JP2011187966A5 - - Google Patents
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- Publication number
- JP2011187966A5 JP2011187966A5 JP2011056687A JP2011056687A JP2011187966A5 JP 2011187966 A5 JP2011187966 A5 JP 2011187966A5 JP 2011056687 A JP2011056687 A JP 2011056687A JP 2011056687 A JP2011056687 A JP 2011056687A JP 2011187966 A5 JP2011187966 A5 JP 2011187966A5
- Authority
- JP
- Japan
- Prior art keywords
- epitaxial region
- peripheral portion
- metal stack
- ohmic metal
- implanting ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32018203P | 2003-05-09 | 2003-05-09 | |
| US60/320,182 | 2003-05-09 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006532792A Division JP5122817B2 (ja) | 2003-05-09 | 2004-05-06 | イオン・インプラント・アイソレーションによるled製作 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011187966A JP2011187966A (ja) | 2011-09-22 |
| JP2011187966A5 true JP2011187966A5 (enExample) | 2012-02-16 |
| JP5491439B2 JP5491439B2 (ja) | 2014-05-14 |
Family
ID=33449503
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006532792A Expired - Lifetime JP5122817B2 (ja) | 2003-05-09 | 2004-05-06 | イオン・インプラント・アイソレーションによるled製作 |
| JP2011056687A Expired - Lifetime JP5491439B2 (ja) | 2003-05-09 | 2011-03-15 | イオン・インプラント・アイソレーションによるled製作 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006532792A Expired - Lifetime JP5122817B2 (ja) | 2003-05-09 | 2004-05-06 | イオン・インプラント・アイソレーションによるled製作 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7338822B2 (enExample) |
| EP (1) | EP1623467B1 (enExample) |
| JP (2) | JP5122817B2 (enExample) |
| CN (2) | CN101697366B (enExample) |
| TW (1) | TWI347683B (enExample) |
| WO (1) | WO2004102686A1 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7338822B2 (en) * | 2003-05-09 | 2008-03-04 | Cree, Inc. | LED fabrication via ion implant isolation |
| JP4766845B2 (ja) * | 2003-07-25 | 2011-09-07 | シャープ株式会社 | 窒化物系化合物半導体発光素子およびその製造方法 |
| EP1668687A4 (en) * | 2003-09-19 | 2007-11-07 | Tinggi Tech Private Ltd | FABRICATION OF A CONDUCTIVE METAL LAYER ON SEMICONDUCTOR COMPONENTS |
| CN101335320B (zh) | 2003-09-19 | 2012-06-06 | 霆激科技股份有限公司 | 用于制作发光器件的方法 |
| US20050194584A1 (en) * | 2003-11-12 | 2005-09-08 | Slater David B.Jr. | LED fabrication via ion implant isolation |
| EP1730790B1 (en) * | 2004-03-15 | 2011-11-09 | Tinggi Technologies Private Limited | Fabrication of semiconductor devices |
| US8309377B2 (en) | 2004-04-07 | 2012-11-13 | Tinggi Technologies Private Limited | Fabrication of reflective layer on semiconductor light emitting devices |
| US7592634B2 (en) * | 2004-05-06 | 2009-09-22 | Cree, Inc. | LED fabrication via ion implant isolation |
| US8174037B2 (en) | 2004-09-22 | 2012-05-08 | Cree, Inc. | High efficiency group III nitride LED with lenticular surface |
| SG130975A1 (en) * | 2005-09-29 | 2007-04-26 | Tinggi Tech Private Ltd | Fabrication of semiconductor devices for light emission |
| SG131803A1 (en) | 2005-10-19 | 2007-05-28 | Tinggi Tech Private Ltd | Fabrication of transistors |
| SG133432A1 (en) | 2005-12-20 | 2007-07-30 | Tinggi Tech Private Ltd | Localized annealing during semiconductor device fabrication |
| US7772604B2 (en) * | 2006-01-05 | 2010-08-10 | Illumitex | Separate optical device for directing light from an LED |
| JP2008041811A (ja) * | 2006-08-03 | 2008-02-21 | Ngk Spark Plug Co Ltd | 配線基板および多数個取り配線基板ならびにその製造方法 |
| SG140473A1 (en) | 2006-08-16 | 2008-03-28 | Tinggi Tech Private Ltd | Improvements in external light efficiency of light emitting diodes |
| US7646024B2 (en) * | 2006-08-18 | 2010-01-12 | Cree, Inc. | Structure and method for reducing forward voltage across a silicon carbide-group III nitride interface |
| SG140512A1 (en) | 2006-09-04 | 2008-03-28 | Tinggi Tech Private Ltd | Electrical current distribution in light emitting devices |
| US8087960B2 (en) | 2006-10-02 | 2012-01-03 | Illumitex, Inc. | LED system and method |
| US8674593B2 (en) * | 2007-05-31 | 2014-03-18 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
| KR20100122485A (ko) | 2008-02-08 | 2010-11-22 | 일루미텍스, 인크. | 발광체층 쉐이핑을 위한 시스템 및 방법 |
| US20090261346A1 (en) * | 2008-04-16 | 2009-10-22 | Ding-Yuan Chen | Integrating CMOS and Optical Devices on a Same Chip |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| JP2010199558A (ja) * | 2009-01-27 | 2010-09-09 | Panasonic Corp | 半導体装置およびその製造方法 |
| US8096671B1 (en) | 2009-04-06 | 2012-01-17 | Nmera, Llc | Light emitting diode illumination system |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| US8263422B2 (en) * | 2010-04-26 | 2012-09-11 | Varian Semiconductor Equipment Associates, Inc. | Bond pad isolation and current confinement in an LED using ion implantation |
| DE102010026518B4 (de) | 2010-07-08 | 2025-02-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip und Verfahren zur Herstellung einer Mehrzahl von Leuchtdiodenchips |
| KR101782081B1 (ko) * | 2010-08-30 | 2017-09-26 | 엘지이노텍 주식회사 | 발광 소자 |
| US20120097918A1 (en) * | 2010-10-20 | 2012-04-26 | Varian Semiconductor Equipment Associates, Inc. | Implanted current confinement structure to improve current spreading |
| US8664027B2 (en) | 2011-02-11 | 2014-03-04 | Varian Semiconductor Associates, Inc. | LED mesa sidewall isolation by ion implantation |
| US8927999B2 (en) * | 2011-11-21 | 2015-01-06 | Avogy, Inc. | Edge termination by ion implantation in GaN |
| DE102012108883A1 (de) * | 2012-09-20 | 2014-03-20 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips |
| TWI495154B (zh) * | 2012-12-06 | 2015-08-01 | Genesis Photonics Inc | 半導體結構 |
| US9985190B2 (en) * | 2016-05-18 | 2018-05-29 | eLux Inc. | Formation and structure of post enhanced diodes for orientation control |
| CN106711301B (zh) * | 2015-11-12 | 2020-10-27 | 美科米尚技术有限公司 | 发光二极管与其制作方法 |
| CN106024623B (zh) * | 2016-06-29 | 2019-03-01 | 江苏能华微电子科技发展有限公司 | 一种氮化镓肖特基二极管及其制作方法 |
| TWI703726B (zh) | 2016-09-19 | 2020-09-01 | 新世紀光電股份有限公司 | 含氮半導體元件 |
| US10892137B2 (en) * | 2018-09-12 | 2021-01-12 | Entegris, Inc. | Ion implantation processes and apparatus using gallium |
| DE102019129619A1 (de) * | 2019-11-04 | 2021-05-06 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauteil |
| GB2590450B (en) * | 2019-12-18 | 2022-01-05 | Plessey Semiconductors Ltd | Light emitting diode precursor |
| CN111653565B (zh) * | 2020-03-11 | 2023-03-17 | 厦门市三安集成电路有限公司 | 一种高阻抗半导体电阻器结构及其制备方法 |
| US11227801B2 (en) | 2020-03-19 | 2022-01-18 | International Business Machines Corporation | Formation of contacts for semiconductor devices |
| EP3971981A1 (en) | 2020-09-22 | 2022-03-23 | Samsung Electronics Co., Ltd. | Light-emitting diode display device and manufacturing method thereof |
| CN119545988A (zh) * | 2021-02-03 | 2025-02-28 | 厦门三安光电有限公司 | 微型发光二极管和显示面板 |
| CN114141916B (zh) * | 2021-11-24 | 2023-08-01 | 福州大学 | 纳米尺寸led芯片阵列及其制备方法 |
| CN114628432B (zh) * | 2022-02-28 | 2023-03-10 | 诺视科技(苏州)有限公司 | 一种半导体装置的制作方法及半导体装置 |
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| BE791929A (fr) | 1971-12-02 | 1973-03-16 | Western Electric Co | Procede de fabrication de regions isolantes dans un corps de semi-conducteur |
| US5114827A (en) * | 1988-06-28 | 1992-05-19 | Microelectronics Center Of N.C. | Photoresists resistant to oxygen plasmas |
| US4968582A (en) * | 1988-06-28 | 1990-11-06 | Mcnc And University Of Nc At Charlotte | Photoresists resistant to oxygen plasmas |
| US5119540A (en) * | 1990-07-24 | 1992-06-09 | Cree Research, Inc. | Apparatus for eliminating residual nitrogen contamination in epitaxial layers of silicon carbide and resulting product |
| JPH0394481A (ja) * | 1989-09-07 | 1991-04-19 | Ricoh Co Ltd | アレイ状半導体発光装置 |
| US5210051A (en) * | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
| US5248760A (en) * | 1991-01-25 | 1993-09-28 | Unc At Charlotte | Chemically cured low temperature polyimides |
| JPH0546052U (ja) * | 1991-11-19 | 1993-06-18 | 三洋電機株式会社 | 発光ダイオード装置 |
| JPH0697498A (ja) * | 1992-09-17 | 1994-04-08 | Toshiba Corp | 半導体発光素子 |
| US5393642A (en) * | 1992-12-31 | 1995-02-28 | The University Of North Carolina At Charlotte | Ionic modification of organic resins and photoresists to produce photoactive etch resistant compositions |
| US5416342A (en) * | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
| US5393993A (en) * | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
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| US5718760A (en) * | 1996-02-05 | 1998-02-17 | Cree Research, Inc. | Growth of colorless silicon carbide crystals |
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| JP3516433B2 (ja) * | 1997-12-19 | 2004-04-05 | 昭和電工株式会社 | 化合物半導体発光素子 |
| US5998232A (en) * | 1998-01-16 | 1999-12-07 | Implant Sciences Corporation | Planar technology for producing light-emitting devices |
| JPH11214800A (ja) * | 1998-01-28 | 1999-08-06 | Sony Corp | 半導体装置およびその製造方法 |
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| JP2000077713A (ja) * | 1998-08-27 | 2000-03-14 | Sanyo Electric Co Ltd | 半導体発光素子 |
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| JP3424634B2 (ja) * | 2000-01-27 | 2003-07-07 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
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| TW493284B (en) * | 2000-09-06 | 2002-07-01 | Highlink Technology Corp | LED device and the manufacturing method thereof |
| US6255129B1 (en) * | 2000-09-07 | 2001-07-03 | Highlink Technology Corporation | Light-emitting diode device and method of manufacturing the same |
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| US6800876B2 (en) * | 2001-01-16 | 2004-10-05 | Cree, Inc. | Group III nitride LED with undoped cladding layer (5000.137) |
| US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
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| US7338822B2 (en) * | 2003-05-09 | 2008-03-04 | Cree, Inc. | LED fabrication via ion implant isolation |
-
2004
- 2004-05-06 US US10/840,463 patent/US7338822B2/en not_active Expired - Lifetime
- 2004-05-06 CN CN2009102088552A patent/CN101697366B/zh not_active Expired - Lifetime
- 2004-05-06 CN CN2004800125618A patent/CN1802755B/zh not_active Expired - Lifetime
- 2004-05-06 WO PCT/US2004/014023 patent/WO2004102686A1/en not_active Ceased
- 2004-05-06 JP JP2006532792A patent/JP5122817B2/ja not_active Expired - Lifetime
- 2004-05-06 EP EP04751419.5A patent/EP1623467B1/en not_active Expired - Lifetime
- 2004-05-07 TW TW093112923A patent/TWI347683B/zh not_active IP Right Cessation
-
2011
- 2011-03-15 JP JP2011056687A patent/JP5491439B2/ja not_active Expired - Lifetime
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