JP5702937B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5702937B2
JP5702937B2 JP2010055276A JP2010055276A JP5702937B2 JP 5702937 B2 JP5702937 B2 JP 5702937B2 JP 2010055276 A JP2010055276 A JP 2010055276A JP 2010055276 A JP2010055276 A JP 2010055276A JP 5702937 B2 JP5702937 B2 JP 5702937B2
Authority
JP
Japan
Prior art keywords
wire
semiconductor device
conductor
solder
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010055276A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011192686A5 (enExample
JP2011192686A (ja
Inventor
靖 池田
靖 池田
知丈 東平
知丈 東平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2010055276A priority Critical patent/JP5702937B2/ja
Priority to PCT/JP2010/006785 priority patent/WO2011111137A1/ja
Priority to DE112010005383.9T priority patent/DE112010005383B4/de
Publication of JP2011192686A publication Critical patent/JP2011192686A/ja
Publication of JP2011192686A5 publication Critical patent/JP2011192686A5/ja
Application granted granted Critical
Publication of JP5702937B2 publication Critical patent/JP5702937B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07336—
    • H10W72/07352—
    • H10W72/07354—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/07555—
    • H10W72/07633—
    • H10W72/07636—
    • H10W72/07653—
    • H10W72/321—
    • H10W72/327—
    • H10W72/347—
    • H10W72/352—
    • H10W72/5475—
    • H10W72/5524—
    • H10W72/557—
    • H10W72/624—
    • H10W72/652—
    • H10W72/655—
    • H10W72/871—
    • H10W72/884—
    • H10W76/47—
    • H10W90/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP2010055276A 2010-03-12 2010-03-12 半導体装置 Expired - Fee Related JP5702937B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010055276A JP5702937B2 (ja) 2010-03-12 2010-03-12 半導体装置
PCT/JP2010/006785 WO2011111137A1 (ja) 2010-03-12 2010-11-19 半導体装置
DE112010005383.9T DE112010005383B4 (de) 2010-03-12 2010-11-19 Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010055276A JP5702937B2 (ja) 2010-03-12 2010-03-12 半導体装置

Publications (3)

Publication Number Publication Date
JP2011192686A JP2011192686A (ja) 2011-09-29
JP2011192686A5 JP2011192686A5 (enExample) 2012-09-20
JP5702937B2 true JP5702937B2 (ja) 2015-04-15

Family

ID=44562985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010055276A Expired - Fee Related JP5702937B2 (ja) 2010-03-12 2010-03-12 半導体装置

Country Status (3)

Country Link
JP (1) JP5702937B2 (enExample)
DE (1) DE112010005383B4 (enExample)
WO (1) WO2011111137A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103183A (ja) 2012-11-19 2014-06-05 Mitsubishi Electric Corp 電子回路、その製造方法、および電子部品
JP2015216290A (ja) * 2014-05-13 2015-12-03 カルソニックカンセイ株式会社 ビームリード、半導体装置、および、半導体装置の製造方法
DE102015103779A1 (de) * 2015-03-16 2016-09-22 Pac Tech-Packaging Technologies Gmbh Chipanordnung und Verfahren zur Ausbildung einer Kontaktverbindung
DE102016108656A1 (de) * 2016-05-11 2017-11-16 Danfoss Silicon Power Gmbh Leistungselektronische Baugruppe mit vibrationsfreier Kontaktierung
JP2017157847A (ja) * 2017-04-21 2017-09-07 三菱電機株式会社 電子回路
DE102019215438A1 (de) * 2019-10-09 2020-08-20 Vitesco Technologies Germany Gmbh Bondbändchen, Elektronikanordnung mit einem Bondbändchen, Verfahren zum Herstellen eines Bondbändchens

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE564212A (enExample) * 1957-01-25
JP2001332664A (ja) 2000-05-24 2001-11-30 Fuji Electric Co Ltd 半導体装置およびその製造方法
JP2003037130A (ja) * 2001-07-24 2003-02-07 Sony Corp ボンディングワイヤ、半導体装置及びその製造方法
JP2004319740A (ja) * 2003-04-16 2004-11-11 Fuji Electric Holdings Co Ltd パワー半導体装置およびその製造方法
US20040217488A1 (en) 2003-05-02 2004-11-04 Luechinger Christoph B. Ribbon bonding
US20090272577A1 (en) * 2006-04-27 2009-11-05 Neomax Materials Co., Ltd. Clad material for wiring connection and wiring connection member processed from the clad material
JP4640345B2 (ja) 2007-01-25 2011-03-02 三菱電機株式会社 電力用半導体装置
DE102007057346B3 (de) * 2007-11-28 2009-06-10 Fachhochschule Kiel Laminierte Leistungselektronikbaugruppe

Also Published As

Publication number Publication date
DE112010005383T5 (de) 2013-01-03
WO2011111137A1 (ja) 2011-09-15
JP2011192686A (ja) 2011-09-29
DE112010005383B4 (de) 2014-10-16

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