JP2011171531A5 - - Google Patents
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- Publication number
- JP2011171531A5 JP2011171531A5 JP2010034314A JP2010034314A JP2011171531A5 JP 2011171531 A5 JP2011171531 A5 JP 2011171531A5 JP 2010034314 A JP2010034314 A JP 2010034314A JP 2010034314 A JP2010034314 A JP 2010034314A JP 2011171531 A5 JP2011171531 A5 JP 2011171531A5
- Authority
- JP
- Japan
- Prior art keywords
- aluminum oxide
- wiring board
- oxide substrate
- layer
- connection pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000006467 substitution reaction Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010034314A JP5363377B2 (ja) | 2010-02-19 | 2010-02-19 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010034314A JP5363377B2 (ja) | 2010-02-19 | 2010-02-19 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011171531A JP2011171531A (ja) | 2011-09-01 |
| JP2011171531A5 true JP2011171531A5 (OSRAM) | 2013-01-24 |
| JP5363377B2 JP5363377B2 (ja) | 2013-12-11 |
Family
ID=44685332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010034314A Expired - Fee Related JP5363377B2 (ja) | 2010-02-19 | 2010-02-19 | 配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5363377B2 (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6282425B2 (ja) * | 2012-10-29 | 2018-02-21 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP6375249B2 (ja) | 2015-03-02 | 2018-08-15 | 新光電気工業株式会社 | 配線基板及びその製造方法、半導体パッケージ |
| WO2022034769A1 (ja) * | 2020-08-12 | 2022-02-17 | 富士フイルム株式会社 | 構造体、構造体の製造方法、接合体の製造方法及びデバイスの製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3154713B2 (ja) * | 1990-03-16 | 2001-04-09 | 株式会社リコー | 異方性導電膜およびその製造方法 |
| JPH05291721A (ja) * | 1992-04-10 | 1993-11-05 | Cmk Corp | プリント配線板 |
| JPH06287774A (ja) * | 1993-04-05 | 1994-10-11 | Metsuku Kk | 銅および銅合金の表面処理剤 |
| JP3130707B2 (ja) * | 1993-08-09 | 2001-01-31 | 株式会社日立製作所 | プリント基板およびその製造方法 |
| JP3087152B2 (ja) * | 1993-09-08 | 2000-09-11 | 富士通株式会社 | 樹脂フィルム多層回路基板の製造方法 |
| JPH09266374A (ja) * | 1996-03-28 | 1997-10-07 | Chichibu Onoda Cement Corp | 放熱性基板の製造方法 |
| JP3736046B2 (ja) * | 1997-06-19 | 2006-01-18 | 株式会社トッパンＮｅｃサーキットソリューションズ | 半導体装置用基板及びその製造方法 |
| JP4558883B2 (ja) * | 2000-03-24 | 2010-10-06 | 義和 小林 | 酸性無電解錫めっき液中の銅の定量方法 |
| JP2004273480A (ja) * | 2003-03-05 | 2004-09-30 | Sony Corp | 配線基板およびその製造方法および半導体装置 |
| JP2009099831A (ja) * | 2007-10-18 | 2009-05-07 | Nippon Circuit Kogyo Kk | 配線基板の製造方法 |
| JP5344667B2 (ja) * | 2007-12-18 | 2013-11-20 | 太陽誘電株式会社 | 回路基板およびその製造方法並びに回路モジュール |
-
2010
- 2010-02-19 JP JP2010034314A patent/JP5363377B2/ja not_active Expired - Fee Related
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