JP2011501426A5 - - Google Patents
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- Publication number
- JP2011501426A5 JP2011501426A5 JP2010529422A JP2010529422A JP2011501426A5 JP 2011501426 A5 JP2011501426 A5 JP 2011501426A5 JP 2010529422 A JP2010529422 A JP 2010529422A JP 2010529422 A JP2010529422 A JP 2010529422A JP 2011501426 A5 JP2011501426 A5 JP 2011501426A5
- Authority
- JP
- Japan
- Prior art keywords
- getter
- layer
- sublayer
- adjustment
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 230000004913 activation Effects 0.000 claims 4
- 230000003750 conditioning effect Effects 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 2
- 239000011651 chromium Substances 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 230000007423 decrease Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0707212A FR2922202B1 (fr) | 2007-10-15 | 2007-10-15 | Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication. |
| FR0707212 | 2007-10-15 | ||
| PCT/FR2008/001420 WO2009087284A1 (fr) | 2007-10-15 | 2008-10-09 | Structure comportant une couche getter et une sous-couche d'ajustement et procédé de fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011501426A JP2011501426A (ja) | 2011-01-06 |
| JP2011501426A5 true JP2011501426A5 (enExample) | 2011-12-01 |
| JP5431343B2 JP5431343B2 (ja) | 2014-03-05 |
Family
ID=39462016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010529422A Active JP5431343B2 (ja) | 2007-10-15 | 2008-10-09 | ゲッタ層と調整サブ層とを備える構造および製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8605445B2 (enExample) |
| EP (2) | EP2204347B1 (enExample) |
| JP (1) | JP5431343B2 (enExample) |
| AT (1) | ATE497481T1 (enExample) |
| CA (1) | CA2701363A1 (enExample) |
| DE (1) | DE602008004848D1 (enExample) |
| FR (1) | FR2922202B1 (enExample) |
| WO (1) | WO2009087284A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3271272B2 (ja) | 1991-11-12 | 2002-04-02 | 日本電気株式会社 | 半導体装置の製造方法 |
| FR2950877B1 (fr) | 2009-10-07 | 2012-01-13 | Commissariat Energie Atomique | Structure a cavite comportant une interface de collage a base de materiau getter |
| FR2950876B1 (fr) | 2009-10-07 | 2012-02-10 | Commissariat Energie Atomique | Procede de traitement d'un materiau getter et procede d'encapsulation d'un tel materiau getter |
| FR2952627A1 (fr) | 2009-11-17 | 2011-05-20 | Commissariat Energie Atomique | Getter ayant deux temperatures d'activation et structure comportant ce getter |
| EP2363373A1 (en) * | 2010-03-02 | 2011-09-07 | SensoNor Technologies AS | Bonding process for sensitive micro-and nano-systems |
| FR2967150A1 (fr) * | 2010-11-09 | 2012-05-11 | Commissariat Energie Atomique | Procédé de réalisation de substrat a couches enfouies de matériau getter |
| FR2967302B1 (fr) | 2010-11-09 | 2012-12-21 | Commissariat Energie Atomique | Structure d'encapsulation d'un micro-dispositif comportant un matériau getter |
| FR2976932A1 (fr) * | 2011-06-23 | 2012-12-28 | Commissariat Energie Atomique | Structure a materiau getter protege hermetiquement lors de sa realisation |
| FR2977883B1 (fr) | 2011-07-11 | 2014-03-14 | Commissariat Energie Atomique | Structure getter a capacite de pompage optimisee |
| FR2981198B1 (fr) * | 2011-10-11 | 2014-04-04 | Commissariat Energie Atomique | Structure d'encapsulation de dispositif electronique et procede de realisation d'une telle structure |
| FR2981059A1 (fr) | 2011-10-11 | 2013-04-12 | Commissariat Energie Atomique | Procede d'encapsulation de micro-dispositif par report de capot et depot de getter a travers le capot |
| FR2982073B1 (fr) * | 2011-10-28 | 2014-10-10 | Commissariat Energie Atomique | Structure d'encapsulation hermetique d'un dispositif et d'un composant electronique |
| WO2013191656A1 (en) * | 2012-06-20 | 2013-12-27 | Agency For Science, Technology And Research | A layer arrangement and a wafer level package comprising the layer arrangement |
| JP6230286B2 (ja) * | 2012-08-20 | 2017-11-15 | セイコーインスツル株式会社 | 電子デバイス及び電子デバイスの製造方法 |
| JP6230285B2 (ja) * | 2012-08-24 | 2017-11-15 | セイコーインスツル株式会社 | 電子デバイス、memsセンサ及び電子デバイスの製造方法 |
| CN103140026B (zh) * | 2013-02-04 | 2015-12-02 | 深圳市佳捷特陶瓷电路技术有限公司 | 陶瓷覆铜板及其制备方法 |
| EP2813465B1 (en) * | 2013-06-12 | 2020-01-15 | Tronic's Microsystems | MEMS device with getter layer |
| FR3008965B1 (fr) | 2013-07-26 | 2017-03-03 | Commissariat Energie Atomique | Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter |
| US9637378B2 (en) * | 2013-09-11 | 2017-05-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cup-like getter scheme |
| US9242853B2 (en) | 2013-10-15 | 2016-01-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of improving getter efficiency by increasing superficial area |
| FR3014240B1 (fr) | 2013-11-29 | 2017-05-05 | Commissariat Energie Atomique | Procede de realisation d'un substrat comportant un materiau getter dispose sur des parois d'un ou plusieurs trous borgnes formes dans le substrat |
| FR3014241B1 (fr) | 2013-11-29 | 2017-05-05 | Commissariat Energie Atomique | Structure d'encapsulation comprenant des tranchees partiellement remplies de materiau getter |
| FR3030475B1 (fr) | 2014-12-17 | 2017-01-20 | Commissariat Energie Atomique | Structure getter multi-niveaux et structure d'encapsulation comportant une telle structure getter multi-niveaux |
| US9718672B2 (en) | 2015-05-27 | 2017-08-01 | Globalfoundries Singapore Pte. Ltd. | Electronic devices including substantially hermetically sealed cavities and getter films with Kelvin measurement arrangement for evaluating the getter films and methods for fabricating the same |
| US9438411B1 (en) | 2015-08-12 | 2016-09-06 | The Boeing Company | Method and apparatus for synchronizing digital messages |
| US9570321B1 (en) * | 2015-10-20 | 2017-02-14 | Raytheon Company | Use of an external getter to reduce package pressure |
| JP2018054496A (ja) * | 2016-09-29 | 2018-04-05 | セイコーインスツル株式会社 | パッケージおよび赤外線センサ |
| FR3072788B1 (fr) | 2017-10-24 | 2020-05-29 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Source de rayonnement infrarouge modulable |
| CN108249386B (zh) * | 2018-01-23 | 2020-09-08 | 苏州大学 | 激活温度可控的非蒸散型薄膜吸气剂及其应用 |
| US10526199B1 (en) * | 2018-09-27 | 2020-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | High efficiency getter design in vacuum MEMS device |
| JP2021136413A (ja) * | 2020-02-28 | 2021-09-13 | 国立研究開発法人産業技術総合研究所 | 封止構造体およびその製造方法 |
| CN111892014B (zh) * | 2020-07-30 | 2023-10-31 | 钢铁研究总院 | 一种吸气薄膜及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4127134A (en) * | 1977-04-11 | 1978-11-28 | Cordis Corporation | Gas-absorbing pacer and method of fabrication |
| US4302498A (en) * | 1980-10-28 | 1981-11-24 | Rca Corporation | Laminated conducting film on an integrated circuit substrate and method of forming the laminate |
| US4814945A (en) * | 1987-09-18 | 1989-03-21 | Trw Inc. | Multilayer printed circuit board for ceramic chip carriers |
| US5577020A (en) * | 1993-10-08 | 1996-11-19 | Tdk Corporation | Magneto-optical disc with intermediate film layer between a recording film and a dielectric film |
| US5456740A (en) * | 1994-06-22 | 1995-10-10 | Millipore Corporation | High-efficiency metal membrane getter element and process for making |
| TW447144B (en) * | 1995-03-27 | 2001-07-21 | Semiconductor Energy Lab | Semiconductor device and a method of manufacturing the same |
| US5943601A (en) | 1997-04-30 | 1999-08-24 | International Business Machines Corporation | Process for fabricating a metallization structure |
| US5866978A (en) * | 1997-09-30 | 1999-02-02 | Fed Corporation | Matrix getter for residual gas in vacuum sealed panels |
| US6110808A (en) | 1998-12-04 | 2000-08-29 | Trw Inc. | Hydrogen getter for integrated microelectronic assembly |
| US6423575B1 (en) | 2001-07-27 | 2002-07-23 | Dean Tran | Hydrogen gettering structure including silver-doped palladium layer to increase hydrogen gettering of module component and semiconductor device module having such structure, and methods of fabrication |
| US20030062610A1 (en) * | 2001-09-28 | 2003-04-03 | Kovacs Alan L. | Multilayer thin film hydrogen getter |
| US6923625B2 (en) | 2002-01-07 | 2005-08-02 | Integrated Sensing Systems, Inc. | Method of forming a reactive material and article formed thereby |
| JP2004066225A (ja) * | 2002-06-13 | 2004-03-04 | Lg Electronics Inc | ゲッタの組成物及び該ゲッタの組成物を利用した電界放出表示装置 |
| US6806557B2 (en) * | 2002-09-30 | 2004-10-19 | Motorola, Inc. | Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum |
| US6988924B2 (en) * | 2003-04-14 | 2006-01-24 | Hewlett-Packard Development Company, L.P. | Method of making a getter structure |
| ITMI20031178A1 (it) | 2003-06-11 | 2004-12-12 | Getters Spa | Depositi multistrato getter non evaporabili ottenuti per |
| ITMI20032209A1 (it) * | 2003-11-14 | 2005-05-15 | Getters Spa | Processo per la produzione di dispositivi che richiedono per il loro funzionamento un materiale getter non evaporabile. |
| US20060230927A1 (en) | 2005-04-02 | 2006-10-19 | Xiaobing Xie | Hydrogen separation |
| ITMI20050616A1 (it) | 2005-04-12 | 2006-10-13 | Getters Spa | Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti |
| ITMI20052343A1 (it) * | 2005-12-06 | 2007-06-07 | Getters Spa | Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti |
-
2007
- 2007-10-15 FR FR0707212A patent/FR2922202B1/fr not_active Expired - Fee Related
-
2008
- 2008-10-09 AT AT08869876T patent/ATE497481T1/de not_active IP Right Cessation
- 2008-10-09 CA CA2701363A patent/CA2701363A1/fr not_active Abandoned
- 2008-10-09 US US12/679,487 patent/US8605445B2/en active Active
- 2008-10-09 JP JP2010529422A patent/JP5431343B2/ja active Active
- 2008-10-09 WO PCT/FR2008/001420 patent/WO2009087284A1/fr not_active Ceased
- 2008-10-09 EP EP10158202.1A patent/EP2204347B1/fr active Active
- 2008-10-09 EP EP08869876A patent/EP2197780B1/fr active Active
- 2008-10-09 DE DE602008004848T patent/DE602008004848D1/de active Active
-
2010
- 2010-03-23 US US12/729,634 patent/US8414963B2/en active Active
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