JP5830670B2 - テーパを有しない、または逆テーパを有する穴を開ける装置および方法 - Google Patents

テーパを有しない、または逆テーパを有する穴を開ける装置および方法 Download PDF

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JP5830670B2
JP5830670B2 JP2010269452A JP2010269452A JP5830670B2 JP 5830670 B2 JP5830670 B2 JP 5830670B2 JP 2010269452 A JP2010269452 A JP 2010269452A JP 2010269452 A JP2010269452 A JP 2010269452A JP 5830670 B2 JP5830670 B2 JP 5830670B2
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light guide
guide element
lens
dimensions
actuator
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JP2011121119A (ja
JP2011121119A5 (https=
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シンビン リュウ
シンビン リュウ
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2010269452A 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法 Active JP5830670B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/632,143 2009-12-07
US12/632,143 US8338745B2 (en) 2009-12-07 2009-12-07 Apparatus and methods for drilling holes with no taper or reverse taper

Publications (3)

Publication Number Publication Date
JP2011121119A JP2011121119A (ja) 2011-06-23
JP2011121119A5 JP2011121119A5 (https=) 2013-08-15
JP5830670B2 true JP5830670B2 (ja) 2015-12-09

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JP2010269452A Active JP5830670B2 (ja) 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法

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Country Link
US (1) US8338745B2 (https=)
JP (1) JP5830670B2 (https=)

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CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
CN204913053U (zh) * 2015-08-28 2015-12-30 李俊豪 双向加工的激光机台
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US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
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US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10415338B2 (en) * 2017-07-27 2019-09-17 Saudi Arabian Oil Company Downhole high power laser scanner tool and methods
CN111246966B (zh) 2017-10-25 2023-02-28 株式会社尼康 加工装置及移动体的制造方法
DE102017010055A1 (de) * 2017-10-27 2019-05-02 Lessmüller Lasertechnik GmbH Laserstrahlschweißen von geometrischen Figuren mit OCT-Nahtführung
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US10705327B2 (en) 2018-01-02 2020-07-07 Industrial Technology Research Institute Light emitting method and light emitting device
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
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US8338745B2 (en) 2012-12-25
US20110132881A1 (en) 2011-06-09

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