JP2011121119A5 - - Google Patents

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Publication number
JP2011121119A5
JP2011121119A5 JP2010269452A JP2010269452A JP2011121119A5 JP 2011121119 A5 JP2011121119 A5 JP 2011121119A5 JP 2010269452 A JP2010269452 A JP 2010269452A JP 2010269452 A JP2010269452 A JP 2010269452A JP 2011121119 A5 JP2011121119 A5 JP 2011121119A5
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JP
Japan
Prior art keywords
light guide
guide element
dimensions
move
piezoelectric actuator
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JP2010269452A
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English (en)
Japanese (ja)
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JP2011121119A (ja
JP5830670B2 (ja
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Priority claimed from US12/632,143 external-priority patent/US8338745B2/en
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Publication of JP2011121119A5 publication Critical patent/JP2011121119A5/ja
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Publication of JP5830670B2 publication Critical patent/JP5830670B2/ja
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JP2010269452A 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法 Active JP5830670B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/632,143 US8338745B2 (en) 2009-12-07 2009-12-07 Apparatus and methods for drilling holes with no taper or reverse taper
US12/632,143 2009-12-07

Publications (3)

Publication Number Publication Date
JP2011121119A JP2011121119A (ja) 2011-06-23
JP2011121119A5 true JP2011121119A5 (enExample) 2013-08-15
JP5830670B2 JP5830670B2 (ja) 2015-12-09

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JP2010269452A Active JP5830670B2 (ja) 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法

Country Status (2)

Country Link
US (1) US8338745B2 (enExample)
JP (1) JP5830670B2 (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120132629A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
CN105163897A (zh) * 2013-03-15 2015-12-16 伊雷克托科学工业股份有限公司 锥度控制的射束角协调及工件运动
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
DE102013222834A1 (de) * 2013-11-11 2015-05-13 Robert Bosch Gmbh Vorrichtung und Verfahren zur Führung eines Laserstrahls
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US20150165560A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
EP3021153B1 (en) 2014-11-13 2018-12-12 Canon Kabushiki Kaisha Optical apparatus, processing apparatus, and article manufacturing method
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
US10399171B2 (en) 2015-01-29 2019-09-03 Messer Cutting Systems Inc. Systems and methods for cutting a plow bolt hole with a cutting torch
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
CN204913053U (zh) * 2015-08-28 2015-12-30 李俊豪 双向加工的激光机台
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
WO2018044843A1 (en) 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10415338B2 (en) 2017-07-27 2019-09-17 Saudi Arabian Oil Company Downhole high power laser scanner tool and methods
US12157184B2 (en) 2017-10-25 2024-12-03 Nikon Corporation Processing apparatus, and manufacturing method of movable body
DE102017010055A1 (de) * 2017-10-27 2019-05-02 Lessmüller Lasertechnik GmbH Laserstrahlschweißen von geometrischen Figuren mit OCT-Nahtführung
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US10705327B2 (en) 2018-01-02 2020-07-07 Industrial Technology Research Institute Light emitting method and light emitting device
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
KR20210009720A (ko) * 2019-07-17 2021-01-27 주식회사 레이저모션테크 레이저 드릴링 장치
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
US12296399B2 (en) 2020-12-15 2025-05-13 Robert Bosch Gmbh Electrical discharge machining assembly including electrode
US11585305B2 (en) 2020-12-15 2023-02-21 Robert Bosch Gmbh Monolithic fuel rail structure and method of manufacture
CN114505602B (zh) * 2022-04-19 2022-07-01 中国工程物理研究院激光聚变研究中心 一种多轴旋切扫描系统的使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51134997A (en) * 1975-05-20 1976-11-22 Toshiba Corp Laser-utilizing processing device
US4135902A (en) * 1978-03-03 1979-01-23 Western Electric Co., Inc. Method and apparatus for drawing optical fibers
US5973290A (en) * 1997-02-26 1999-10-26 W. L. Gore & Associates, Inc. Laser apparatus having improved via processing rate
JPH10242617A (ja) * 1997-02-28 1998-09-11 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びレーザ加工装置
JP3769942B2 (ja) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
JPH11267873A (ja) * 1998-03-23 1999-10-05 Seiko Epson Corp レーザ光の走査光学系及びレーザ加工装置
JP2002113711A (ja) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びそれに用いるレーザ加工装置
US6720567B2 (en) * 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
JP4069348B2 (ja) * 2001-02-22 2008-04-02 トヨタ自動車株式会社 レーザ加工方法およびレーザ加工装置
CN1299873C (zh) * 2002-01-11 2007-02-14 电子科学工业公司 借助激光光斑放大来激光加工工件的方法
JP2004160522A (ja) * 2002-11-15 2004-06-10 Mitsubishi Heavy Ind Ltd レーザ加工方法及びその装置
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
JP2004243404A (ja) * 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
DE10317363B3 (de) * 2003-04-15 2004-08-26 Siemens Ag Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat
JP2008110384A (ja) * 2006-10-31 2008-05-15 Sumitomo Electric Ind Ltd 多孔質樹脂膜とその穿孔方法、その樹脂膜を用いた異方性導電シート、電気検査方法及び回路接続方法

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