BE791929A - Procede de fabrication de regions isolantes dans un corps de semi-conducteur - Google Patents

Procede de fabrication de regions isolantes dans un corps de semi-conducteur

Info

Publication number
BE791929A
BE791929A BE791929DA BE791929A BE 791929 A BE791929 A BE 791929A BE 791929D A BE791929D A BE 791929DA BE 791929 A BE791929 A BE 791929A
Authority
BE
Belgium
Prior art keywords
semiconductor body
insulating regions
manufacturing insulating
manufacturing
regions
Prior art date
Application number
Other languages
English (en)
Inventor
L A D Asaro
J C Dyment
M Kuhn
S M Spitzer
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE791929A publication Critical patent/BE791929A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/7605—Making of isolation regions between components between components manufactured in an active substrate comprising AIII BV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Semiconductor Lasers (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
  • Led Devices (AREA)
BE791929D 1971-12-02 Procede de fabrication de regions isolantes dans un corps de semi-conducteur BE791929A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00204222A US3824133A (en) 1971-12-02 1971-12-02 Fabrication of electrically insulating regions in optical devices by proton bombardment

Publications (1)

Publication Number Publication Date
BE791929A true BE791929A (fr) 1973-03-16

Family

ID=22757099

Family Applications (1)

Application Number Title Priority Date Filing Date
BE791929D BE791929A (fr) 1971-12-02 Procede de fabrication de regions isolantes dans un corps de semi-conducteur

Country Status (6)

Country Link
US (1) US3824133A (fr)
JP (1) JPS5117876B2 (fr)
BE (1) BE791929A (fr)
CA (1) CA962374A (fr)
DE (1) DE2258444B2 (fr)
GB (1) GB1365570A (fr)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340096B2 (fr) * 1972-02-10 1978-10-25
JPS562407B2 (fr) * 1973-01-31 1981-01-20
US3974002A (en) * 1974-06-10 1976-08-10 Bell Telephone Laboratories, Incorporated MBE growth: gettering contaminants and fabricating heterostructure junction lasers
JPS516491A (en) * 1974-07-04 1976-01-20 Nippon Electric Co Handotaireezano seizohoho
US3936322A (en) * 1974-07-29 1976-02-03 International Business Machines Corporation Method of making a double heterojunction diode laser
US4010483A (en) * 1974-08-08 1977-03-01 International Telephone And Telegraph Corporation Current confining light emitting diode
GB1564702A (en) * 1975-11-17 1980-04-10 Post Office Semiconductor devices
JPS5277687A (en) * 1975-12-24 1977-06-30 Sharp Corp Manufacture of semiconductor laser element
JPS52116088A (en) * 1976-03-25 1977-09-29 Sharp Corp Preparation of semiconductor laser element
US4138274A (en) * 1976-06-09 1979-02-06 Northern Telecom Limited Method of producing optoelectronic devices with control of light propagation by proton bombardment
US4080617A (en) * 1976-06-09 1978-03-21 Northern Telecom Limited Optoelectronic devices with control of light propagation
US4047976A (en) * 1976-06-21 1977-09-13 Motorola, Inc. Method for manufacturing a high-speed semiconductor device
US4124826A (en) * 1977-03-01 1978-11-07 Bell Telephone Laboratories, Incorporated Current confinement in semiconductor lasers
JPS53988A (en) * 1977-07-22 1978-01-07 Sharp Corp Structure of semiconductor laser element
NL7800583A (nl) * 1978-01-18 1979-07-20 Philips Nv Werkwijze voor het vervaardigen van een in- richting en inrichting vervaardigd met behulp van de werkwijze.
JPS5837713B2 (ja) * 1978-12-01 1983-08-18 富士通株式会社 半導体レ−ザ−装置の製造方法
NL8003336A (nl) * 1979-06-12 1980-12-16 Dearnaley G Werkwijze voor de vervaardiging van een halfgeleider- inrichting.
US5298787A (en) * 1979-08-10 1994-03-29 Massachusetts Institute Of Technology Semiconductor embedded layer technology including permeable base transistor
US4378629A (en) * 1979-08-10 1983-04-05 Massachusetts Institute Of Technology Semiconductor embedded layer technology including permeable base transistor, fabrication method
JPS56104488A (en) * 1980-01-23 1981-08-20 Hitachi Ltd Semiconductor laser element
US4340967A (en) * 1980-06-02 1982-07-20 Bell Telephone Laboratories, Incorporated Semiconductor lasers with stable higher-order modes parallel to the junction plane
US4447905A (en) * 1981-03-25 1984-05-08 Bell Telephone Laboratories, Incorporated Current confinement in semiconductor light emitting devices
US4514896A (en) * 1981-03-25 1985-05-07 At&T Bell Laboratories Method of forming current confinement channels in semiconductor devices
US4352835A (en) * 1981-07-01 1982-10-05 Western Electric Co., Inc. Masking portions of a substrate
US4403397A (en) * 1981-07-13 1983-09-13 The United States Of America As Represented By The Secretary Of The Navy Method of making avalanche photodiodes
US4391651A (en) * 1981-10-15 1983-07-05 The United States Of America As Represented By The Secretary Of The Navy Method of forming a hyperabrupt interface in a GaAs substrate
JPS58162091A (ja) * 1982-03-23 1983-09-26 Nippon Telegr & Teleph Corp <Ntt> 半導体レ−ザ素子及びその製造方法
JPH0642488B2 (ja) * 1982-05-10 1994-06-01 理化学研究所 イオン注入による結晶層界面の結晶組成制御方法
JPS58219790A (ja) * 1982-06-14 1983-12-21 Sanyo Electric Co Ltd 半導体発光素子
US4523961A (en) * 1982-11-12 1985-06-18 At&T Bell Laboratories Method of improving current confinement in semiconductor lasers by inert ion bombardment
US4599791A (en) * 1983-11-28 1986-07-15 At&T Bell Laboratories Method of making integrated circuits employing proton-bombarded AlGaAs layers
US4597165A (en) * 1983-11-28 1986-07-01 At&T Bell Laboratories Method of making integrated circuits employing ion-bombarded InP layers
US4539743A (en) * 1983-11-28 1985-09-10 At&T Bell Laboratories Production of semiconductor structures with buried resistive or conductive regions by controlled ion bombardment and heat treatment
JPH03276661A (ja) * 1990-03-26 1991-12-06 Mitsubishi Electric Corp 絶縁領域の形成方法
US5358877A (en) * 1991-03-29 1994-10-25 Electronic Decisions Inc. Soft proton isolation process for an acoustic charge transport integrated circuit
US5804461A (en) * 1994-12-22 1998-09-08 Polaroid Corporation Laser diode with an ion-implant region
DE19918651A1 (de) * 1999-04-16 2000-10-19 Friedrich Schiller Uni Jena Bu Lichtemittierende Halbleiterdiode und Verfahren zu ihrer Herstellung
WO2004102686A1 (fr) * 2003-05-09 2004-11-25 Cree, Inc. Fabrication de diodes electroluminescentes par isolation d'implantation ionique
US20050194584A1 (en) * 2003-11-12 2005-09-08 Slater David B.Jr. LED fabrication via ion implant isolation
US7592634B2 (en) * 2004-05-06 2009-09-22 Cree, Inc. LED fabrication via ion implant isolation

Also Published As

Publication number Publication date
DE2258444B2 (de) 1975-09-18
US3824133A (en) 1974-07-16
DE2258444A1 (de) 1973-06-07
GB1365570A (en) 1974-09-04
AU4948672A (en) 1973-05-24
JPS4865882A (fr) 1973-09-10
JPS5117876B2 (fr) 1976-06-05
CA962374A (en) 1975-02-04

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