JP5830670B2 - テーパを有しない、または逆テーパを有する穴を開ける装置および方法 - Google Patents

テーパを有しない、または逆テーパを有する穴を開ける装置および方法 Download PDF

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JP5830670B2
JP5830670B2 JP2010269452A JP2010269452A JP5830670B2 JP 5830670 B2 JP5830670 B2 JP 5830670B2 JP 2010269452 A JP2010269452 A JP 2010269452A JP 2010269452 A JP2010269452 A JP 2010269452A JP 5830670 B2 JP5830670 B2 JP 5830670B2
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light guide
guide element
lens
dimensions
actuator
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JP2011121119A5 (enExample
JP2011121119A (ja
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シンビン リュウ
シンビン リュウ
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2010269452A 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法 Active JP5830670B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/632,143 US8338745B2 (en) 2009-12-07 2009-12-07 Apparatus and methods for drilling holes with no taper or reverse taper
US12/632,143 2009-12-07

Publications (3)

Publication Number Publication Date
JP2011121119A JP2011121119A (ja) 2011-06-23
JP2011121119A5 JP2011121119A5 (enExample) 2013-08-15
JP5830670B2 true JP5830670B2 (ja) 2015-12-09

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JP2010269452A Active JP5830670B2 (ja) 2009-12-07 2010-12-02 テーパを有しない、または逆テーパを有する穴を開ける装置および方法

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Country Link
US (1) US8338745B2 (enExample)
JP (1) JP5830670B2 (enExample)

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US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
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CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
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DE102017010055A1 (de) * 2017-10-27 2019-05-02 Lessmüller Lasertechnik GmbH Laserstrahlschweißen von geometrischen Figuren mit OCT-Nahtführung
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US20110132881A1 (en) 2011-06-09
JP2011121119A (ja) 2011-06-23
US8338745B2 (en) 2012-12-25

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