JP2011121119A5 - - Google Patents

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Publication number
JP2011121119A5
JP2011121119A5 JP2010269452A JP2010269452A JP2011121119A5 JP 2011121119 A5 JP2011121119 A5 JP 2011121119A5 JP 2010269452 A JP2010269452 A JP 2010269452A JP 2010269452 A JP2010269452 A JP 2010269452A JP 2011121119 A5 JP2011121119 A5 JP 2011121119A5
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JP
Japan
Prior art keywords
light guide
guide element
dimensions
move
piezoelectric actuator
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JP2010269452A
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English (en)
Japanese (ja)
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JP2011121119A (ja
JP5830670B2 (ja
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Priority claimed from US12/632,143 external-priority patent/US8338745B2/en
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Publication of JP2011121119A5 publication Critical patent/JP2011121119A5/ja
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Publication of JP5830670B2 publication Critical patent/JP5830670B2/ja
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JP2010269452A 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法 Active JP5830670B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/632,143 2009-12-07
US12/632,143 US8338745B2 (en) 2009-12-07 2009-12-07 Apparatus and methods for drilling holes with no taper or reverse taper

Publications (3)

Publication Number Publication Date
JP2011121119A JP2011121119A (ja) 2011-06-23
JP2011121119A5 true JP2011121119A5 (https=) 2013-08-15
JP5830670B2 JP5830670B2 (ja) 2015-12-09

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JP2010269452A Active JP5830670B2 (ja) 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法

Country Status (2)

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US (1) US8338745B2 (https=)
JP (1) JP5830670B2 (https=)

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WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
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JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
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KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
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DE102017010055A1 (de) * 2017-10-27 2019-05-02 Lessmüller Lasertechnik GmbH Laserstrahlschweißen von geometrischen Figuren mit OCT-Nahtführung
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
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