JP2011162879A - 導電性材料 - Google Patents

導電性材料 Download PDF

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Publication number
JP2011162879A
JP2011162879A JP2011023259A JP2011023259A JP2011162879A JP 2011162879 A JP2011162879 A JP 2011162879A JP 2011023259 A JP2011023259 A JP 2011023259A JP 2011023259 A JP2011023259 A JP 2011023259A JP 2011162879 A JP2011162879 A JP 2011162879A
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JP
Japan
Prior art keywords
metal
group
mixtures
mixture
atomic percent
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2011023259A
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English (en)
Japanese (ja)
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JP2011162879A5 (enExample
Inventor
Markus Widenmeyer
ヴィデンマイアー マルクス
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of JP2011162879A publication Critical patent/JP2011162879A/ja
Publication of JP2011162879A5 publication Critical patent/JP2011162879A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • G01N27/4146—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS involving nanosized elements, e.g. nanotubes, nanowires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Nanotechnology (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Powder Metallurgy (AREA)
  • Catalysts (AREA)
  • Non-Insulated Conductors (AREA)
  • Inert Electrodes (AREA)
JP2011023259A 2010-02-04 2011-02-04 導電性材料 Pending JP2011162879A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010001567.9 2010-02-04
DE102010001567A DE102010001567A1 (de) 2010-02-04 2010-02-04 Elektrisch leitfähiges Material

Publications (2)

Publication Number Publication Date
JP2011162879A true JP2011162879A (ja) 2011-08-25
JP2011162879A5 JP2011162879A5 (enExample) 2014-01-09

Family

ID=44307730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011023259A Pending JP2011162879A (ja) 2010-02-04 2011-02-04 導電性材料

Country Status (4)

Country Link
JP (1) JP2011162879A (enExample)
CN (1) CN102148068B (enExample)
DE (1) DE102010001567A1 (enExample)
FR (1) FR2955968A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047465A1 (ja) * 2011-09-27 2013-04-04 田中貴金属工業株式会社 導電粒子及び金属ペースト並びに電極
WO2013108942A1 (ko) * 2012-01-19 2013-07-25 Kim Young Sang 금속과 비금속 파우더에 나노 주석을 부착하여 제조한 복합소재
JP2013149616A (ja) * 2012-01-17 2013-08-01 Robert Bosch Gmbh 導電性材料
CN104480346A (zh) * 2014-12-25 2015-04-01 春焱电子科技（苏州）有限公司 一种含有钽元素的电子材料用铜合金
JP2016535847A (ja) * 2013-11-07 2016-11-17 ヘレーウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトＨｅｒａｅｕｓ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ＆Ｃｏ．ＫＧ プローブニードル及びプローブニードルの製造方法
WO2017150009A1 (ja) * 2016-02-29 2017-09-08 エヌ・イー ケムキャット株式会社 電極用触媒、ガス拡散電極形成用組成物、ガス拡散電極、膜・電極接合体、燃料電池スタック
WO2017150010A1 (ja) * 2016-02-29 2017-09-08 エヌ・イー ケムキャット株式会社 電極用触媒、ガス拡散電極形成用組成物、ガス拡散電極、膜・電極接合体、燃料電池スタック
CN120060763A (zh) * 2025-04-28 2025-05-30 中南大学 一种耐热的无氧铜材料及其制备方法和应用

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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US9796052B2 (en) * 2012-03-30 2017-10-24 Applied Nanoparticle Laboratory Corporation Composite nanometal paste containing copper filler and joining method
JP5189705B1 (ja) 2012-09-25 2013-04-24 田中貴金属工業株式会社 センサー電極及びその製造方法、並びに、電極形成用の金属ペースト
CN102994855B (zh) * 2012-11-28 2016-03-30 太仓市天合新材料科技有限公司 一种延展性好的金属
CN103205593A (zh) * 2013-04-19 2013-07-17 苏州昊迪特殊钢有限公司 一种铂合金复合材料的配方
CN105112718A (zh) * 2015-09-08 2015-12-02 张超 一种铜稀土合金
CN106119594A (zh) * 2016-08-31 2016-11-16 裴秀琴 一种银合金新材料
CN106449094A (zh) * 2016-09-30 2017-02-22 安徽鑫利源电子有限公司 薄膜电容器接线端子
CN107447125A (zh) * 2017-08-30 2017-12-08 太仓天润新材料科技有限公司 一种铜合金高导电环保新材料
CN107586994B (zh) * 2017-10-16 2019-03-05 南京工程学院 一种高导电率铜合金及其制备方法
CN107946271B (zh) * 2017-11-14 2020-01-21 汕头市骏码凯撒有限公司 一种半导体封装用银合金线及其制造方法
CN110972343A (zh) * 2018-09-29 2020-04-07 中新三三仁智科技江苏有限公司 智能致密化金属纳米负离子热源导体
CN111394606B (zh) * 2020-05-06 2021-03-16 贵研铂业股份有限公司 一种金基高阻合金、合金材料及其制备方法
CN113106286B (zh) * 2021-03-15 2022-07-01 江阴金湾合金材料有限公司 一种5g通信用高导电铍铜合金棒及其制备工艺
CN114433862B (zh) * 2022-02-10 2022-10-14 西安交通大学 一种钼铼镧预合金粉末及其制备方法
CN117305652B (zh) * 2023-10-07 2025-09-23 宁波兴敖达金属新材料有限公司 微合金化耐磨、耐蚀性含锡铜合金的制备方法

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Publication number Priority date Publication date Assignee Title
JP2004179139A (ja) * 2002-09-30 2004-06-24 Sumitomo Osaka Cement Co Ltd 導電性粒子とそれを含有する導電性接着材料及び透明導電膜形成用塗料及びそれを用いた透明導電膜並びに表示装置
JP2006193796A (ja) * 2005-01-14 2006-07-27 Ishifuku Metal Ind Co Ltd 導電ペースト用貴金属粉末及びその製造方法
JP2007100214A (ja) * 2005-09-30 2007-04-19 Samsung Sdi Co Ltd 電極形成用伝導性粉体、その製造方法、これを利用したプラズマディスプレイパネルの電極形成方法及び、これを含むプラズマディスプレイパネル

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CN100448540C (zh) * 2005-11-08 2009-01-07 财团法人工业技术研究院 金属纳米光催化剂复合材料及其制法
WO2007066934A1 (en) * 2005-12-06 2007-06-14 Lg Chem, Ltd. Core-shell type nanoparticles and method for preparing the same
EP1978072A4 (en) * 2006-01-27 2009-04-08 Konica Minolta Med & Graphic SEMICONDUCTOR PROOF WITH CORE / COVER STRUCTURE AND METHOD OF MANUFACTURING THEREOF
US20070227300A1 (en) * 2006-03-31 2007-10-04 Quantumsphere, Inc. Compositions of nanometal particles containing a metal or alloy and platinum particles for use in fuel cells
JP5151993B2 (ja) * 2007-01-22 2013-02-27 コニカミノルタエムジー株式会社 コア／シェル型半導体ナノ粒子とその製造方法
CN100482385C (zh) * 2007-06-15 2009-04-29 北京化工大学 一种银/二氧化硅核壳结构纳米颗粒制备方法
DE102007041027A1 (de) * 2007-08-29 2009-03-05 Eckart Gmbh Effektpigmente auf Basis von aus anorganisch-organischen Mischphasen gebildeten Substraten, deren Herstellung und Verwendung
TWI353269B (en) * 2007-12-07 2011-12-01 Nat Univ Tsing Hua Process for preparing aldehyde or ketone by oxidat
US20090261305A1 (en) * 2008-04-21 2009-10-22 Quantumsphere, Inc. Composition of and method of using nanoscale materials in hydrogen storage applications
US20110105889A1 (en) * 2008-07-17 2011-05-05 Konica Minolta Medical & Graphic, Inc. Nanoparticle labeling and system using nanoparticle labeling
CN101362200A (zh) * 2008-09-20 2009-02-11 大连理工大学 金属氧化物包覆异质金属“核/壳”型纳米粒子的合成方法
CN101623634A (zh) * 2009-08-04 2010-01-13 厦门大学 包裹贵金属纳米颗粒的核壳纳米催化剂及其方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179139A (ja) * 2002-09-30 2004-06-24 Sumitomo Osaka Cement Co Ltd 導電性粒子とそれを含有する導電性接着材料及び透明導電膜形成用塗料及びそれを用いた透明導電膜並びに表示装置
JP2006193796A (ja) * 2005-01-14 2006-07-27 Ishifuku Metal Ind Co Ltd 導電ペースト用貴金属粉末及びその製造方法
JP2007100214A (ja) * 2005-09-30 2007-04-19 Samsung Sdi Co Ltd 電極形成用伝導性粉体、その製造方法、これを利用したプラズマディスプレイパネルの電極形成方法及び、これを含むプラズマディスプレイパネル

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047465A1 (ja) * 2011-09-27 2013-04-04 田中貴金属工業株式会社 導電粒子及び金属ペースト並びに電極
JP2013073713A (ja) * 2011-09-27 2013-04-22 Tanaka Kikinzoku Kogyo Kk 導電粒子及び金属ペースト並びに電極
KR20140069229A (ko) * 2011-09-27 2014-06-09 다나카 기킨조쿠 고교 가부시키가이샤 도전 입자 및 금속 페이스트 및 전극
KR101581602B1 (ko) 2011-09-27 2015-12-30 다나카 기킨조쿠 고교 가부시키가이샤 도전 입자 및 금속 페이스트 및 전극
US9245660B2 (en) 2011-09-27 2016-01-26 Tanaka Kikinzoku Kogyo K.K. Electroconductive particle and metal paste, and electrode
JP2013149616A (ja) * 2012-01-17 2013-08-01 Robert Bosch Gmbh 導電性材料
WO2013108942A1 (ko) * 2012-01-19 2013-07-25 Kim Young Sang 금속과 비금속 파우더에 나노 주석을 부착하여 제조한 복합소재
JP2016535847A (ja) * 2013-11-07 2016-11-17 ヘレーウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトＨｅｒａｅｕｓ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ＆Ｃｏ．ＫＧ プローブニードル及びプローブニードルの製造方法
CN104480346A (zh) * 2014-12-25 2015-04-01 春焱电子科技（苏州）有限公司 一种含有钽元素的电子材料用铜合金
WO2017150009A1 (ja) * 2016-02-29 2017-09-08 エヌ・イー ケムキャット株式会社 電極用触媒、ガス拡散電極形成用組成物、ガス拡散電極、膜・電極接合体、燃料電池スタック
WO2017150010A1 (ja) * 2016-02-29 2017-09-08 エヌ・イー ケムキャット株式会社 電極用触媒、ガス拡散電極形成用組成物、ガス拡散電極、膜・電極接合体、燃料電池スタック
CN120060763A (zh) * 2025-04-28 2025-05-30 中南大学 一种耐热的无氧铜材料及其制备方法和应用

Also Published As

Publication number Publication date
DE102010001567A1 (de) 2011-08-04
CN102148068B (zh) 2016-08-31
FR2955968A1 (fr) 2011-08-05
CN102148068A (zh) 2011-08-10

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