JP2011215517A - リペア装置 - Google Patents
リペア装置 Download PDFInfo
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- JP2011215517A JP2011215517A JP2010085805A JP2010085805A JP2011215517A JP 2011215517 A JP2011215517 A JP 2011215517A JP 2010085805 A JP2010085805 A JP 2010085805A JP 2010085805 A JP2010085805 A JP 2010085805A JP 2011215517 A JP2011215517 A JP 2011215517A
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- 230000032258 transport Effects 0.000 claims description 46
- 238000005286 illumination Methods 0.000 claims description 38
- 230000007547 defect Effects 0.000 claims description 30
- 239000000428 dust Substances 0.000 claims description 27
- 230000033001 locomotion Effects 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 17
- 230000002950 deficient Effects 0.000 claims description 16
- 238000011144 upstream manufacturing Methods 0.000 claims description 7
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000012546 transfer Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 14
- 230000003028 elevating effect Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 238000003384 imaging method Methods 0.000 description 8
- 230000007723 transport mechanism Effects 0.000 description 8
- 230000001678 irradiating effect Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
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- 239000000758 substrate Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】本発明のリペア装置は処理対象パネルのリペア処理を行う。処理対象パネルを搬送してリペア処理を行う処理コンベアを備え、当該処理コンベアが、ローラコンベア部と、搬入部と、リペア部と、搬出部と、パネル搬送ステージとを備えた。前記ローラコンベア部は、フリーローラを備えて前記パネル搬送ステージによる前記パネルの搬送を補助する。前記リペア部のXY軸ステージは、レーザ装置の搬送方向と直行する方向の位置調整を行うY軸移動機構と、前記パネル搬送ステージで前記パネルの位置決めがされた後に前記レーザ装置を搬送方向に移動させて補助的に微調整を行うX軸移動機構とを備えた。
【選択図】図2
Description
前記実施形態では、処理コンベア2と搬送コンベア3とを、別部材として構成したが、図14に示すように、一体的に構成してもよい。図14のリペア装置130の全体的構成は、前記実施形態のリペア装置1とほぼ同様であるため、ここでは、同一部材には同一符号を付して、その説明を省略する。
Claims (4)
- 処理対象パネルのリペア処理を行うリペア装置であって、
処理対象パネルを搬送してリペア処理を行う処理コンベアを備え、
当該処理コンベアが、
前記処理対象パネルをスライド可能に支持するローラコンベア部と、
当該ローラコンベア部の上流側に設けられて処理対象パネルを外部から搬入する搬入部と、
前記ローラコンベア部の中央部に設けられて前記搬入部から受け取った前記パネルにリペア処理を施すリペア部と、
前記ローラコンベア部の下流側に設けられて前記リペア部でリペア処理が施された前記パネルを外部に搬出する搬出部と、
前記搬入部に搬入された前記パネルの搬送方向に直行する方向の位置決めをして当該パネルを搬送方向の前記リペア部及び前記搬出部に搬送すると共に搬送方向の位置決めをするパネル搬送ステージとを備え、
前記ローラコンベア部が、駆動源を持たず前記パネルをスライド可能に支持するフリーローラを備えて構成されて前記パネル搬送ステージによる前記パネルの搬送を補助し、
前記リペア部が、前記ローラコンベア部の下側から前記パネルの欠陥部にレーザ光を照射してリペアを施すレーザ装置と、当該レーザ装置を搬送方向とそれに直行する方向とに移動させてレーザ光の照射位置と前記パネルの欠陥位置とを合わせるXY軸ステージとを備え、
当該XY軸ステージが、前記レーザ装置の搬送方向と直行する方向の位置調整を行うY軸移動機構と、前記パネル搬送ステージで前記パネルの位置決めがされた後に前記レーザ装置を搬送方向に移動させて補助的にレーザ光の照射位置と欠陥位置との微調整を行うX軸移動機構とを備えたことを特徴とするリペア装置。 - 請求項1に記載のリペア装置において、
前記処理コンベアで処理が済んだ前記パネルを受け取って外部へ搬送する搬送コンベアを、前記処理コンベアと縦又は横に並べて配設されたことを特徴とするリペア装置。 - 請求項1又は2に記載のリペア装置において、
レーザ装置が前記パネルにその下側から向けた対物レンズを備え、当該対物レンズにゴミの付着を防止するシャッタを備えたことを特徴とするリペア装置。 - 請求項1乃至3のいずれか1項に記載のリペア装置において、
前記パネルの欠陥部を照明する照明部と、前記レーザ装置のレンズのゴミを除去するごみ除去部とを有する照明ごみ除去装置を備え、
当該照明ごみ除去装置を支持して前記照明部が、その透過照明の光軸と、前記レーザ装置からのレーザ光の光軸とが同一軸上に合わされるように、当該レーザ装置の移動と同期して追従、移動されて、常時照明状態を確保するXYZ軸ステージを備えたことを特徴とするリペア装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010085805A JP5432804B2 (ja) | 2010-04-02 | 2010-04-02 | リペア装置 |
TW100106704A TWI457638B (zh) | 2010-04-02 | 2011-03-01 | 修理裝置 |
KR1020110024484A KR20110111237A (ko) | 2010-04-02 | 2011-03-18 | 리페어 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010085805A JP5432804B2 (ja) | 2010-04-02 | 2010-04-02 | リペア装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011215517A true JP2011215517A (ja) | 2011-10-27 |
JP5432804B2 JP5432804B2 (ja) | 2014-03-05 |
Family
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010085805A Active JP5432804B2 (ja) | 2010-04-02 | 2010-04-02 | リペア装置 |
Country Status (3)
Country | Link |
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JP (1) | JP5432804B2 (ja) |
KR (1) | KR20110111237A (ja) |
TW (1) | TWI457638B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105334675A (zh) * | 2014-08-04 | 2016-02-17 | 岩崎电气株式会社 | 光配向装置 |
CN105628713A (zh) * | 2016-03-10 | 2016-06-01 | 吉林大学 | 卧式丝网模板智能检测修复机 |
JP6345903B1 (ja) * | 2017-09-13 | 2018-06-20 | 堺ディスプレイプロダクト株式会社 | フレキシブルディスプレイの製造装置 |
CN108681113A (zh) * | 2018-04-23 | 2018-10-19 | 深圳市深科达智能装备股份有限公司 | 自动化压合设备 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106531673B (zh) * | 2016-12-02 | 2023-08-22 | 长江大学 | 引线框架自动上板机 |
CN108325871B (zh) * | 2018-04-18 | 2024-05-17 | 昆山精讯电子技术有限公司 | 一种面板的检测装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1099978A (ja) * | 1996-09-27 | 1998-04-21 | Hitachi Ltd | レーザー加工装置 |
JP2001183308A (ja) * | 1999-12-24 | 2001-07-06 | Toray Ind Inc | 大型基板用検査装置 |
JP2006119575A (ja) * | 2004-09-27 | 2006-05-11 | Hitachi Displays Ltd | パターン修正装置および表示装置の製造方法 |
JP2008270284A (ja) * | 2007-04-16 | 2008-11-06 | Shibaura Mechatronics Corp | 基板の処理装置 |
JP2008272792A (ja) * | 2007-04-27 | 2008-11-13 | Jfe Steel Kk | 鋼帯溶接部検査装置 |
JP2009145723A (ja) * | 2007-12-17 | 2009-07-02 | Ips Alpha Technology Ltd | 液晶表示装置の製造方法および検査システム |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005227652A (ja) * | 2004-02-16 | 2005-08-25 | Micronics Japan Co Ltd | 表示用パネルの処理装置 |
-
2010
- 2010-04-02 JP JP2010085805A patent/JP5432804B2/ja active Active
-
2011
- 2011-03-01 TW TW100106704A patent/TWI457638B/zh active
- 2011-03-18 KR KR1020110024484A patent/KR20110111237A/ko not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1099978A (ja) * | 1996-09-27 | 1998-04-21 | Hitachi Ltd | レーザー加工装置 |
JP2001183308A (ja) * | 1999-12-24 | 2001-07-06 | Toray Ind Inc | 大型基板用検査装置 |
JP2006119575A (ja) * | 2004-09-27 | 2006-05-11 | Hitachi Displays Ltd | パターン修正装置および表示装置の製造方法 |
JP2008270284A (ja) * | 2007-04-16 | 2008-11-06 | Shibaura Mechatronics Corp | 基板の処理装置 |
JP2008272792A (ja) * | 2007-04-27 | 2008-11-13 | Jfe Steel Kk | 鋼帯溶接部検査装置 |
JP2009145723A (ja) * | 2007-12-17 | 2009-07-02 | Ips Alpha Technology Ltd | 液晶表示装置の製造方法および検査システム |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105334675A (zh) * | 2014-08-04 | 2016-02-17 | 岩崎电气株式会社 | 光配向装置 |
CN105628713A (zh) * | 2016-03-10 | 2016-06-01 | 吉林大学 | 卧式丝网模板智能检测修复机 |
JP6345903B1 (ja) * | 2017-09-13 | 2018-06-20 | 堺ディスプレイプロダクト株式会社 | フレキシブルディスプレイの製造装置 |
WO2019053820A1 (ja) * | 2017-09-13 | 2019-03-21 | 堺ディスプレイプロダクト株式会社 | フレキシブルディスプレイの製造装置 |
US10516121B2 (en) | 2017-09-13 | 2019-12-24 | Sakai Display Products Corporation | Apparatus for producing flexible display |
CN108681113A (zh) * | 2018-04-23 | 2018-10-19 | 深圳市深科达智能装备股份有限公司 | 自动化压合设备 |
CN108681113B (zh) * | 2018-04-23 | 2023-12-15 | 深圳市深科达智能装备股份有限公司 | 自动化压合设备 |
Also Published As
Publication number | Publication date |
---|---|
TW201213931A (en) | 2012-04-01 |
TWI457638B (zh) | 2014-10-21 |
KR20110111237A (ko) | 2011-10-10 |
JP5432804B2 (ja) | 2014-03-05 |
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