JP2011216754A - パワーモジュール及びそれを用いた電力変換装置 - Google Patents
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Abstract
【解決手段】本発明の課題を解決するために、本発明に係るパワーモジュールは、上それぞれの主面が対向する2枚の金属ベースと、前記一方の金属ベースはケースの第1開口部を塞ぐように配置され、かつ前記他方の金属ベースは前記ケースの第2開口部を塞ぐように配置され、さらに前記ケースと前記2枚の金属ベースとの接合箇所には樹脂系接着剤が塗布されており、前記ケースの内壁と樹脂封止材との間には、前記樹脂系接着剤が露出するように形成された空隙部を有し、当該空隙部は前記第1開口部と連通する。
【選択図】 図9
Description
Claims (4)
- それぞれの主面が対向する2枚の金属ベースと、
前記2枚の金属ベースの間に挟まれるパワー半導体素子と、
前記2枚の金属ベースの間に挟まれており、かつ前記半導体素子に電力供給するための端子と、
前記2枚の金属ベースと前記半導体素子と前記端子の一部とを封止するための樹脂封止材と、
前記樹脂封止材により封止された前記2枚の金属ベースを収納するためのケースと、を備え、
前記ケースは、前記2枚の金属ベースのうち一方の金属ベースを冷媒に直接接触させる第1開口部と、前記2枚の金属ベースのうち他方の金属ベースを前記冷媒に直接接触させる第2開口部と、前記端子を当該ケースの外部に突出させる第3開口部と、当該第3開口部と対向する有底部と、を形成し、
前記一方の金属ベースは前記ケースの前記第1開口部を塞ぐように配置され、かつ前記他方の金属ベースは前記ケースの前記第2開口部を塞ぐように配置され、さらに前記ケースと前記2枚の金属ベースとの接合箇所には樹脂系接着剤が塗布されており、
前記ケースの内壁と前記樹脂封止材との間には、前記樹脂系接着剤が露出するように形成された空隙部を有し、当該空隙部は前記第1開口部と連通するパワーモジュール。 - 請求項1に記載されたパワーモジュールであって、
前記ケースは、前記第1開口部が形成された第1ケース部材と、前記第2開口部が形成された第2ケース部材と、により構成され、
前記第1ケース部材と前記第2ケース部材との接合部には樹脂系接着剤が塗布されており、かつ当該第1ケース部材と当該第2ケース部材とを接合するための樹脂系接着剤は、前記空隙部に露出するように構成されるパワーモジュール。 - 請求項1または2に記載されたいずれかのパワーモジュールであって、
前記空隙部には、連続気泡をもった多孔質材料が挿入されているパワーモジュール。 - 請求項1または2に記載されたいずれかのパワーモジュールであって、
前記樹脂封止材の表面は、当該樹脂封止材よりも吸湿性の低い材料で被覆されているパワーモジュール。
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JP2010084773A JP5188530B2 (ja) | 2010-04-01 | 2010-04-01 | パワーモジュール及びそれを用いた電力変換装置 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013088870A1 (ja) * | 2011-12-15 | 2013-06-20 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュールおよびパワーモジュール |
JP2013179104A (ja) * | 2012-02-28 | 2013-09-09 | Hitachi Automotive Systems Ltd | 電力変換装置 |
WO2014050277A1 (ja) * | 2012-09-28 | 2014-04-03 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
US20150245523A1 (en) * | 2012-08-09 | 2015-08-27 | Hitachi Automotive System, Ltd. | Power Module |
DE102016219070B4 (de) | 2015-10-09 | 2022-06-02 | Schaeffler Technologies AG & Co. KG | Gehäuse für ein Halbbrückenmodul und ein Verfahren zur Herstellung einer Kühlstruktur |
Citations (7)
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JPH04127456A (ja) * | 1989-09-14 | 1992-04-28 | Toshiba Corp | 樹脂封止型半導体装置及びその製造方法 |
JPH11177074A (ja) * | 1997-12-10 | 1999-07-02 | Kyocera Corp | 固体撮像装置 |
JP2005057212A (ja) * | 2003-08-07 | 2005-03-03 | Toyota Motor Corp | 浸漬式両面放熱パワーモジュール |
JP2005175163A (ja) * | 2003-12-10 | 2005-06-30 | Toyota Motor Corp | 半導体モジュールの冷却構造 |
JP2005237141A (ja) * | 2004-02-20 | 2005-09-02 | Toyota Motor Corp | インバータおよびインバータの製造方法 |
JP2007053295A (ja) * | 2005-08-19 | 2007-03-01 | Hitachi Ltd | 半導体装置,それを用いた電力変換装置及び車載用電機システム |
JP2008193867A (ja) * | 2007-02-07 | 2008-08-21 | Hitachi Ltd | 電力変換装置 |
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2010
- 2010-04-01 JP JP2010084773A patent/JP5188530B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04127456A (ja) * | 1989-09-14 | 1992-04-28 | Toshiba Corp | 樹脂封止型半導体装置及びその製造方法 |
JPH11177074A (ja) * | 1997-12-10 | 1999-07-02 | Kyocera Corp | 固体撮像装置 |
JP2005057212A (ja) * | 2003-08-07 | 2005-03-03 | Toyota Motor Corp | 浸漬式両面放熱パワーモジュール |
JP2005175163A (ja) * | 2003-12-10 | 2005-06-30 | Toyota Motor Corp | 半導体モジュールの冷却構造 |
JP2005237141A (ja) * | 2004-02-20 | 2005-09-02 | Toyota Motor Corp | インバータおよびインバータの製造方法 |
JP2007053295A (ja) * | 2005-08-19 | 2007-03-01 | Hitachi Ltd | 半導体装置,それを用いた電力変換装置及び車載用電機システム |
JP2008193867A (ja) * | 2007-02-07 | 2008-08-21 | Hitachi Ltd | 電力変換装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013088870A1 (ja) * | 2011-12-15 | 2013-06-20 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュールおよびパワーモジュール |
US9591789B2 (en) | 2011-12-15 | 2017-03-07 | Hitachi Automotive Systems, Ltd. | Power semiconductor module and power module |
JP2013179104A (ja) * | 2012-02-28 | 2013-09-09 | Hitachi Automotive Systems Ltd | 電力変換装置 |
US20150245523A1 (en) * | 2012-08-09 | 2015-08-27 | Hitachi Automotive System, Ltd. | Power Module |
US9497873B2 (en) * | 2012-08-09 | 2016-11-15 | Hitachi Automotive Systems, Ltd. | Power module including first and second sealing resins |
WO2014050277A1 (ja) * | 2012-09-28 | 2014-04-03 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2014072939A (ja) * | 2012-09-28 | 2014-04-21 | Hitachi Automotive Systems Ltd | 電力変換装置 |
US9510487B2 (en) | 2012-09-28 | 2016-11-29 | Hitachi Automotive Systems, Ltd. | Power conversion apparatus |
DE102016219070B4 (de) | 2015-10-09 | 2022-06-02 | Schaeffler Technologies AG & Co. KG | Gehäuse für ein Halbbrückenmodul und ein Verfahren zur Herstellung einer Kühlstruktur |
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