JP2011192686A5 - - Google Patents
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- Publication number
- JP2011192686A5 JP2011192686A5 JP2010055276A JP2010055276A JP2011192686A5 JP 2011192686 A5 JP2011192686 A5 JP 2011192686A5 JP 2010055276 A JP2010055276 A JP 2010055276A JP 2010055276 A JP2010055276 A JP 2010055276A JP 2011192686 A5 JP2011192686 A5 JP 2011192686A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- semiconductor device
- alloy
- knitted
- bonding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 12
- 239000000463 material Substances 0.000 claims 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 3
- 229910018104 Ni-P Inorganic materials 0.000 claims 2
- 229910018536 Ni—P Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 229910001374 Invar Inorganic materials 0.000 claims 1
- 229910020888 Sn-Cu Inorganic materials 0.000 claims 1
- 229910019204 Sn—Cu Inorganic materials 0.000 claims 1
- 230000005496 eutectics Effects 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010055276A JP5702937B2 (ja) | 2010-03-12 | 2010-03-12 | 半導体装置 |
| DE112010005383.9T DE112010005383B4 (de) | 2010-03-12 | 2010-11-19 | Halbleitervorrichtung |
| PCT/JP2010/006785 WO2011111137A1 (ja) | 2010-03-12 | 2010-11-19 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010055276A JP5702937B2 (ja) | 2010-03-12 | 2010-03-12 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011192686A JP2011192686A (ja) | 2011-09-29 |
| JP2011192686A5 true JP2011192686A5 (enExample) | 2012-09-20 |
| JP5702937B2 JP5702937B2 (ja) | 2015-04-15 |
Family
ID=44562985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010055276A Expired - Fee Related JP5702937B2 (ja) | 2010-03-12 | 2010-03-12 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5702937B2 (enExample) |
| DE (1) | DE112010005383B4 (enExample) |
| WO (1) | WO2011111137A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014103183A (ja) | 2012-11-19 | 2014-06-05 | Mitsubishi Electric Corp | 電子回路、その製造方法、および電子部品 |
| JP2015216290A (ja) * | 2014-05-13 | 2015-12-03 | カルソニックカンセイ株式会社 | ビームリード、半導体装置、および、半導体装置の製造方法 |
| DE102015103779A1 (de) * | 2015-03-16 | 2016-09-22 | Pac Tech-Packaging Technologies Gmbh | Chipanordnung und Verfahren zur Ausbildung einer Kontaktverbindung |
| DE102016108656A1 (de) * | 2016-05-11 | 2017-11-16 | Danfoss Silicon Power Gmbh | Leistungselektronische Baugruppe mit vibrationsfreier Kontaktierung |
| JP2017157847A (ja) * | 2017-04-21 | 2017-09-07 | 三菱電機株式会社 | 電子回路 |
| DE102019215438A1 (de) * | 2019-10-09 | 2020-08-20 | Vitesco Technologies Germany Gmbh | Bondbändchen, Elektronikanordnung mit einem Bondbändchen, Verfahren zum Herstellen eines Bondbändchens |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE564212A (enExample) * | 1957-01-25 | |||
| JP2001332664A (ja) | 2000-05-24 | 2001-11-30 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
| JP2003037130A (ja) * | 2001-07-24 | 2003-02-07 | Sony Corp | ボンディングワイヤ、半導体装置及びその製造方法 |
| JP2004319740A (ja) * | 2003-04-16 | 2004-11-11 | Fuji Electric Holdings Co Ltd | パワー半導体装置およびその製造方法 |
| US20040217488A1 (en) | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
| US20090272577A1 (en) * | 2006-04-27 | 2009-11-05 | Neomax Materials Co., Ltd. | Clad material for wiring connection and wiring connection member processed from the clad material |
| JP4640345B2 (ja) | 2007-01-25 | 2011-03-02 | 三菱電機株式会社 | 電力用半導体装置 |
| DE102007057346B3 (de) * | 2007-11-28 | 2009-06-10 | Fachhochschule Kiel | Laminierte Leistungselektronikbaugruppe |
-
2010
- 2010-03-12 JP JP2010055276A patent/JP5702937B2/ja not_active Expired - Fee Related
- 2010-11-19 WO PCT/JP2010/006785 patent/WO2011111137A1/ja not_active Ceased
- 2010-11-19 DE DE112010005383.9T patent/DE112010005383B4/de not_active Expired - Fee Related
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