JP2011249836A5 - - Google Patents
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- Publication number
- JP2011249836A5 JP2011249836A5 JP2011170349A JP2011170349A JP2011249836A5 JP 2011249836 A5 JP2011249836 A5 JP 2011249836A5 JP 2011170349 A JP2011170349 A JP 2011170349A JP 2011170349 A JP2011170349 A JP 2011170349A JP 2011249836 A5 JP2011249836 A5 JP 2011249836A5
- Authority
- JP
- Japan
- Prior art keywords
- coil
- oxide layer
- type electronic
- electronic component
- soft magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 29
- 229910052742 iron Inorganic materials 0.000 claims description 17
- 239000006249 magnetic particle Substances 0.000 claims description 17
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 15
- 229910052804 chromium Inorganic materials 0.000 claims description 15
- 239000011651 chromium Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011170349A JP5492155B2 (ja) | 2010-04-30 | 2011-08-03 | コイル型電子部品 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010105552 | 2010-04-30 | ||
| JP2010105552 | 2010-04-30 | ||
| JP2011170349A JP5492155B2 (ja) | 2010-04-30 | 2011-08-03 | コイル型電子部品 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011091879A Division JP4866971B2 (ja) | 2010-04-30 | 2011-04-18 | コイル型電子部品およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011249836A JP2011249836A (ja) | 2011-12-08 |
| JP2011249836A5 true JP2011249836A5 (enExample) | 2012-06-07 |
| JP5492155B2 JP5492155B2 (ja) | 2014-05-14 |
Family
ID=45414619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011170349A Active JP5492155B2 (ja) | 2010-04-30 | 2011-08-03 | コイル型電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5492155B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013099297A1 (ja) * | 2011-12-28 | 2013-07-04 | 太陽誘電株式会社 | 積層インダクタ |
| JP6159512B2 (ja) * | 2012-07-04 | 2017-07-05 | 太陽誘電株式会社 | インダクタ |
| JP6358491B2 (ja) * | 2013-12-26 | 2018-07-18 | 日立金属株式会社 | 圧粉磁心、それを用いたコイル部品および圧粉磁心の製造方法 |
| KR102195952B1 (ko) | 2014-03-13 | 2020-12-28 | 히타치 긴조쿠 가부시키가이샤 | 압분 자심의 제조 방법 및 압분 자심 |
| KR101580399B1 (ko) * | 2014-06-24 | 2015-12-23 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
| JP6369749B2 (ja) * | 2014-06-25 | 2018-08-08 | 日立金属株式会社 | 磁心およびそれを用いたコイル部品 |
| WO2016010098A1 (ja) | 2014-07-16 | 2016-01-21 | 日立金属株式会社 | 磁心、磁心の製造方法およびコイル部品 |
| JP7015647B2 (ja) * | 2016-06-30 | 2022-02-03 | 太陽誘電株式会社 | 磁性材料及び電子部品 |
| JP6460505B2 (ja) * | 2018-06-22 | 2019-01-30 | 日立金属株式会社 | 圧粉磁心の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019134A (ja) * | 2005-07-06 | 2007-01-25 | Matsushita Electric Ind Co Ltd | 複合磁性材料の製造方法 |
| JP2007123703A (ja) * | 2005-10-31 | 2007-05-17 | Mitsubishi Materials Pmg Corp | Ｓｉ酸化膜被覆軟磁性粉末 |
| JP2007299871A (ja) * | 2006-04-28 | 2007-11-15 | Matsushita Electric Ind Co Ltd | 複合磁性体の製造方法およびそれを用いて得られた複合磁性体 |
| JP2008028162A (ja) * | 2006-07-21 | 2008-02-07 | Sumitomo Electric Ind Ltd | 軟磁性材料の製造方法、軟磁性材料、および圧粉磁心 |
| JP4585493B2 (ja) * | 2006-08-07 | 2010-11-24 | 株式会社東芝 | 絶縁性磁性材料の製造方法 |
| JP5099480B2 (ja) * | 2007-02-09 | 2012-12-19 | 日立金属株式会社 | 軟磁性金属粉末、圧粉体、および軟磁性金属粉末の製造方法 |
| JP5093008B2 (ja) * | 2007-09-12 | 2012-12-05 | セイコーエプソン株式会社 | 酸化物被覆軟磁性粉末の製造方法、酸化物被覆軟磁性粉末、圧粉磁心および磁性素子 |
| JP2009088502A (ja) * | 2007-09-12 | 2009-04-23 | Seiko Epson Corp | 酸化物被覆軟磁性粉末の製造方法、酸化物被覆軟磁性粉末、圧粉磁心および磁性素子 |
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2011
- 2011-08-03 JP JP2011170349A patent/JP5492155B2/ja active Active
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