JP2011238928A - チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 - Google Patents

チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 Download PDF

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Publication number
JP2011238928A
JP2011238928A JP2011104442A JP2011104442A JP2011238928A JP 2011238928 A JP2011238928 A JP 2011238928A JP 2011104442 A JP2011104442 A JP 2011104442A JP 2011104442 A JP2011104442 A JP 2011104442A JP 2011238928 A JP2011238928 A JP 2011238928A
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JP
Japan
Prior art keywords
terminal
chip package
light emitting
chip
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011104442A
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English (en)
Japanese (ja)
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JP2011238928A5 (https=
Inventor
Yong Jin Lee
永 鎭 李
Jeong-Wook Lee
庭 旭 李
Hiromi Bun
敬 美 文
Young Hee Song
永 僖 宋
Ll Heung Choi
一 興 崔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung LED Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung LED Co Ltd filed Critical Samsung LED Co Ltd
Publication of JP2011238928A publication Critical patent/JP2011238928A/ja
Publication of JP2011238928A5 publication Critical patent/JP2011238928A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2011104442A 2010-05-07 2011-05-09 チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置 Pending JP2011238928A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0043171 2010-05-07
KR1020100043171A KR101662038B1 (ko) 2010-05-07 2010-05-07 칩 패키지

Publications (2)

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JP2011238928A true JP2011238928A (ja) 2011-11-24
JP2011238928A5 JP2011238928A5 (https=) 2014-06-26

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JP2011104442A Pending JP2011238928A (ja) 2010-05-07 2011-05-09 チップ・パッケージ用リードフレーム、チップ・パッケージ、パッケージ・モジュール及びパッケージ・モジュールを採用した照明装置

Country Status (6)

Country Link
US (1) US8455889B2 (https=)
EP (1) EP2385549B1 (https=)
JP (1) JP2011238928A (https=)
KR (1) KR101662038B1 (https=)
CN (1) CN102237485B (https=)
TW (1) TWI596727B (https=)

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* Cited by examiner, † Cited by third party
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JP2014036225A (ja) * 2012-08-08 2014-02-24 Samsung Display Co Ltd バックライトアセンブリー及びこれを有する表示装置
US9343643B2 (en) 2013-04-12 2016-05-17 Nichia Corporation Light emitting device
JP2016146480A (ja) * 2015-02-04 2016-08-12 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Ｌｅｄパッケージング構造及びその製造方法
JP2017004685A (ja) * 2015-06-08 2017-01-05 ウシオ電機株式会社 光源装置
WO2018168473A1 (ja) * 2017-03-15 2018-09-20 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール

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CN102446909B (zh) * 2010-09-30 2015-03-11 赛恩倍吉科技顾问（深圳）有限公司 发光二极管组合
US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
US8853726B2 (en) * 2011-08-25 2014-10-07 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
DE102011056708A1 (de) * 2011-12-20 2013-06-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Leiterrahmenverbund und optoelektronisches Halbleiterbauteil
CN104937326B (zh) * 2013-01-25 2018-10-26 亮锐控股有限公司 照明组件和用于制造照明组件的方法
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
TWI511339B (zh) * 2013-02-06 2015-12-01 Lite On Electronics Guangzhou 發光二極體封裝件及其導線架
CN103208717B (zh) * 2013-04-10 2015-08-05 大族激光科技产业集团股份有限公司 半导体单芯管的转接装置
CN104103748B (zh) * 2013-04-10 2016-12-07 重庆市路迪机械厂 发光二极管封装结构及其制造方法
CN103354266B (zh) * 2013-07-11 2015-12-23 江阴长电先进封装有限公司 一种薄型圆片级led的封装结构及其封装方法
US9166131B2 (en) * 2013-07-17 2015-10-20 Tai-Yin Huang Composite LED package and its application to light tubes
DE102014110614A1 (de) * 2014-07-28 2016-01-28 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
CN104752587B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
CN104779335B (zh) * 2015-04-14 2018-10-19 武汉华星光电技术有限公司 发光器件封装装置及照明装置
TWI587548B (zh) * 2015-09-07 2017-06-11 隆達電子股份有限公司 發光二極體封裝件
KR102261288B1 (ko) 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
DE102018124471B3 (de) * 2018-10-04 2019-12-05 Ledvance Gmbh Verfahren zum Herstellen eines Leadframes für eine Röhrenlampe, Leadframe und Röhrenlampe
CN111744026B (zh) * 2019-03-29 2023-08-18 东芝照明技术株式会社 紫外线放射装置以及照明装置
DE102020107409B4 (de) 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement

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JPS6153807U (https=) * 1984-09-13 1986-04-11
JPS61195076U (https=) * 1985-05-27 1986-12-04
JPH0715045A (ja) * 1992-05-11 1995-01-17 Susumu Kurokawa 面発光照明装置
JP2000183406A (ja) * 1998-12-15 2000-06-30 Matsushita Electric Works Ltd 発光ダイオード
JP2007059674A (ja) * 2005-08-25 2007-03-08 Japan Aviation Electronics Industry Ltd 発光素子実装型電気コネクタ及びそれを用いた発光素子モジュール
JP2007311786A (ja) * 2006-05-18 2007-11-29 Samsung Electro Mech Co Ltd 発光素子パッケージ及び発光素子パッケージアレイ
JP2010007750A (ja) * 2008-06-26 2010-01-14 Univance Corp 油圧式動力伝達装置
US20100072507A1 (en) * 2008-09-25 2010-03-25 Huang Shih-Chung Lead frame, and light emitting diode module having the same
JP2011146611A (ja) * 2010-01-18 2011-07-28 Stanley Electric Co Ltd 発光素子パッケージ、及びこれを用いた線状発光装置、面状発光装置

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KR100643016B1 (ko) 2000-09-07 2006-11-10 삼성전자주식회사 패키지 몸체에 접속 구멍을 갖는 적층형 멀티 칩 패키지및 이에 사용되는 리드프레임
JP3851174B2 (ja) * 2001-01-25 2006-11-29 松下電器産業株式会社 発光ユニット、発光ユニット組合せ体、および照明装置
JP2006186197A (ja) 2004-12-28 2006-07-13 Stanley Electric Co Ltd 発光装置
JP2007036073A (ja) 2005-07-29 2007-02-08 Hitachi Displays Ltd 照明装置およびこの照明装置を用いた表示装置
KR100764432B1 (ko) * 2006-04-05 2007-10-05 삼성전기주식회사 아노다이징 절연 층을 갖는 엘이디 패키지 및 그 제조방법
US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
KR20080081747A (ko) * 2007-03-06 2008-09-10 삼성전기주식회사 표면실장형 발광다이오드 소자
GB2452236A (en) 2007-03-09 2009-03-04 Mellowgraphic Ltd Party balloon with illumination device
KR101337580B1 (ko) 2007-08-21 2013-12-06 삼성전자주식회사 복구가 용이한 ｃｏｂ형 ｌｅｄ 패키지 및 복구방법
US7935575B2 (en) * 2008-04-07 2011-05-03 Semiconductor Components Industries, Llc Method of forming a semiconductor package and structure therefor
TWI372839B (en) * 2008-04-11 2012-09-21 Foxconn Tech Co Ltd Led unit
KR20100012170A (ko) 2008-07-28 2010-02-08 삼성전기주식회사 Ｌｅｄ 조명장치
KR101010375B1 (ko) 2008-08-06 2011-01-21 주식회사 동부하이텍 이미지센서 및 그 제조방법

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JPS6153807U (https=) * 1984-09-13 1986-04-11
JPS61195076U (https=) * 1985-05-27 1986-12-04
JPH0715045A (ja) * 1992-05-11 1995-01-17 Susumu Kurokawa 面発光照明装置
JP2000183406A (ja) * 1998-12-15 2000-06-30 Matsushita Electric Works Ltd 発光ダイオード
JP2007059674A (ja) * 2005-08-25 2007-03-08 Japan Aviation Electronics Industry Ltd 発光素子実装型電気コネクタ及びそれを用いた発光素子モジュール
JP2007311786A (ja) * 2006-05-18 2007-11-29 Samsung Electro Mech Co Ltd 発光素子パッケージ及び発光素子パッケージアレイ
JP2010007750A (ja) * 2008-06-26 2010-01-14 Univance Corp 油圧式動力伝達装置
US20100072507A1 (en) * 2008-09-25 2010-03-25 Huang Shih-Chung Lead frame, and light emitting diode module having the same
JP2011146611A (ja) * 2010-01-18 2011-07-28 Stanley Electric Co Ltd 発光素子パッケージ、及びこれを用いた線状発光装置、面状発光装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014036225A (ja) * 2012-08-08 2014-02-24 Samsung Display Co Ltd バックライトアセンブリー及びこれを有する表示装置
US9343643B2 (en) 2013-04-12 2016-05-17 Nichia Corporation Light emitting device
US9484503B2 (en) 2013-04-12 2016-11-01 Nichia Corporation Light emitting device
JP2016146480A (ja) * 2015-02-04 2016-08-12 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Ｌｅｄパッケージング構造及びその製造方法
JP2017004685A (ja) * 2015-06-08 2017-01-05 ウシオ電機株式会社 光源装置
WO2018168473A1 (ja) * 2017-03-15 2018-09-20 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール
JP2018152536A (ja) * 2017-03-15 2018-09-27 ミツミ電機株式会社 光学モジュールの製造方法及び光学モジュール
US10971666B2 (en) 2017-03-15 2021-04-06 Mitsumi Electric Co., Ltd. Method for manufacturing an optical module and optical module

Also Published As

Publication number Publication date
KR20110123606A (ko) 2011-11-15
TW201208025A (en) 2012-02-16
TWI596727B (zh) 2017-08-21
EP2385549A3 (en) 2013-10-09
KR101662038B1 (ko) 2016-10-05
EP2385549B1 (en) 2016-08-17
US20110272716A1 (en) 2011-11-10
CN102237485A (zh) 2011-11-09
EP2385549A2 (en) 2011-11-09
US8455889B2 (en) 2013-06-04
CN102237485B (zh) 2015-11-18

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