JP2011241412A5 - - Google Patents

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Publication number
JP2011241412A5
JP2011241412A5 JP2010112266A JP2010112266A JP2011241412A5 JP 2011241412 A5 JP2011241412 A5 JP 2011241412A5 JP 2010112266 A JP2010112266 A JP 2010112266A JP 2010112266 A JP2010112266 A JP 2010112266A JP 2011241412 A5 JP2011241412 A5 JP 2011241412A5
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JP
Japan
Prior art keywords
atomic
copper alloy
copper
range
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010112266A
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English (en)
Japanese (ja)
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JP2011241412A (ja
JP5045783B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010112266A external-priority patent/JP5045783B2/ja
Priority to JP2010112266A priority Critical patent/JP5045783B2/ja
Priority to EP15175001.5A priority patent/EP2952595B1/en
Priority to EP11780706.5A priority patent/EP2570506B1/en
Priority to MYPI2014002778A priority patent/MY189251A/en
Priority to EP15193144.1A priority patent/EP3020836A3/en
Priority to KR1020137031600A priority patent/KR101570919B1/ko
Priority to PCT/JP2011/061036 priority patent/WO2011142450A1/ja
Priority to US13/695,666 priority patent/US10056165B2/en
Priority to EP15193147.4A priority patent/EP3009523B1/en
Priority to CN201180018491.7A priority patent/CN102822363B/zh
Priority to TW100116878A priority patent/TWI441931B/zh
Priority to PH1/2012/502195A priority patent/PH12012502195A1/en
Priority to SG2012078978A priority patent/SG185024A1/en
Priority to MYPI2012700829A priority patent/MY168183A/en
Priority to KR1020127025942A priority patent/KR101369693B1/ko
Publication of JP2011241412A publication Critical patent/JP2011241412A/ja
Publication of JP2011241412A5 publication Critical patent/JP2011241412A5/ja
Publication of JP5045783B2 publication Critical patent/JP5045783B2/ja
Application granted granted Critical
Priority to US14/291,335 priority patent/US10032536B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010112266A 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Active JP5045783B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2010112266A JP5045783B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
TW100116878A TWI441931B (zh) 2010-05-14 2011-05-13 電子機器用銅合金、電子機器用銅合金之製造方法、及電子機器用銅合金滾壓材
SG2012078978A SG185024A1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
MYPI2014002778A MY189251A (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
EP15193144.1A EP3020836A3 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing it, and rolled copper alloy for electronic device
KR1020137031600A KR101570919B1 (ko) 2010-05-14 2011-05-13 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
PCT/JP2011/061036 WO2011142450A1 (ja) 2010-05-14 2011-05-13 電子機器用銅合金、電子機器用銅合金の製造方法、及び電子機器用銅合金圧延材
US13/695,666 US10056165B2 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
EP15193147.4A EP3009523B1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing it, and rolled material from it
CN201180018491.7A CN102822363B (zh) 2010-05-14 2011-05-13 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
EP15175001.5A EP2952595B1 (en) 2010-05-14 2011-05-13 Copper alloy and material rolled thereof for electronic device and method for producing this alloy
PH1/2012/502195A PH12012502195A1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
EP11780706.5A EP2570506B1 (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing this alloy, and copper alloy rolled material for this device
MYPI2012700829A MY168183A (en) 2010-05-14 2011-05-13 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
KR1020127025942A KR101369693B1 (ko) 2010-05-14 2011-05-13 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 및 전자 기기용 구리 합금 압연재
US14/291,335 US10032536B2 (en) 2010-05-14 2014-05-30 Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010112266A JP5045783B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Publications (3)

Publication Number Publication Date
JP2011241412A JP2011241412A (ja) 2011-12-01
JP2011241412A5 true JP2011241412A5 (https=) 2012-02-09
JP5045783B2 JP5045783B2 (ja) 2012-10-10

Family

ID=45408382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010112266A Active JP5045783B2 (ja) 2010-05-14 2010-05-14 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Country Status (1)

Country Link
JP (1) JP5045783B2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3020836A3 (en) 2010-05-14 2016-06-08 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing it, and rolled copper alloy for electronic device
TWI571518B (zh) 2011-08-29 2017-02-21 Furukawa Electric Co Ltd Copper alloy material and manufacturing method thereof
JP5903832B2 (ja) * 2011-10-28 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法、電子機器用銅合金圧延材及び電子機器用部品
JP5903838B2 (ja) * 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
JP6248388B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248389B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248386B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP6248387B2 (ja) * 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP5962707B2 (ja) 2013-07-31 2016-08-03 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子
JP6311299B2 (ja) * 2013-12-11 2018-04-18 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子
JP5983589B2 (ja) 2013-12-11 2016-08-31 三菱マテリアル株式会社 電子・電気機器用銅合金圧延材、電子・電気機器用部品及び端子
KR101994015B1 (ko) 2015-09-09 2019-06-27 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 및, 버스바
EP3348656B1 (en) 2015-09-09 2020-12-30 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
SG11201710361SA (en) 2015-09-09 2018-03-28 Mitsubishi Materials Corp Copper alloy for electronic/electrical device, copper alloy plastically worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
TWI713579B (zh) 2015-09-09 2020-12-21 日商三菱綜合材料股份有限公司 電子／電氣機器用銅合金、電子／電氣機器用銅合金塑性加工材、電子／電氣機器用零件、端子以及匯流排
WO2017170699A1 (ja) 2016-03-30 2017-10-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
FI3438299T3 (fi) 2016-03-30 2023-05-23 Mitsubishi Materials Corp Kupariseoksesta valmistettu nauha elektronisia laitteita ja sähkölaitteita varten, komponentti, liitosnapa, virtakisko sekä liikuteltava kappale releitä varten
CN111788320B (zh) 2018-03-30 2022-01-14 三菱综合材料株式会社 电子电气设备用铜合金﹑电子电气设备用铜合金板条材、电子电气设备用组件、端子及汇流排
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2722401B2 (ja) * 1988-10-20 1998-03-04 株式会社神戸製鋼所 耐マイグレーション性に優れた高導電性電気・電子部品配線用銅合金
JPH11186273A (ja) * 1997-12-19 1999-07-09 Ricoh Co Ltd 半導体装置及びその製造方法

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