiconductor Bonding Technologies Inc. | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive |
| KR102786304B1 (ko) * | 2019-10-29 | 2025-03-26 | 삼성전자 주식회사 | 접착 부재를 포함하는 전자 장치 |
| US11742314B2 (en) | 2020-03-31 | 2023-08-29 | Adeia Semiconductor Bonding Technologies Inc. | Reliable hybrid bonded apparatus |
| US11631647B2 (en) | 2020-06-30 | 2023-04-18 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages with integrated device die and dummy element |
| US11728273B2 (en) | 2020-09-04 | 2023-08-15 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US11764177B2 (en) | 2020-09-04 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US12550799B2 (en) | 2021-03-31 | 2026-02-10 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonding methods and structures |
| US12604771B2 (en) | 2021-10-28 | 2026-04-14 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonding methods and structures |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4308331A (en) | 1979-03-02 | 1981-12-29 | Canon Kabushiki Kaisha | Screen photosensitive member and electrophotographic method |
| US4879430A (en) * | 1987-05-14 | 1989-11-07 | Plicon Corporation | Patterned adherent film structures and process for making |
| US5139804A (en) | 1987-05-14 | 1992-08-18 | Plicon, Inc. | Patterned adherent film structures and process for making |
| JPH0715087B2 (ja) | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
| US5049085A (en) * | 1989-12-22 | 1991-09-17 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
| DE4230784A1 (de) * | 1992-09-15 | 1994-03-17 | Beiersdorf Ag | Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape) |
| JP3483161B2 (ja) | 1994-08-11 | 2004-01-06 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
| JP3521099B2 (ja) | 1994-11-29 | 2004-04-19 | リンテック株式会社 | ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート |
| TW505942B (en) | 2000-06-29 | 2002-10-11 | Matsushita Electric Industrial Co Ltd | Method and apparatus for forming pattern onto panel substrate |
| US6472065B1 (en) * | 2000-07-13 | 2002-10-29 | 3M Innovative Properties Company | Clear adhesive sheet |
| US7022546B2 (en) * | 2000-12-05 | 2006-04-04 | Analog Devices, Inc. | Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| US6793759B2 (en) | 2001-10-09 | 2004-09-21 | Dow Corning Corporation | Method for creating adhesion during fabrication of electronic devices |
| US7534498B2 (en) * | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
| US7396869B2 (en) * | 2002-12-04 | 2008-07-08 | Denovus Llc | Metallic acrylate curing agents and usage thereof in intermediate compositions |
| JP2004273895A (ja) * | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | 半導体ウエーハの分割方法 |
| KR101121495B1 (ko) * | 2003-05-12 | 2012-03-15 | 가부시키가이샤 토쿄 세이미쯔 | 판상부재의 분할방법 및 분할장치 |
| JP2004349441A (ja) | 2003-05-22 | 2004-12-09 | Shin Etsu Chem Co Ltd | ダイシング・ダイボンド用接着テープ |
| US20060252234A1 (en) * | 2004-07-07 | 2006-11-09 | Lintec Corporation | Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
| JP2006104246A (ja) | 2004-10-01 | 2006-04-20 | Sumitomo Chemical Co Ltd | 粘着用積層体 |
| JP4799205B2 (ja) | 2006-02-16 | 2011-10-26 | 日東電工株式会社 | 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法 |
| JP4970863B2 (ja) | 2006-07-13 | 2012-07-11 | 日東電工株式会社 | 被加工物の加工方法 |
| US8758682B2 (en) * | 2006-09-29 | 2014-06-24 | Ge Healthcare Bio-Sciences Ab | Method and device for small scale reactions |
| WO2008115711A1 (en) | 2007-03-16 | 2008-09-25 | 3M Innovative Properties Company | Dicing and die attach adhesive |
-
2009
- 2009-03-04 CN CN2009801157248A patent/CN102015943A/zh active Pending
- 2009-03-04 JP JP2010549837A patent/JP2011513995A/ja not_active Withdrawn
- 2009-03-04 KR KR1020107021970A patent/KR20100122110A/ko not_active Withdrawn
- 2009-03-04 WO PCT/US2009/035948 patent/WO2009114345A1/en not_active Ceased
- 2009-03-04 EP EP09719469A patent/EP2257608A1/en not_active Withdrawn
- 2009-03-06 US US12/399,054 patent/US7858499B2/en not_active Expired - Fee Related
- 2009-03-06 TW TW098107450A patent/TW200947543A/zh unknown
-
2010
- 2010-11-15 US US12/946,185 patent/US8008783B2/en not_active Expired - Fee Related
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