JP2011073900A5 - - Google Patents

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JP2011073900A5
JP2011073900A5 JP2009224554A JP2009224554A JP2011073900A5 JP 2011073900 A5 JP2011073900 A5 JP 2011073900A5 JP 2009224554 A JP2009224554 A JP 2009224554A JP 2009224554 A JP2009224554 A JP 2009224554A JP 2011073900 A5 JP2011073900 A5 JP 2011073900A5
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JP
Japan
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single crystal
silicon single
silicon
thin film
crystal thin
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JP2009224554A
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Japanese (ja)
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JP5152137B2 (ja
JP2011073900A (ja
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Publication of JP2011073900A5 publication Critical patent/JP2011073900A5/ja
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JP2009224554A 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法 Active JP5152137B2 (ja)

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JP2009224554A JP5152137B2 (ja) 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009224554A JP5152137B2 (ja) 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法

Publications (3)

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JP2011073900A JP2011073900A (ja) 2011-04-14
JP2011073900A5 true JP2011073900A5 (enExample) 2012-01-12
JP5152137B2 JP5152137B2 (ja) 2013-02-27

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JP2009224554A Active JP5152137B2 (ja) 2009-09-29 2009-09-29 シリコンエピタキシャルウェーハの製造方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6032186B2 (ja) * 2013-11-29 2016-11-24 信越半導体株式会社 シリコンエピタキシャルウエーハの評価方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693433B2 (ja) * 1987-04-15 1994-11-16 日本電気株式会社 半導体装置用基板
JPH09199381A (ja) * 1996-01-12 1997-07-31 Toshiba Ceramics Co Ltd エピタキシャルウエハ用シリコン基板及びその製造法
JP4708697B2 (ja) * 2002-11-11 2011-06-22 株式会社Sumco エピタキシャルシリコンウェーハ
JP2007070131A (ja) * 2005-09-05 2007-03-22 Sumco Corp エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ

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