TWI801054B - 貝塞爾光束的產生裝置與產生方法 - Google Patents

貝塞爾光束的產生裝置與產生方法 Download PDF

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Publication number
TWI801054B
TWI801054B TW110148360A TW110148360A TWI801054B TW I801054 B TWI801054 B TW I801054B TW 110148360 A TW110148360 A TW 110148360A TW 110148360 A TW110148360 A TW 110148360A TW I801054 B TWI801054 B TW I801054B
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TW
Taiwan
Prior art keywords
generating apparatus
beam generating
bessel beam
bessel
generating
Prior art date
Application number
TW110148360A
Other languages
English (en)
Other versions
TW202326233A (zh
Inventor
胡平浩
周府隆
林于中
李閔凱
Original Assignee
財團法人工業技術研究院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 財團法人工業技術研究院 filed Critical 財團法人工業技術研究院
Priority to TW110148360A priority Critical patent/TWI801054B/zh
Priority to US17/672,967 priority patent/US20230201960A1/en
Application granted granted Critical
Publication of TWI801054B publication Critical patent/TWI801054B/zh
Publication of TW202326233A publication Critical patent/TW202326233A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Optical Scanning Systems (AREA)
TW110148360A 2021-12-23 2021-12-23 貝塞爾光束的產生裝置與產生方法 TWI801054B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW110148360A TWI801054B (zh) 2021-12-23 2021-12-23 貝塞爾光束的產生裝置與產生方法
US17/672,967 US20230201960A1 (en) 2021-12-23 2022-02-16 Bessel beam generating apparatus and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110148360A TWI801054B (zh) 2021-12-23 2021-12-23 貝塞爾光束的產生裝置與產生方法

Publications (2)

Publication Number Publication Date
TWI801054B true TWI801054B (zh) 2023-05-01
TW202326233A TW202326233A (zh) 2023-07-01

Family

ID=86898066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110148360A TWI801054B (zh) 2021-12-23 2021-12-23 貝塞爾光束的產生裝置與產生方法

Country Status (2)

Country Link
US (1) US20230201960A1 (zh)
TW (1) TWI801054B (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595265B (zh) * 2014-11-19 2017-08-11 Trumpf Laser-Und Systemtechnik Gmbh Optical system for beam shaping, laser processing apparatus, beam shaping method for laser beam, method for processing laser material, use of beam profile in laser material processing
US20190273025A1 (en) * 2018-03-05 2019-09-05 The Chinese University Of Hong Kong Systems and methods for dicing samples using a bessel beam matrix
TWI716216B (zh) * 2019-12-06 2021-01-11 財團法人工業技術研究院 貝索光束均質模組
CN113534321A (zh) * 2021-07-08 2021-10-22 上海交通大学 激光等离子体产生贝塞尔太赫兹脉冲辐射的系统及方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595265B (zh) * 2014-11-19 2017-08-11 Trumpf Laser-Und Systemtechnik Gmbh Optical system for beam shaping, laser processing apparatus, beam shaping method for laser beam, method for processing laser material, use of beam profile in laser material processing
US20190273025A1 (en) * 2018-03-05 2019-09-05 The Chinese University Of Hong Kong Systems and methods for dicing samples using a bessel beam matrix
TWI716216B (zh) * 2019-12-06 2021-01-11 財團法人工業技術研究院 貝索光束均質模組
CN113534321A (zh) * 2021-07-08 2021-10-22 上海交通大学 激光等离子体产生贝塞尔太赫兹脉冲辐射的系统及方法

Also Published As

Publication number Publication date
TW202326233A (zh) 2023-07-01
US20230201960A1 (en) 2023-06-29

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