JP2011253841A - ウェーハ保持具 - Google Patents
ウェーハ保持具 Download PDFInfo
- Publication number
- JP2011253841A JP2011253841A JP2010124685A JP2010124685A JP2011253841A JP 2011253841 A JP2011253841 A JP 2011253841A JP 2010124685 A JP2010124685 A JP 2010124685A JP 2010124685 A JP2010124685 A JP 2010124685A JP 2011253841 A JP2011253841 A JP 2011253841A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- support member
- wafer holder
- suction
- suction hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013013 elastic material Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 159
- 238000004140 cleaning Methods 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 238000000227 grinding Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polybutylene naphthalate Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010124685A JP2011253841A (ja) | 2010-05-31 | 2010-05-31 | ウェーハ保持具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010124685A JP2011253841A (ja) | 2010-05-31 | 2010-05-31 | ウェーハ保持具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011253841A true JP2011253841A (ja) | 2011-12-15 |
| JP2011253841A5 JP2011253841A5 (https=) | 2013-06-06 |
Family
ID=45417571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010124685A Pending JP2011253841A (ja) | 2010-05-31 | 2010-05-31 | ウェーハ保持具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011253841A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019130740A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社Sumco | 吸着チャック |
| JP2022172553A (ja) * | 2021-05-06 | 2022-11-17 | 株式会社ディスコ | 吸引保持テーブル及び加工装置 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63208459A (ja) * | 1987-02-25 | 1988-08-29 | Shiyouda Tekko Kk | 吸着テ−ブル |
| JPH06244093A (ja) * | 1993-02-17 | 1994-09-02 | Hitachi Ltd | 基板保持方法ならびにそれを用いた薄膜多層基板の製造方法および装置 |
| JPH06349896A (ja) * | 1993-06-02 | 1994-12-22 | Shibuya Kogyo Co Ltd | 基板固定装置 |
| JP2000126959A (ja) * | 1998-10-27 | 2000-05-09 | Tokyo Seimitsu Co Ltd | 被加工材のチャックテーブル |
| JP2000323556A (ja) * | 1999-05-13 | 2000-11-24 | Komatsu Electronic Metals Co Ltd | エピタキシャルウェーハ製造装置 |
| US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
| JP2006054286A (ja) * | 2004-08-11 | 2006-02-23 | Seiko Epson Corp | 真空チャック治具及び真空チャック方法並びに液滴吐出ヘッドの製造方法 |
| JP2007189226A (ja) * | 2006-01-10 | 2007-07-26 | Hanmi Semiconductor Co Ltd | 半導体製造工程用テーブル |
| JP2007276065A (ja) * | 2006-04-07 | 2007-10-25 | Dainippon Printing Co Ltd | 基板吸着保持装置及び配線基板ユニットの製造装置 |
| JP2008515187A (ja) * | 2004-09-27 | 2008-05-08 | ロッコ・システムズ・プライベイト・リミテッド | 変換キット |
| JP2009252848A (ja) * | 2008-04-02 | 2009-10-29 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
| JP2010056341A (ja) * | 2008-08-28 | 2010-03-11 | Lintec Corp | 支持装置 |
| JP2010103286A (ja) * | 2008-10-23 | 2010-05-06 | Lintec Corp | 支持装置 |
-
2010
- 2010-05-31 JP JP2010124685A patent/JP2011253841A/ja active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63208459A (ja) * | 1987-02-25 | 1988-08-29 | Shiyouda Tekko Kk | 吸着テ−ブル |
| JPH06244093A (ja) * | 1993-02-17 | 1994-09-02 | Hitachi Ltd | 基板保持方法ならびにそれを用いた薄膜多層基板の製造方法および装置 |
| JPH06349896A (ja) * | 1993-06-02 | 1994-12-22 | Shibuya Kogyo Co Ltd | 基板固定装置 |
| JP2000126959A (ja) * | 1998-10-27 | 2000-05-09 | Tokyo Seimitsu Co Ltd | 被加工材のチャックテーブル |
| JP2000323556A (ja) * | 1999-05-13 | 2000-11-24 | Komatsu Electronic Metals Co Ltd | エピタキシャルウェーハ製造装置 |
| US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
| JP2006054286A (ja) * | 2004-08-11 | 2006-02-23 | Seiko Epson Corp | 真空チャック治具及び真空チャック方法並びに液滴吐出ヘッドの製造方法 |
| JP2008515187A (ja) * | 2004-09-27 | 2008-05-08 | ロッコ・システムズ・プライベイト・リミテッド | 変換キット |
| JP2007189226A (ja) * | 2006-01-10 | 2007-07-26 | Hanmi Semiconductor Co Ltd | 半導体製造工程用テーブル |
| JP2007276065A (ja) * | 2006-04-07 | 2007-10-25 | Dainippon Printing Co Ltd | 基板吸着保持装置及び配線基板ユニットの製造装置 |
| JP2009252848A (ja) * | 2008-04-02 | 2009-10-29 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
| JP2010056341A (ja) * | 2008-08-28 | 2010-03-11 | Lintec Corp | 支持装置 |
| JP2010103286A (ja) * | 2008-10-23 | 2010-05-06 | Lintec Corp | 支持装置 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019130740A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社Sumco | 吸着チャック |
| JP2019117873A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社Sumco | 吸着チャック |
| TWI684240B (zh) * | 2017-12-27 | 2020-02-01 | 日商Ｓｕｍｃｏ股份有限公司 | 吸附夾頭 |
| KR20200087849A (ko) * | 2017-12-27 | 2020-07-21 | 가부시키가이샤 사무코 | 흡착 척 |
| CN111771272A (zh) * | 2017-12-27 | 2020-10-13 | 胜高股份有限公司 | 吸附卡盘 |
| KR102340019B1 (ko) | 2017-12-27 | 2021-12-15 | 가부시키가이샤 사무코 | 흡착 척 |
| DE112018006636B4 (de) | 2017-12-27 | 2023-08-17 | Sumco Corporation | Vakuumchuck |
| CN111771272B (zh) * | 2017-12-27 | 2023-12-05 | 胜高股份有限公司 | 吸附卡盘 |
| JP2022172553A (ja) * | 2021-05-06 | 2022-11-17 | 株式会社ディスコ | 吸引保持テーブル及び加工装置 |
| JP7708581B2 (ja) | 2021-05-06 | 2025-07-15 | 株式会社ディスコ | 吸引保持テーブル及び加工装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI742023B (zh) | 基板處理裝置、從基板處理裝置之真空吸附台脫附基板之方法、以及將基板載置於基板處理裝置之真空吸附台之方法 | |
| JP5652832B2 (ja) | チャック装置、及びチャック方法 | |
| TWI794570B (zh) | 洗淨頭、中心刷、外周刷、基板洗淨裝置及基板洗淨方法 | |
| TW201838080A (zh) | 真空吸著墊及基板保持裝置 | |
| US12020976B2 (en) | Substrate processing apparatus and method for removing substrate from table of substrate processing apparatus | |
| CN110246797A (zh) | 晶圆固定装置、晶圆固定基座及晶圆真空吸盘 | |
| JP5183169B2 (ja) | ウェーハ処理装置 | |
| JP3602943B2 (ja) | 半導体ウエハの研削装置 | |
| JP2011253841A (ja) | ウェーハ保持具 | |
| CN115383616B (zh) | 研磨装置、研磨方法及硅片 | |
| JP2012064800A (ja) | ウェーハ洗浄装置 | |
| JP2023133420A (ja) | ウェハ保持装置及びウェハ搬送保持装置 | |
| JP2004040011A (ja) | 基板の供給取出治具、供給取出装置および供給取出方法 | |
| JP2004283936A (ja) | 真空吸着装置 | |
| KR101466756B1 (ko) | 웨이퍼 세정장치 및 방법 | |
| JP2015138859A (ja) | ウエハチャックおよびウエハチャック補助具 | |
| JP2010232528A (ja) | 枚葉式洗浄装置 | |
| CN110605636A (zh) | 卡盘台、磨削装置及磨削品的制造方法 | |
| TWI642138B (zh) | 晶圓固定裝置、晶圓固定基座及晶圓真空吸盤 | |
| JPH02252238A (ja) | 基板の洗浄装置 | |
| JP2005109057A (ja) | 基板搬送器具 | |
| JP2006013079A (ja) | 半導体装置の製造装置 | |
| KR100634450B1 (ko) | 화학적 기계적 연마 장치 및 이에 사용되는 플레이튼 | |
| CN108273774A (zh) | 清洁装置及清洁方法、晶圆加工装置及加工方法 | |
| KR102340019B1 (ko) | 흡착 척 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130418 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130418 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140220 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140701 |