JP2011146445A5 - - Google Patents
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- Publication number
- JP2011146445A5 JP2011146445A5 JP2010004394A JP2010004394A JP2011146445A5 JP 2011146445 A5 JP2011146445 A5 JP 2011146445A5 JP 2010004394 A JP2010004394 A JP 2010004394A JP 2010004394 A JP2010004394 A JP 2010004394A JP 2011146445 A5 JP2011146445 A5 JP 2011146445A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring
- electrode
- main surface
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims description 81
- 239000000919 ceramic Substances 0.000 claims description 32
- 229920000642 polymer Polymers 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 229910052878 cordierite Inorganic materials 0.000 claims 2
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 239000003507 refrigerant Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010004394A JP5514559B2 (ja) | 2010-01-12 | 2010-01-12 | 配線基板及びその製造方法並びに半導体パッケージ |
| US12/987,398 US8686548B2 (en) | 2010-01-12 | 2011-01-10 | Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010004394A JP5514559B2 (ja) | 2010-01-12 | 2010-01-12 | 配線基板及びその製造方法並びに半導体パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011146445A JP2011146445A (ja) | 2011-07-28 |
| JP2011146445A5 true JP2011146445A5 (enExample) | 2013-02-21 |
| JP5514559B2 JP5514559B2 (ja) | 2014-06-04 |
Family
ID=44257896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010004394A Active JP5514559B2 (ja) | 2010-01-12 | 2010-01-12 | 配線基板及びその製造方法並びに半導体パッケージ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8686548B2 (enExample) |
| JP (1) | JP5514559B2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8501587B2 (en) * | 2009-01-13 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked integrated chips and methods of fabrication thereof |
| US8780576B2 (en) * | 2011-09-14 | 2014-07-15 | Invensas Corporation | Low CTE interposer |
| US8912045B2 (en) * | 2012-06-12 | 2014-12-16 | International Business Machines Corporation | Three dimensional flip chip system and method |
| US8927345B2 (en) * | 2012-07-09 | 2015-01-06 | Freescale Semiconductor, Inc. | Device package with rigid interconnect structure connecting die and substrate and method thereof |
| US9583426B2 (en) | 2014-11-05 | 2017-02-28 | Invensas Corporation | Multi-layer substrates suitable for interconnection between circuit modules |
| US9633930B2 (en) * | 2014-11-26 | 2017-04-25 | Kookmin University Industry Academy Cooperation Foundation | Method of forming through-hole in silicon substrate, method of forming electrical connection element penetrating silicon substrate and semiconductor device manufactured thereby |
| US9969614B2 (en) | 2015-05-29 | 2018-05-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS packages and methods of manufacture thereof |
| US10283492B2 (en) | 2015-06-23 | 2019-05-07 | Invensas Corporation | Laminated interposers and packages with embedded trace interconnects |
| KR102439483B1 (ko) * | 2015-10-08 | 2022-09-02 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| US9852994B2 (en) | 2015-12-14 | 2017-12-26 | Invensas Corporation | Embedded vialess bridges |
| US9953911B2 (en) | 2016-07-01 | 2018-04-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fan-out package structure and method |
| TWI800487B (zh) * | 2016-09-09 | 2023-05-01 | 日商索尼半導體解決方案公司 | 固體攝像元件及製造方法、以及電子機器 |
| US12205877B2 (en) | 2019-02-21 | 2025-01-21 | AT&S(Chongqing) Company Limited | Ultra-thin component carrier having high stiffness and method of manufacturing the same |
| CN115547846A (zh) * | 2019-02-21 | 2022-12-30 | 奥特斯科技(重庆)有限公司 | 部件承载件及其制造方法和电气装置 |
| IT201900006736A1 (it) * | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998044319A1 (fr) * | 1997-04-03 | 1998-10-08 | Yamatake Corporation | Plaquette de circuit et detecteur, et leur procede de fabrication |
| US6617681B1 (en) | 1999-06-28 | 2003-09-09 | Intel Corporation | Interposer and method of making same |
| DE10010461A1 (de) * | 2000-03-03 | 2001-09-13 | Infineon Technologies Ag | Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik |
| JP2002299486A (ja) | 2001-03-29 | 2002-10-11 | Kyocera Corp | 光半導体素子収納用パッケージ |
| US6791133B2 (en) | 2002-07-19 | 2004-09-14 | International Business Machines Corporation | Interposer capacitor built on silicon wafer and joined to a ceramic substrate |
| JP4295682B2 (ja) | 2004-06-28 | 2009-07-15 | Ｔｄｋ株式会社 | 多層配線基板 |
| US7221050B2 (en) * | 2004-09-02 | 2007-05-22 | Intel Corporation | Substrate having a functionally gradient coefficient of thermal expansion |
| JP2007123371A (ja) | 2005-10-26 | 2007-05-17 | Kyocera Corp | 多数個取り電子装置およびその製造方法 |
| JP4738228B2 (ja) | 2006-03-28 | 2011-08-03 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2008160019A (ja) | 2006-12-26 | 2008-07-10 | Shinko Electric Ind Co Ltd | 電子部品 |
| US20080284037A1 (en) * | 2007-05-15 | 2008-11-20 | Andry Paul S | Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers |
| US8455766B2 (en) * | 2007-08-08 | 2013-06-04 | Ibiden Co., Ltd. | Substrate with low-elasticity layer and low-thermal-expansion layer |
| US7936060B2 (en) * | 2009-04-29 | 2011-05-03 | International Business Machines Corporation | Reworkable electronic device assembly and method |
-
2010
- 2010-01-12 JP JP2010004394A patent/JP5514559B2/ja active Active
-
2011
- 2011-01-10 US US12/987,398 patent/US8686548B2/en active Active
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