JP2011258664A5 - - Google Patents

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Publication number
JP2011258664A5
JP2011258664A5 JP2010130422A JP2010130422A JP2011258664A5 JP 2011258664 A5 JP2011258664 A5 JP 2011258664A5 JP 2010130422 A JP2010130422 A JP 2010130422A JP 2010130422 A JP2010130422 A JP 2010130422A JP 2011258664 A5 JP2011258664 A5 JP 2011258664A5
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JP
Japan
Prior art keywords
layer
tin
forming
titanium
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010130422A
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English (en)
Japanese (ja)
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JP5498864B2 (ja
JP2011258664A (ja
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Application filed filed Critical
Priority to JP2010130422A priority Critical patent/JP5498864B2/ja
Priority claimed from JP2010130422A external-priority patent/JP5498864B2/ja
Priority to US13/153,590 priority patent/US8664536B2/en
Publication of JP2011258664A publication Critical patent/JP2011258664A/ja
Publication of JP2011258664A5 publication Critical patent/JP2011258664A5/ja
Application granted granted Critical
Publication of JP5498864B2 publication Critical patent/JP5498864B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010130422A 2010-06-07 2010-06-07 配線基板及び配線基板の製造方法 Active JP5498864B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010130422A JP5498864B2 (ja) 2010-06-07 2010-06-07 配線基板及び配線基板の製造方法
US13/153,590 US8664536B2 (en) 2010-06-07 2011-06-06 Wiring substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010130422A JP5498864B2 (ja) 2010-06-07 2010-06-07 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011258664A JP2011258664A (ja) 2011-12-22
JP2011258664A5 true JP2011258664A5 (enExample) 2013-05-16
JP5498864B2 JP5498864B2 (ja) 2014-05-21

Family

ID=45063591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010130422A Active JP5498864B2 (ja) 2010-06-07 2010-06-07 配線基板及び配線基板の製造方法

Country Status (2)

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US (1) US8664536B2 (enExample)
JP (1) JP5498864B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5608430B2 (ja) * 2010-06-07 2014-10-15 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP2012212867A (ja) * 2011-03-30 2012-11-01 Ibiden Co Ltd プリント配線板及びその製造方法
WO2017100752A2 (en) * 2015-12-11 2017-06-15 Thin Film Electronics Asa Electronic device having a plated antenna and/or trace, and methods of making and using the same
WO2017199712A1 (ja) * 2016-05-16 2017-11-23 株式会社村田製作所 セラミック電子部品
CN111293072B (zh) * 2018-12-10 2023-06-20 联华电子股份有限公司 半导体元件及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261167A (ja) * 2005-03-15 2006-09-28 Murata Mfg Co Ltd 配線基板およびその製造方法
JP5082253B2 (ja) * 2006-02-10 2012-11-28 大日本印刷株式会社 受動素子内蔵配線基板およびその製造方法
JP5231733B2 (ja) * 2006-11-27 2013-07-10 パナソニック株式会社 貫通孔配線構造およびその形成方法
JP2009238957A (ja) * 2008-03-26 2009-10-15 Panasonic Electric Works Co Ltd 基板へのビアの形成方法
JP5343245B2 (ja) * 2008-05-15 2013-11-13 新光電気工業株式会社 シリコンインターポーザの製造方法
JP2010050116A (ja) * 2008-08-19 2010-03-04 Fcm Kk 多層積層回路基板
US7741148B1 (en) * 2008-12-10 2010-06-22 Stats Chippac, Ltd. Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
US8248803B2 (en) * 2010-03-31 2012-08-21 Hong Kong Applied Science and Technology Research Institute Company Limited Semiconductor package and method of manufacturing the same

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