JP2011097062A5 - - Google Patents
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- JP2011097062A5 JP2011097062A5 JP2010243863A JP2010243863A JP2011097062A5 JP 2011097062 A5 JP2011097062 A5 JP 2011097062A5 JP 2010243863 A JP2010243863 A JP 2010243863A JP 2010243863 A JP2010243863 A JP 2010243863A JP 2011097062 A5 JP2011097062 A5 JP 2011097062A5
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- semiconductor substrate
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- 239000004065 semiconductor Substances 0.000 claims 29
- 239000000758 substrate Substances 0.000 claims 21
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 150000004767 nitrides Chemical class 0.000 claims 2
- 239000002800 charge carrier Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09174720.4A EP2317542B1 (en) | 2009-10-30 | 2009-10-30 | Semiconductor device and method of manufacturing thereof |
| EP09174720.4 | 2009-10-30 | ||
| US26026809P | 2009-11-11 | 2009-11-11 | |
| US61/260,268 | 2009-11-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011097062A JP2011097062A (ja) | 2011-05-12 |
| JP2011097062A5 true JP2011097062A5 (https=) | 2013-06-27 |
| JP5396369B2 JP5396369B2 (ja) | 2014-01-22 |
Family
ID=42076024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010243863A Active JP5396369B2 (ja) | 2009-10-30 | 2010-10-29 | 半導体基板構造および半導体素子 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8373204B2 (https=) |
| EP (1) | EP2317542B1 (https=) |
| JP (1) | JP5396369B2 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7417266B1 (en) | 2004-06-10 | 2008-08-26 | Qspeed Semiconductor Inc. | MOSFET having a JFET embedded as a body diode |
| KR101120904B1 (ko) * | 2010-03-25 | 2012-02-27 | 삼성전기주식회사 | 반도체 소자 및 그 제조 방법 |
| US9245760B2 (en) * | 2010-09-30 | 2016-01-26 | Infineon Technologies Ag | Methods of forming epitaxial layers on a porous semiconductor layer |
| US8835986B2 (en) * | 2011-06-22 | 2014-09-16 | Imec | Method for fabrication of III-nitride device and the III-nitride device thereof |
| KR20130035024A (ko) * | 2011-09-29 | 2013-04-08 | 삼성전자주식회사 | 고 전자 이동도 트랜지스터 및 그 제조방법 |
| US8633094B2 (en) | 2011-12-01 | 2014-01-21 | Power Integrations, Inc. | GaN high voltage HFET with passivation plus gate dielectric multilayer structure |
| US20130143392A1 (en) * | 2011-12-06 | 2013-06-06 | Epowersoft, Inc. | In-situ sin growth to enable schottky contact for gan devices |
| US8940620B2 (en) | 2011-12-15 | 2015-01-27 | Power Integrations, Inc. | Composite wafer for fabrication of semiconductor devices |
| US20140077266A1 (en) * | 2012-09-14 | 2014-03-20 | Power Integrations, Inc. | Heterostructure Transistor with Multiple Gate Dielectric Layers |
| DE102012217073B4 (de) | 2012-09-21 | 2024-11-28 | Robert Bosch Gmbh | Vertikales mikroelektronisches Bauelement |
| KR20140083591A (ko) * | 2012-12-26 | 2014-07-04 | 에스케이하이닉스 주식회사 | 반도체 장치 제조 방법 |
| CN103117294B (zh) | 2013-02-07 | 2015-11-25 | 苏州晶湛半导体有限公司 | 氮化物高压器件及其制造方法 |
| US8928037B2 (en) | 2013-02-28 | 2015-01-06 | Power Integrations, Inc. | Heterostructure power transistor with AlSiN passivation layer |
| DE102013210814A1 (de) | 2013-06-10 | 2014-12-11 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Transistors mit hoher Elektronenbeweglichkeit |
| US9368584B2 (en) | 2013-07-09 | 2016-06-14 | Vishay General Semiconductor Llc | Gallium nitride power semiconductor device having a vertical structure |
| US9425312B2 (en) | 2014-06-23 | 2016-08-23 | International Business Machines Corporation | Silicon-containing, tunneling field-effect transistor including III-N source |
| US9640620B2 (en) * | 2014-11-03 | 2017-05-02 | Texas Instruments Incorporated | High power transistor with oxide gate barriers |
| JP6520197B2 (ja) * | 2015-02-20 | 2019-05-29 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
| CN105244377B (zh) * | 2015-10-29 | 2018-09-18 | 杭州士兰微电子股份有限公司 | 一种基于硅衬底的hemt器件及其制造方法 |
| US10381473B2 (en) | 2016-12-02 | 2019-08-13 | Vishay-Siliconix | High-electron-mobility transistor with buried interconnect |
| US10224426B2 (en) | 2016-12-02 | 2019-03-05 | Vishay-Siliconix | High-electron-mobility transistor devices |
| CN108922849B (zh) * | 2018-07-13 | 2019-07-12 | 苏州汉骅半导体有限公司 | 半导体结构制造方法 |
| US10833063B2 (en) | 2018-07-25 | 2020-11-10 | Vishay SIliconix, LLC | High electron mobility transistor ESD protection structures |
| CN112242442B (zh) * | 2019-07-16 | 2024-06-11 | 世界先进积体电路股份有限公司 | 半导体结构及其形成方法 |
| CN112993005B (zh) * | 2019-12-02 | 2024-01-09 | 联华电子股份有限公司 | 具有平台结构的半导体元件及其制作方法 |
| US20220139709A1 (en) * | 2020-11-05 | 2022-05-05 | International Business Machines Corporation | Confined gallium nitride epitaxial layers |
| CN112789733B (zh) * | 2020-12-28 | 2022-08-23 | 英诺赛科(苏州)半导体有限公司 | 半导体器件结构和其制造方法 |
| JP7510139B2 (ja) * | 2021-04-19 | 2024-07-03 | 株式会社Sumco | Ge単結晶膜の製造方法 |
| JP7658253B2 (ja) | 2021-11-17 | 2025-04-08 | 信越半導体株式会社 | 窒化物半導体基板及び窒化物半導体基板の製造方法 |
| US12451398B2 (en) * | 2022-05-11 | 2025-10-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gallium nitride-based devices and methods of testing thereof |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3376211B2 (ja) * | 1996-05-29 | 2003-02-10 | 株式会社東芝 | 半導体装置、半導体基板の製造方法及び半導体装置の製造方法 |
| US6265289B1 (en) | 1998-06-10 | 2001-07-24 | North Carolina State University | Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby |
| JP2000031491A (ja) * | 1998-07-14 | 2000-01-28 | Hitachi Ltd | 半導体装置,半導体装置の製造方法,半導体基板および半導体基板の製造方法 |
| KR100677683B1 (ko) * | 1999-03-17 | 2007-02-05 | 미츠비시 덴센 고교 가부시키가이샤 | 반도체 기재와 그 제조 방법 및 반도체 결정의 제조 방법 |
| US7087965B2 (en) * | 2004-04-22 | 2006-08-08 | International Business Machines Corporation | Strained silicon CMOS on hybrid crystal orientations |
| EP2273553B1 (en) | 2004-06-30 | 2020-02-12 | IMEC vzw | A method for fabricating AlGaN/GaN HEMT devices |
| FR2877491B1 (fr) | 2004-10-29 | 2007-01-19 | Soitec Silicon On Insulator | Structure composite a forte dissipation thermique |
| US20060223211A1 (en) * | 2004-12-02 | 2006-10-05 | The Regents Of The University Of California | Semiconductor devices based on coalesced nano-rod arrays |
| US7247889B2 (en) | 2004-12-03 | 2007-07-24 | Nitronex Corporation | III-nitride material structures including silicon substrates |
| JP2006196869A (ja) * | 2004-12-13 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| US8163575B2 (en) * | 2005-06-17 | 2012-04-24 | Philips Lumileds Lighting Company Llc | Grown photonic crystals in semiconductor light emitting devices |
| US7697584B2 (en) * | 2006-10-02 | 2010-04-13 | Philips Lumileds Lighting Company, Llc | Light emitting device including arrayed emitters defined by a photonic crystal |
| JP5242068B2 (ja) * | 2007-03-23 | 2013-07-24 | 古河電気工業株式会社 | GaN系半導体デバイスおよびその製造方法 |
| WO2009005894A2 (en) * | 2007-05-08 | 2009-01-08 | Nitek, Inc. | Non-polar ultraviolet light emitting device and method for fabricating same |
| JP5462161B2 (ja) | 2007-07-20 | 2014-04-02 | アイメック | Iii−v族mesfetでのダマシンコンタクト製造方法 |
| US8378387B2 (en) * | 2008-03-04 | 2013-02-19 | Nec Corporation | Field effect transistor and method of manufacturing the same |
-
2009
- 2009-10-30 EP EP09174720.4A patent/EP2317542B1/en active Active
-
2010
- 2010-10-29 US US12/916,346 patent/US8373204B2/en active Active
- 2010-10-29 JP JP2010243863A patent/JP5396369B2/ja active Active
-
2013
- 2013-01-18 US US13/745,289 patent/US8580626B2/en active Active
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